Patents by Inventor Han-Yong Chae

Han-Yong Chae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SIMULATION METHOD AND APPARATUS FOR SECONDARY BATTERY PRODUCTION
    Publication number: 20240069535
    Abstract: The present disclosure relates to a simulation apparatus for secondary battery production.
    Type: Application
    Filed: July 14, 2022
    Publication date: February 29, 2024
    Inventors: Shinkyu KANG, Min Yong KIM, Youngduk KIM, Nam Hyuck KIM, Su Ho JEON, Min Hee KWON, Sung Nam CHO, Hyeong Geun CHAE, Gyeong Yun JO, Moon Kyu JO, Kyungchul HWANG, Moo Hyun YOO, Han Seung KIM, Daewoon JUNG, Seungtae KIM, Junhyeok JEON
  • Apparatus and method for treating edge of substrate
    Patent number: 7166183
    Abstract: An apparatus for treating an edge of a semiconductor substrate includes an etchant supply nozzle for supplying a first etchant to the edge of the semiconductor substrate. The apparatus further includes a shielding cover for preventing an etchant from flowing to a shielding surface of the semiconductor substrate. The shielding cover is movable in an upward and downward direction. The apparatus also includes a device for cleaning the edge of the semiconductor substrate. According to the apparatus, after a wafer edge is etched, foreign substances remaining at the wafer edge is efficiently removed.
    Type: Grant
    Filed: July 2, 2004
    Date of Patent: January 23, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chang-Hyeon Nam, Seung-Kim Lee, Man-Young Lee, Yoon-Kyung Kim, Han-Yong Chae, Duk-Min Ahn
  • Apparatus and method for treating edge of substrate
    Publication number: 20050000652
    Abstract: An apparatus for treating an edge of a semiconductor substrate includes an etchant supply nozzle for supplying a first etchant to the edge of the semiconductor substrate. The apparatus further includes a shielding cover for preventing an etchant from flowing to a shielding surface of the semiconductor substrate. The shielding cover is movable in an upward and downward direction. The apparatus also includes a device for cleaning the edge of the semiconductor substrate. According to the apparatus, after a wafer edge is etched, foreign substances remaining at the wafer edge is efficiently removed.
    Type: Application
    Filed: July 2, 2004
    Publication date: January 6, 2005
    Inventors: Chaqng-Hyeon Nam, Seung-Kim Lee, Man-Young Lee, Yoon-Kyung Kim, Han-Yong Chae, Duk-Min Ahn