Patents by Inventor Hanako Hata

Hanako Hata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7150677
    Abstract: A CMP conditioner is provided in which diamond grit that is adhered to a conditioning surface so as to face and be in contact with a polishing pad of a CMP apparatus is adhered such that 111 surfaces of crystal surfaces of the diamond grit are substantially parallel with the conditioning surface and face in a direction faced by the conditioning surface.
    Type: Grant
    Filed: September 20, 2005
    Date of Patent: December 19, 2006
    Assignee: Mitsubishi Materials Corporation
    Inventors: Tetsuji Yamashita, Takashi Kimura, Hanako Hata
  • Publication number: 20060079162
    Abstract: A CMP conditioner is provided in which diamond grit that is adhered to a conditioning surface so as to face and be in contact with a polishing pad of a CMP apparatus is adhered such that 111 surfaces of crystal surfaces of the diamond grit are substantially parallel with the conditioning surface and face in a direction faced by the conditioning surface.
    Type: Application
    Filed: September 20, 2005
    Publication date: April 13, 2006
    Applicant: Mitsubishi Materials Corporation
    Inventors: Tetsuji Yamashita, Takashi Kimura, Hanako Hata
  • Patent number: 6875098
    Abstract: Objectives: To improve the cutting sharpness and life while the manufacturing cost is being lowered. Solution mechanism: The whetstone particle layer (13), which consists of multiple whetstone particle layer units (12), . . . , is configured on the surface (11a) of the whetstone substrate (11) while the respective whetstone particle layer units (12) are being mutually linked via the bridge unit (9). The non-whetstone particle unit (22) is configured between whetstone particle layer units (12) and (12). Whetstone particle layer unit (12) is obtained by configuring the superwhetstone particles (14) densely in the central unit (12a) and by configuring them sparsely in the peripheral unit (12b). The metal coupling phase (17), to which the superwhetstone particles (14) are fixed, is formed by the first and second metal plate phases (15) and (16), respectively. The thickness of the first metal plate phase (15) decreases from the central unit (12a) toward the peripheral unit (12b) in the shape of a mountain.
    Type: Grant
    Filed: January 5, 2001
    Date of Patent: April 5, 2005
    Assignee: Mitsubishi Materials Corporation
    Inventors: Tsutomu Takahashi, Naoki Shimomae, Hanako Hata
  • Patent number: 6419574
    Abstract: In the electrodeposited abrasive wheel 20 of the abrasive tool according to the present invention, plural mound parts 21, which are upheaved at the central domain of base metal 19 in almost columnar shape, are arranged mostly in the shape of lattice. An abrasive grain layer 22 is formed on a base metal 19, and plural ultra abrasive grains 14 are adhered only to each mound parts 21 by electrodeposited metal phase 25, and referred as the small abrasive-grain-layer parts 24, respectively. Ultra abrasive grains are laid out at corner R part 21a and top 21b of the mound parts 21 at the small abrasive-grain-layer parts 24. Ultra abrasive grains at each small abrasive-grain-layer parts are set as 11-500 pieces, and the rate which ultra abrasive grains occupy to the whole area of abrasive grain layer accounted by plane projection is set as 20%-80% of the range.
    Type: Grant
    Filed: August 31, 2000
    Date of Patent: July 16, 2002
    Assignee: Mitsubishi Materials Corporation
    Inventors: Tsutomu Takahashi, Naoki Shimomae, Tetsuji Yamashita, Hanako Hata
  • Publication number: 20010014578
    Abstract: Objectives: To improve the cutting sharpness and life while the manufacturing cost is being lowered.
    Type: Application
    Filed: January 5, 2001
    Publication date: August 16, 2001
    Applicant: Mitsubishi Materials Corporation
    Inventors: Tsutomu Takahashi, Naoki Shimomae, Hanako Hata