Patents by Inventor Hanako Henry

Hanako Henry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device processing with reduced wiring puddle formation
    Patent number: 9018097
    Abstract: A method of forming an interconnect structure for a semiconductor device includes forming a lower antireflective coating layer over a dielectric layer; forming an organic planarizing layer on the lower antireflective coating layer; transferring a wiring pattern through the organic planarizing layer; transferring the wiring pattern through the lower antireflective coating layer; and transferring the wiring pattern through the dielectric layer, wherein unpatterned portions of the lower antireflective coating layer serve as an etch stop layer so as to prevent any bubble defects present in the organic planarizing layer from being transferred to the dielectric layer.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: April 28, 2015
    Assignee: International Business Machines Corporation
    Inventors: Thomas W. Dyer, Hanako Henry, Tze-Man Ko, Yiheng Xu, Shaoning Yao
  • SEMICONDUCTOR DEVICE PROCESSING WITH REDUCED WIRING PUDDLE FORMATION
    Publication number: 20140099787
    Abstract: A method of forming an interconnect structure for a semiconductor device includes forming a lower antireflective coating layer over a dielectric layer; forming an organic planarizing layer on the lower antireflective coating layer; transferring a wiring pattern through the organic planarizing layer; transferring the wiring pattern through the lower antireflective coating layer; and transferring the wiring pattern through the dielectric layer, wherein unpatterned portions of the lower antireflective coating layer serve as an etch stop layer so as to prevent any bubble defects present in the organic planarizing layer from being transferred to the dielectric layer.
    Type: Application
    Filed: October 10, 2012
    Publication date: April 10, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Thomas W. Dyer, Hanako Henry, Tze-Man Ko, Yiheng Xu, Shaoning Yao