Patents by Inventor HanBeet CHANG
HanBeet CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11099390Abstract: A head-mounted display apparatus is disclosed. The head-mounted display apparatus includes an optical member having a front surface, a rear surface, and a plurality of side surfaces, a display unit adapted to emit a display image toward one of the side surfaces of the optical member, and a reflective structure disposed inside the optical member to reflect the display image emitted from the display unit and to allow the reflected display image to pass and propagate through the rear surface. The image reflected by the reflective structure and delivered to user's eyes is the same irrespective of the coverage of the user's field of view.Type: GrantFiled: September 3, 2019Date of Patent: August 24, 2021Assignee: LUMENS CO., LTD.Inventors: Daewon Kim, Seongbok Yoon, Hanbeet Chang, Myungji Moon, Yongpil Kim, JaeSoon Park
-
Patent number: 11069664Abstract: A micro-LED module is disclosed. The micro-LED module includes: a micro-LED including a plurality of LED cells, each of which includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a submount substrate mounted with the micro-LED; a plurality of electrode pads formed on the micro-LED cells; a plurality of electrodes formed corresponding to the plurality of electrode pads on the submount substrate; a plurality of connection members through which the plurality of electrode pads are connected to the corresponding plurality of electrodes; and a gap fill layer formed in the gap between the micro-LED and the submount substrate and having a bonding strength to the micro-LED and the submount substrate.Type: GrantFiled: July 29, 2019Date of Patent: July 20, 2021Assignee: LUMENS CO., LTD.Inventors: Daewon Kim, Eunsung Shin, Myungji Moon, Hanbeet Chang, Yongpil Kim, Jaesoon Park
-
Publication number: 20200388596Abstract: A micro-LED module is disclosed. The micro-LED module includes: a micro-LED including a plurality of LED cells, each of which includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a submount substrate mounted with the micro-LED; a plurality of electrode pads formed on the micro-LED cells; a plurality of electrodes formed corresponding to the plurality of electrode pads on the submount substrate; a plurality of connection members through which the plurality of electrode pads are connected to the corresponding plurality of electrodes; and a gap fill layer formed in the gap between the micro-LED and the submount substrate and having a bonding strength to the micro-LED and the submount substrate.Type: ApplicationFiled: July 29, 2019Publication date: December 10, 2020Applicant: LUMENS CO., LTD.Inventors: Daewon KIM, Eunsung SHIN, Myungji MOON, Hanbeet CHANG, Yongpil KIM, Jaesoon PARK
-
Patent number: 10847504Abstract: A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes. The flip-bonding includes heating the plurality of solders by a laser.Type: GrantFiled: April 25, 2019Date of Patent: November 24, 2020Assignee: LUMENS CO., LTD.Inventors: Taekyung Yoo, Daewon Kim, Seongbok Yoon, Yelim Won, Myungji Moon, Hanbeet Chang, Yongpil Kim, Jaesoon Park
-
Patent number: 10784241Abstract: Micro-LED array display devices are disclosed. One of the micro-LED display devices includes: a micro-LED panel including a plurality of micro-LED pixels; a CMOS backplane including a plurality of CMOS cells corresponding to the micro-LED pixels to individually drive the micro-LED pixels; and bumps electrically connecting the micro-LED pixels to the corresponding CMOS cells in a state in which the micro-LED pixels are arranged to face the CMOS cells. The micro-LED pixels are flip-chip bonded to the corresponding CMOS cells formed on the CMOS backplane through the bumps so that the micro-LED pixels are individually controlled.Type: GrantFiled: July 26, 2018Date of Patent: September 22, 2020Assignee: LUMENS CO., LTD.Inventors: HanBeet Chang, EunSung Shin, HyunYong Cho
-
Patent number: 10663756Abstract: A display apparatus is disclosed. The display apparatus includes: at least one LED display unit including a plurality of LED display panels outputting image lights; a light guide unit including a plurality of in-coupling zones where the image lights are received and a single out-coupling zone to which the received image lights are guided; a plurality of in-coupling holographic optical elements (HOEs) arranged in the in-coupling zones to define the propagation path of the image lights through the light guide unit; and a plurality of out-coupling HOEs arranged in the out-coupling zone to define a path through which the image lights guided through the light guide unit are sent outside the light guide unit.Type: GrantFiled: July 14, 2017Date of Patent: May 26, 2020Assignee: LUMENS CO., LTD.Inventors: HanBeet Chang, EunSung Shin, HyunYong Cho
-
Patent number: 10607973Abstract: Micro-LED array display devices are disclosed. One of the micro-LED display devices includes: a micro-LED panel including a plurality of micro-LED pixels; a CMOS backplane including a plurality of CMOS cells corresponding to the micro-LED pixels to individually drive the micro-LED pixels; and bumps electrically connecting the micro-LED pixels to the corresponding CMOS cells in a state in which the micro-LED pixels are arranged to face the CMOS cells. The micro-LED pixels are flip-chip bonded to the corresponding CMOS cells formed on the CMOS backplane through the bumps so that the micro-LED pixels are individually controlled.Type: GrantFiled: July 26, 2018Date of Patent: March 31, 2020Assignee: LUMENS CO., LTD.Inventors: HanBeet Chang, EunSung Shin, HyunYong Cho
-
Publication number: 20190391397Abstract: A head-mounted display apparatus is disclosed. The head-mounted display apparatus includes an optical member having a front surface, a rear surface, and a plurality of side surfaces, a display unit adapted to emit a display image toward one of the side surfaces of the optical member, and a reflective structure disposed inside the optical member to reflect the display image emitted from the display unit and to allow the reflected display image to pass and propagate through the rear surface. The image reflected by the reflective structure and delivered to user's eyes is the same irrespective of the coverage of the user's field of view.Type: ApplicationFiled: September 3, 2019Publication date: December 26, 2019Applicant: LUMENS CO., LTD.Inventors: Daewon KIM, Seongbok YOON, Hanbeet CHANG, Myungji MOON, Yongpil KIM, JaeSoon PARK
-
Patent number: 10444511Abstract: A head-mounted display apparatus is disclosed. The head-mounted display apparatus includes an optical member having a front surface, a rear surface, and a plurality of side surfaces, a display unit adapted to emit a display image toward one of the side surfaces of the optical member, and a reflective structure disposed inside the optical member to reflect the display image emitted from the display unit and to allow the reflected display image to pass and propagate through the rear surface. The image reflected by the reflective structure and delivered to user's eyes is the same irrespective of the coverage of the user's field of view.Type: GrantFiled: September 26, 2017Date of Patent: October 15, 2019Assignee: LUMENS CO., LTD.Inventors: Daewon Kim, Seongbok Yoon, Hanbeet Chang, Myungji Moon, Yongpil Kim, JaeSoon Park
-
Patent number: 10410998Abstract: A micro-LED module is disclosed. The micro-LED module includes: a micro-LED including a plurality of LED cells, each of which includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a submount substrate mounted with the micro-LED; a plurality of electrode pads formed on the micro-LED cells; a plurality of electrodes formed corresponding to the plurality of electrode pads on the submount substrate; a plurality of connection members through which the plurality of electrode pads are connected to the corresponding plurality of electrodes; and a gap fill layer formed in the gap between the micro-LED and the submount substrate and having a bonding strength to the micro-LED and the submount substrate.Type: GrantFiled: November 15, 2017Date of Patent: September 10, 2019Assignee: LUMENS CO., LTD.Inventors: Daewon Kim, Eunsung Shin, Myungji Moon, Hanbeet Chang, Yongpil Kim, Jaesoon Park
-
Publication number: 20190252360Abstract: A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes. The flip-bonding includes heating the plurality of solders by a laser.Type: ApplicationFiled: April 25, 2019Publication date: August 15, 2019Applicant: LUMENS CO., LTD.Inventors: Taekyung YOO, Daewon KIM, Seongbok YOON, Yelim WON, Myungji MOON, Hanbeet CHANG, Yongpil KIM, Jaesoon PARK
-
Patent number: 10319706Abstract: A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes. The flip-bonding includes heating the plurality of solders by a laser.Type: GrantFiled: November 20, 2017Date of Patent: June 11, 2019Assignee: LUMENS CO., LTD.Inventors: Taekyung Yoo, Daewon Kim, Seongbok Yoon, Yelim Won, Myungji Moon, Hanbeet Chang, Yongpil Kim, Jaesoon Park
-
Publication number: 20180331086Abstract: Micro-LED array display devices are disclosed. One of the micro-LED display devices includes: a micro-LED panel including a plurality of micro-LED pixels; a CMOS backplane including a plurality of CMOS cells corresponding to the micro-LED pixels to individually drive the micro-LED pixels; and bumps electrically connecting the micro-LED pixels to the corresponding CMOS cells in a state in which the micro-LED pixels are arranged to face the CMOS cells. The micro-LED pixels are flip-chip bonded to the corresponding CMOS cells formed on the CMOS backplane through the bumps so that the micro-LED pixels are individually controlled.Type: ApplicationFiled: July 26, 2018Publication date: November 15, 2018Applicant: LUMENS CO., LTD.Inventors: HanBeet Chang, EunSung Shin, HyunYong Cho
-
Publication number: 20180331085Abstract: Micro-LED array display devices are disclosed. One of the micro-LED display devices includes: a micro-LED panel including a plurality of micro-LED pixels; a CMOS backplane including a plurality of CMOS cells corresponding to the micro-LED pixels to individually drive the micro-LED pixels; and bumps electrically connecting the micro-LED pixels to the corresponding CMOS cells in a state in which the micro-LED pixels are arranged to face the CMOS cells. The micro-LED pixels are flip-chip bonded to the corresponding CMOS cells formed on the CMOS backplane through the bumps so that the micro-LED pixels are individually controlled.Type: ApplicationFiled: July 26, 2018Publication date: November 15, 2018Applicant: LUMENS CO., LTD.Inventors: HanBeet CHANG, EunSung SHIN, HyunYong CHO
-
Patent number: 10062675Abstract: Micro-LED array display devices are disclosed. One of the micro-LED display devices includes: a micro-LED panel including a plurality of micro-LED pixels; a CMOS backplane including a plurality of CMOS cells corresponding to the micro-LED pixels to individually drive the micro-LED pixels; and bumps electrically connecting the micro-LED pixels to the corresponding CMOS cells in a state in which the micro-LED pixels are arranged to face the CMOS cells. The micro-LED pixels are flip-chip bonded to the corresponding CMOS cells formed on the CMOS backplane through the bumps so that the micro-LED pixels are individually controlled.Type: GrantFiled: June 4, 2017Date of Patent: August 28, 2018Assignee: LUMENS CO., LTD.Inventors: HanBeet Chang, EunSung Shin, HyunYong Cho
-
Publication number: 20180233496Abstract: A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes. The flip-bonding includes heating the plurality of solders by a laser.Type: ApplicationFiled: November 20, 2017Publication date: August 16, 2018Applicant: LUMENS CO., LTD.Inventors: Taekyung Yoo, Daewon Kim, Seongbok Yoon, Yelim Won, Myungji Moon, Hanbeet Chang, Yongpil Kim, Jaesoon Park
-
Publication number: 20180182740Abstract: A micro-LED module is disclosed. The micro-LED module includes: a micro-LED including a plurality of LED cells, each of which includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a submount substrate mounted with the micro-LED; a plurality of electrode pads formed on the micro-LED cells; a plurality of electrodes formed corresponding to the plurality of electrode pads on the submount substrate; a plurality of connection members through which the plurality of electrode pads are connected to the corresponding plurality of electrodes; and a gap fill layer formed in the gap between the micro-LED and the submount substrate and having a bonding strength to the micro-LED and the submount substrate.Type: ApplicationFiled: November 15, 2017Publication date: June 28, 2018Applicant: LUMENS CO., LTD.Inventors: Daewon KIM, Eunsung SHIN, Myungji MOON, Hanbeet CHANG, Yongpil KIM, Jaesoon PARK
-
Publication number: 20180136467Abstract: A head-mounted display apparatus is disclosed. The head-mounted display apparatus includes an optical member having a front surface, a rear surface, and a plurality of side surfaces, a display unit adapted to emit a display image toward one of the side surfaces of the optical member, and a reflective structure disposed inside the optical member to reflect the display image emitted from the display unit and to allow the reflected display image to pass and propagate through the rear surface. The image reflected by the reflective structure and delivered to user's eyes is the same irrespective of the coverage of the user's field of view.Type: ApplicationFiled: September 26, 2017Publication date: May 17, 2018Applicant: LUMENS CO., LTD.Inventors: Daewon KIM, Seongbok YOON, Hanbeet CHANG, Myungji MOON, Yongpil KIM, JaeSoon PARK
-
Publication number: 20180017801Abstract: A display apparatus is disclosed. The display apparatus includes: at least one LED display unit including a plurality of LED display panels outputting image lights; a light guide unit including a plurality of in-coupling zones where the image lights are received and a single out-coupling zone to which the received image lights are guided; a plurality of in-coupling holographic optical elements (HOEs) arranged in the in-coupling zones to define the propagation path of the image lights through the light guide unit; and a plurality of out-coupling HOEs arranged in the out-coupling zone to define a path through which the image lights guided through the light guide unit are sent outside the light guide unit.Type: ApplicationFiled: July 14, 2017Publication date: January 18, 2018Applicant: LUMENS CO., LTD.Inventors: HanBeet CHANG, EunSung SHIN, HyunYong CHO
-
Publication number: 20180019233Abstract: Micro-LED array display devices are disclosed. One of the micro-LED display devices includes: a micro-LED panel including a plurality of micro-LED pixels; a CMOS backplane including a plurality of CMOS cells corresponding to the micro-LED pixels to individually drive the micro-LED pixels; and bumps electrically connecting the micro-LED pixels to the corresponding CMOS cells in a state in which the micro-LED pixels are arranged to face the CMOS cells. The micro-LED pixels are flip-chip bonded to the corresponding CMOS cells formed on the CMOS backplane through the bumps so that the micro-LED pixels are individually controlled.Type: ApplicationFiled: June 4, 2017Publication date: January 18, 2018Applicant: LUMENS CO., LTD.Inventors: HanBeet CHANG, EunSung SHIN, HyunYong CHO