Patents by Inventor Hance H. Huston, III

Hance H. Huston, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for restoring rejected wafers in line for reuse as new
    Patent number: 5920764
    Abstract: A process applicable to the restoration of defective or rejected semiconductor wafers to a defect-free form uses etchants and a variation of the Smart-Cut.RTM. process. Because of the use of the variation on the Smart-Cut.RTM. process, diffusion regions are removed without significantly affecting the specifications of the semiconductor wafer. Therefore, a defective or rejected wafer can be restored to near original condition for use in semiconductor manufacturing.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: July 6, 1999
    Assignee: International Business Machines Corporation
    Inventors: David R. Hanson, Hance H. Huston, III, Kris V. Srikrishnan