Abstract: To provide a stacked mounting structure in which the number of semiconductor chips that can be stacked is greater than conventionally, as well as a method for fabricating the same, each semiconductor chip has electrodes provided at least at one end in the stacked mounting structure, and a board holding the semiconductor chips at the one end is folded with at least two of the semiconductor chips being stacked so as to at least partially overlap with each other.

Abstract: A component placing method uses a first component image-pickup unit capable of capturing an image of a component held by a component holding member from a direction along central axes of the component holding members, and a second component image-pickup unit capable of capturing an image of the held component from a direction generally orthogonal to the central axes of the component holding members, the images of the component are captured by the first component image-pickup unit and the second component image-pickup unit from the two directions generally orthogonal to each other, and holding postures of the components are recognized on the basis of the images.

Abstract: A semiconductor stack device having semiconductor chips stacked therein, wherein pads 4d of an uppermost semiconductor chip 2d are disposed on the side of a base substrate 1, and the pads 4d of the semiconductor chip 2d and electrodes 8d of the base substrate 1 are connected to each other via a flexible substrate 5 having circuit components 7 mounted thereon.

Abstract: To provide a stacked mounting structure in which the number of semiconductor chips that can be stacked is greater than conventionally, as well as a method for fabricating the same, each semiconductor chip has electrodes provided at least at one end in the stacked mounting structure, and a board holding the semiconductor chips at the one end is folded with at least two of the semiconductor chips being stacked so as to at least partially overlap with each other.

Abstract: An X-Y robot having a structure that linearly deforms along an X-axis direction and a Y-axis direction, a camera reference mark, and a control unit are provided. The X-Y robot causes no displacement of warp or the like and linearly deforms along only the X-axis direction and the Y-axis direction even if heat takes effect due to continuous operation. Therefore, if the amount of expansion and contraction of the X-Y robot due to heat is obtained by picking-up an image of the camera reference mark by a board recognition camera and the component placing position is corrected on the basis of the amount of expansion and contraction, then an electronic component can be mounted in a prescribed position or almost in the prescribed position.

Abstract: An X-Y robot having a structure that linearly deforms along an X-axis direction and a Y-axis direction, a camera reference mark, and a control unit are provided. The X-Y robot causes no displacement of warp or the like and linearly deforms along only the X-axis direction and the Y-axis direction even if heat takes effect due to continuous operation. Therefore, if the amount of expansion and contraction of the X-Y robot due to heat is obtained by picking-up an image of the camera reference mark by a board recognition camera and the component placing position is corrected on the basis of the amount of expansion and contraction, then the electronic component can be mounted in the prescribed position or almost in the prescribed position.

Abstract: A component placing head has a first component image-pickup unit capable of capturing an image of a component held by a component holding member from a direction along central axes of the component holding members, and a second component image-pickup unit capable of capturing an image of the held component from a direction generally orthogonal to the central axes of the component holding members, the images of the component are captured by the first component image-pickup unit and the second component image-pickup unit from the two directions generally orthogonal to each other, and holding postures of the components are recognized on basis of the images.