Abstract: Described are methods and apparatuses pertaining to stacked integrated circuits having application in ultra-low-power and small form factor design, with fast prototyping and mass-production cycle time, including application for millimeter wave radio frequency circuits.

Abstract: A 1D diamond nanobeam can act as a coherent mechanical interface between spin defect centers in diamond and telecom optical modes. The nanobeam includes embedded mechanical and electric field concentrators with mechanical and optical mode volumes of Vmech/?p3 ˜10?5 and Vopt/?3 ˜10?3, respectively. With a Group IV vacancy in the concentrator, the nanobeam can operate at spin-mechanical coupling rates approaching 40 MHz with high acousto-optical couplings. This nanobeam, used in an entanglement heralding scheme, can provide high-fidelity Bell pairs between quantum repeaters. Using the mechanical interface as an intermediary between the optical and spin subsystems enables addressing the spin defect center with telecom optics, bypassing the native wavelength of the spin. As the spin is never optically excited or addressed, the device can operate at temperatures up to 40 K with no appreciable spectral diffusion, limited by thermal losses.

Abstract: Described are methods and apparatuses pertaining to stacked integrated circuits having application in ultra-low-power and small form factor design, with fast prototyping and mass-production cycle time, including application for millimeter wave radio frequency circuits.

Abstract: Described are methods and apparatuses pertaining to stacked integrated circuits having application in ultra-low-power and small form factor design, with fast prototyping and mass-production cycle time, including application for millimeter wave radio frequency circuits.

Abstract: A system for testing aerodynamic characteristics of a high-speed moving vehicle-bridge system and subsidiary facilities thereof under a crosswind includes a vehicle model, a starting mechanism, a buffer mechanism, a wind tunnel test section and guide rails. The guide rails pass through the wind tunnel test section; the starting mechanism and the buffer mechanism are separately located at both ends of the guide rails. The guide rails include an acceleration section and a deceleration section. The starting mechanism is located in the acceleration section, and the buffer mechanism is located in the deceleration section; the vehicle model starts to run at the starting mechanism and stops at the buffer mechanism; an instantaneous speed of the vehicle model in the acceleration section is not less than 100 km/h. The present invention carries out simulation tests on various infrastructures, their subsidiary facilities and trains through scale models.

Abstract: Described are methods and apparatuses pertaining to stacked integrated circuits having application in ultra-low-power and small form factor design, with fast prototyping and mass-production cycle time, including application for millimeter wave radio frequency circuits.

Abstract: A system for testing aerodynamic characteristics of a high-speed moving vehicle-bridge system and subsidiary facilities thereof under a crosswind includes a vehicle model, a starting mechanism, a buffer mechanism, a wind tunnel test section and guide rails. The guide rails pass through the wind tunnel test section; the starting mechanism and the buffer mechanism are separately located at both ends of the guide rails. The guide rails include an acceleration section and a deceleration section. The starting mechanism is located in the acceleration section, and the buffer mechanism is located in the deceleration section; the vehicle model starts to run at the starting mechanism and stops at the buffer mechanism; an instantaneous speed of the vehicle model in the acceleration section is not less than 100 km/h. The present invention carries out simulation tests on various infrastructures, their subsidiary facilities and trains through scale models.

Abstract: A capacitive fingerprint sensor that may be formed of an array of sensing elements. Each capacitive sensing element of the array may register a voltage that varies with the capacitance of a capacitive coupling. A finger may capacitively couple to the individual capacitive sensing elements of the sensor, such that the sensor may sense a capacitance between each capacitive sensing element and the flesh of the fingerprint. The capacitance signal may be detected by sensing the change in voltage on the capacitive sensing element as the relative voltage between the finger and the sensing chip is changed. Alternately, the capacitance signal may be detected by sensing the change in charge received by the capacitive sensing elements as the relative voltage between the finger and the sensing chip is changed.

Abstract: A capacitive fingerprint sensor that may be formed of an array of sensing elements. Each capacitive sensing element of the array may register a voltage that varies with the capacitance of a capacitive coupling. A finger may capacitively couple to the individual capacitive sensing elements of the sensor, such that the sensor may sense a capacitance between each capacitive sensing element and the flesh of the fingerprint. The capacitance signal may be detected by sensing the change in voltage on the capacitive sensing element as the relative voltage between the finger and the sensing chip is changed. Alternately, the capacitance signal may be detected by sensing the change in charge received by the capacitive sensing elements as the relative voltage between the finger and the sensing chip is changed.

Abstract: A capacitive fingerprint sensor that may be formed of an array of sensing elements. Each capacitive sensing element of the array may register a voltage that varies with the capacitance of a capacitive coupling. A finger may capacitively couple to the individual capacitive sensing elements of the sensor, such that the sensor may sense a capacitance between each capacitive sensing element and the flesh of the fingerprint. The capacitance signal may be detected by sensing the change in voltage on the capacitive sensing element as the relative voltage between the finger and the sensing chip is changed. Alternately, the capacitance signal may be detected by sensing the change in charge received by the capacitive sensing elements as the relative voltage between the finger and the sensing chip is changed.

Abstract: In an electronic device having a compact form factor, a space-saving harness using bundled or ribbonized strands of micro-coaxial (micro-coax) cable may be utilized to provide signal and/or power interconnects between EMI-generating peripheral components and other components in the device such as those populated on circuit boards. Discrete wires are included in the harness to provide shielding to adjacent micro-coax conductors which may carry high speed signals such as MIPI (Mobile Industry Processor Interface) differential signal pairs and provide power and ground return paths. The discrete wires are subjected to fabrication processes during assembly of the micro-coax harness so that their outer diameters substantially match that of components in the micro-coax cable to thereby facilitate connectorization or termination to the circuit boards and/or other components in the device.

Abstract: In an electronic device having a compact form factor, such as a head mounted display (HMD) device, a space-saving harness using bundled or ribbonized strands of micro-coaxial (micro-coax) cable may be utilized to provide signal and/or power interconnects between EMI-generating peripheral components and other components in the device such as those populated on circuit boards. Discrete wires are included in the harness to provide shielding to adjacent micro-coax conductors which may carry high speed signals such as MIPI (Mobile Industry Processor Interface) differential signal pairs and provide power and ground return paths. The discrete wires are subjected to fabrication processes during assembly of the micro-coax harness so that their outer diameters substantially match that of components in the micro-coax cable to thereby facilitate connectorization or termination to the circuit boards and/or other components in the device. The matching outer diameters can also provide a consistent pitch (i.e.

Abstract: A capacitive fingerprint sensor that may be formed of an array of sensing elements. Each capacitive sensing element of the array may register a voltage that varies with the capacitance of a capacitive coupling. A finger may capacitively couple to the individual capacitive sensing elements of the sensor, such that the sensor may sense a capacitance between each capacitive sensing element and the flesh of the fingerprint. The capacitance signal may be detected by sensing the change in voltage on the capacitive sensing element as the relative voltage between the finger and the sensing chip is changed. Alternately, the capacitance signal may be detected by sensing the change in charge received by the capacitive sensing elements as the relative voltage between the finger and the sensing chip is changed.