Abstract: A method of forming a protection layer on a specimen for TEM inspection and a method of forming a specimen for TEM inspection are provided. The method of forming a protection layer on a specimen for TEM inspection generally comprises coating a wafer slice comprising an inspection point with a protection material and compressing the protection material to the wafer slice. The method of forming a specimen for TEM inspection generally comprises cutting a wafer slice comprising an inspection point from a wafer, forming a protection layer on the wafer slice, forming a first preliminary specimen by cutting the wafer slice, forming a second preliminary specimen by grinding the first preliminary specimen, and forming a TEM specimen by etching portions of the second preliminary specimen.

Abstract: A method of forming a protection layer on a specimen for TEM inspection and a method of forming a specimen for TEM inspection are provided. The method of forming a protection layer on a specimen for TEM inspection generally comprises coating a wafer slice comprising an inspection point with a protection material and compressing the protection material to the wafer slice. The method of forming a specimen for TEM inspection generally comprises cutting a wafer slice comprising an inspection point from a wafer, forming a protection layer on the wafer slice, forming a first preliminary specimen by cutting the wafer slice, forming a second preliminary specimen by grinding the first preliminary specimen, and forming a TEM specimen by etching portions of the second preliminary specimen.