Abstract: A multilayer ceramic electronic component may include: a ceramic body in which dielectric layers containing plate-shaped dielectric grains are stacked; and internal electrodes disposed on the dielectric layers within the ceramic body. The dielectric layer may contain dielectric grains, plate-shaped surfaces of which have an angle of 20° or less with regard to a boundary surface between the dielectric layer and the internal electrode.

Abstract: A multilayer ceramic electronic component may include: a ceramic body including a plurality of dielectric layers; internal electrodes disposed in the ceramic body and having one ends exposed to outer surfaces of the ceramic body; and external electrodes disposed on the outer surfaces of the ceramic body to be connected to the respective one ends of the internal electrodes and containing a conductive metal and a conductive ceramic powder.

Abstract: A multilayer ceramic electronic component may include: a ceramic body including an active part in which dielectric layers and internal electrodes are alternately disposed, an upper cover part disposed on an upper portion of the active part, and a lower cover part disposed on a lower portion thereof; a first dummy electrode disposed between a central portion of the upper or lower cover part in a length direction and one end surface of the cover part in the length direction; and a second dummy electrode disposed between the central portion of the upper or lower cover part in the length direction and the other end surface of the cover part in the length direction, and spaced apart from the first dummy electrode.

Abstract: A multilayer ceramic electronic component may include: a plurality of active parts including a plurality of dielectric layers and a plurality of internal electrodes that are alternately disposed, the plurality of active parts being stacked; an interlayer margin part disposed between the active parts adjacent to each other and containing magnesium; an upper cover part disposed on an upper portion of an uppermost active part among the plurality of active parts and containing magnesium; and a lower cover part disposed on a lower portion of a lowermost active part among the plurality of active parts and containing magnesium, wherein the upper and lower cover parts and the interlayer margin part include magnesium-nickel oxide layers formed on interfaces thereof adjacent to the active parts.

Abstract: A multilayer ceramic capacitor includes a ceramic body including dielectric layers and internal electrodes; an electrode layer disposed on an outer surface of the ceramic body and electrically connected to the internal electrodes; a first composite resin layer disposed on the electrode layer and including a first conductive powder; and a second composite resin layer disposed on the first composite resin layer and including a second conductive powder different from the first conductive powder.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers; an oxide film formed on one surface of the ceramic body; first and second external electrodes formed on both sides of the oxide film on one surface of the ceramic body; a first internal electrode formed on the dielectric layer and including a first electrode lead-out portion exposed to the first external electrode and a first insulating lead-out portion exposed to the oxide film and having a composite-metal-oxide region formed in an exposed edge portion thereof; a second internal electrode facing the first internal electrode, having the dielectric layer interposed therebetween, and including a second electrode lead-out portion exposed to the second external electrode and a second insulating lead-out portion exposed to the oxide film, having a composite-metal-oxide region formed in an exposed edge portion thereof, and overlapped with the first insulating lead-out portion to form additional capacitance.

Abstract: A multilayer ceramic electronic component may include: a ceramic body including a plurality of dielectric layers; internal electrodes disposed in the ceramic body and having one ends exposed to outer surfaces of the ceramic body; and external electrodes disposed on the outer surfaces of the ceramic body to be connected to the respective one ends of the internal electrodes and containing a conductive metal and a conductive ceramic powder.

Abstract: A multilayer ceramic electronic component may include: a plurality of active parts including a plurality of dielectric layers and a plurality of internal electrodes that are alternately disposed, the plurality of active parts being stacked; an interlayer margin part disposed between the active parts adjacent to each other and containing magnesium; an upper cover part disposed on an upper portion of an uppermost active part among the plurality of active parts and containing magnesium; and a lower cover part disposed on a lower portion of a lowermost active part among the plurality of active parts and containing magnesium, wherein the upper and lower cover parts and the interlayer margin part include magnesium-nickel oxide layers formed on interfaces thereof adjacent to the active parts.

Abstract: A multilayer ceramic electronic component may include: a ceramic body including an active part in which dielectric layers and internal electrodes are alternately disposed, an upper cover part disposed on an upper portion of the active part, and a lower cover part disposed on a lower portion thereof; a first dummy electrode disposed between a central portion of the upper or lower cover part in a length direction and one end surface of the cover part in the length direction; and a second dummy electrode disposed between the central portion of the upper or lower cover part in the length direction and the other end surface of the cover part in the length direction, and spaced apart from the first dummy electrode.

Abstract: A multilayer ceramic electronic component may include: a ceramic body in which dielectric layers containing plate-shaped dielectric grains are stacked; and internal electrodes disposed on the dielectric layers within the ceramic body. The dielectric layer may contain dielectric grains, plate-shaped surfaces of which have an angle of 20° or less with regard to a boundary surface between the dielectric layer and the internal electrode.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers and internal electrodes; an electrode layer disposed on an outer surface of the ceramic body and electrically connected to the internal electrodes; a first composite resin layer disposed on the electrode layer and including a first conductive powder; and a second composite resin layer disposed on the first composite resin layer and including a second conductive powder different from the first conductive powder.

Abstract: There is provided a multilayer ceramic electronic component. The multilayer ceramic electronic component includes a ceramic main body including a dielectric layer, and first and second internal electrodes disposed to face each other within the ceramic main body and having the dielectric layer interposed therebetween. When an average roughness of center lines of the first and second internal electrodes is Ra, a maximum distance from a virtual line corresponding to Ra to a bottom of a pit (d) formed below the virtual line is 0.1 ?m to 13 ?m. The surface roughness of the internal electrode printed surface is improved to decrease the occurrence of electrical shorts.

Abstract: A magnetic paste composition for a chip electronic component, a chip electronic component, and a manufacturing method therof are provided. The chip electronic component is capable of being manufactured in a thin-film to allow for thinness and miniaturization thereof, thereby preventing a deterioration in efficiency thereof due to core loss even under high frequency and high current conditions. The chip electronic component exhibits high permeability, high efficiency, and a high Isat value by decreasing porosity.

Abstract: A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes covering end portions of the ceramic body in length direction; an active layer in which the internal electrodes are disposed in opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in thickness direction, the lower cover layer thicker than the upper cover layer.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers; an oxide film formed on one surface of the ceramic body; first and second external electrodes formed on both sides of the oxide film on one surface of the ceramic body; a first internal electrode formed on the dielectric layer and including a first electrode lead-out portion exposed to the first external electrode and a first insulating lead-out portion exposed to the oxide film and having a composite-metal-oxide region formed in an exposed edge portion thereof; a second internal electrode facing the first internal electrode, having the dielectric layer interposed therebetween, and including a second electrode lead-out portion exposed to the second external electrode and a second insulating lead-out portion exposed to the oxide film, having a composite-metal-oxide region formed in an exposed edge portion thereof, and overlapped with the first insulating lead-out portion to form additional capacitance.

Abstract: A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes covering end portions of the ceramic body in length direction; an active layer in which the internal electrodes are disposed in opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in thickness direction, the lower cover layer thicker than the upper cover layer.

Abstract: There is provided a multilayer ceramic electronic component. The multilayer ceramic electronic component includes a ceramic main body including a dielectric layer, and first and second internal electrodes disposed to face each other within the ceramic main body and having the dielectric layer interposed therebetween. When an average roughness of center lines of the first and second internal electrodes is Ra, a maximum distance from a virtual line corresponding to Ra to a bottom of a pit (d) formed below the virtual line is 0.1 ?m to 13 ?m. The surface roughness of the internal electrode printed surface is improved to decrease the occurrence of electrical shorts.

Abstract: There are provided a ceramic composition for a multilayer ceramic capacitor, a multilayer ceramic capacitor comprising the same, and a method of manufacturing the multilayer ceramic capacitor. The ceramic composition includes a dielectric ceramic powder; an organic binder; and an antistatic agent represented by a specific Chemical Formula. A ceramic green sheet comprising the ceramic composition according to an exemplary embodiment of the present invention only generates a small amount of static electricity and shows excellent mechanical physical properties even in the case that the thickness thereof is thin.

Abstract: Provided is a shadow mask including a substrate; a mask that is formed to have an opening for transferring a thin film onto the substrate in a desired shape; and a delamination-preventing polymer layer formed on the mask.