Abstract: A capacitance-variable pressure sensor is disclosed. The capacitance-variable pressure sensor includes a double layer flexible circuit board, a multi-layer ceramic capacitor, and a soft conductive pad. The multi-layer ceramic capacitor is positioned in adjacent to the soft conductive pad. The double layer flexible circuit board is configured with a through hole or a notch, and is positioned between the multi-layer ceramic capacitor and the soft conductive pad. The multi-layer ceramic capacitor is positioned above the through hole or notch, and the soft conductive pad is positioned under the through hole or notch. The multi-layer ceramic capacitor includes a first member and a second member. The first member includes an external electrode or a plurality of external electrodes. The second member includes a ceramic dielectric, and a plurality of internal electrode layers disposed inside the ceramic dielectric. Each external electrode is connected to internal electrode layers.

Abstract: A variable capacitor is disclosed. The variable capacitor includes a multi-layer ceramic capacitor member, and a capacitance varying mechanism. The multi-layer ceramic capacitor member includes one or two external electrode(s), a ceramic dielectric, and a plurality of electrode layers positioned inside the ceramic dielectric. The capacitance varying mechanism includes an electrical conductor positioned aside and approximate to the ceramic dielectric. The electrical conductor is deformable responsive to a pressure applied thereon, and an area of the electrical conductor in contact with the ceramic dielectric varies in accordance with the pressure, thus varying a capacitance value between the external electrode(s) and the electrical conductor. In general, the external electrode(s) of the multi-layer ceramic capacitor member serve(s) as fixed electrode(s) of the variable capacitor.

Abstract: A capacitance-variable pressure sensor is disclosed. The capacitance-variable pressure sensor includes a double layer flexible circuit board, a multi-layer ceramic capacitor, and a soft conductive pad. The multi-layer ceramic capacitor is positioned in adjacent to the soft conductive pad. The double layer flexible circuit board is configured with a through hole or a notch, and is positioned between the multi-layer ceramic capacitor and the soft conductive pad. The multi-layer ceramic capacitor is positioned above the through hole or notch, and the soft conductive pad is positioned under the through hole or notch. The multi-layer ceramic capacitor includes a first member and a second member. The first member includes an external electrode or a plurality of external electrodes. The second member includes a ceramic dielectric, and a plurality of internal electrode layers disposed inside the ceramic dielectric. Each external electrode is connected to internal electrode layers.

Abstract: A variable capacitor is disclosed. The variable capacitor includes a multi-layer ceramic capacitor member, and a capacitance varying mechanism. The multi-layer ceramic capacitor member includes one or two external electrode(s), a ceramic dielectric, and a plurality of electrode layers positioned inside the ceramic dielectric. The capacitance varying mechanism includes an electrical conductor positioned aside and approximate to the ceramic dielectric. The electrical conductor is deformable responsive to a pressure applied thereon, and an area of the electrical conductor in contact with the ceramic dielectric varies in accordance with the pressure, thus varying a capacitance value between the external electrode(s) and the electrical conductor. In general, the external electrode(s) of the multi-layer ceramic capacitor member serve(s) as fixed electrode(s) of the variable capacitor.

Abstract: A method for fabricating an electromagnetic induction digitizer antenna board that includes the steps of: a. preparing a substrate that is convenient for being holed; b. providing a consecutive wire leading-out terminal at one side of the substrate; c. moving the substrate relative to the consecutive wire leading-out terminal along with a predetermined track of the electromagnetic induction coil of the induction digitizer antenna board, so that the consecutive wire leading-out terminal gets in surface-contact with the substrate, and configures the electromagnetic induction coil on the substrate; d. binding the conductive wire of the electromagnetic induction coil with the substrate at every predetermined interval.

Abstract: The present invention discloses provides a method for fabricating an electromagnetic induction digitizer antenna board. The present invention is featured with advantages of low cost, satisfactory consistency of the product quality, high production yield, simplified process, and using well-developed equipment. The method includes the steps of: a. preparing a substrate that is convenient for being holed; b. providing a consecutive wire leading-out terminal at one side of the substrate; c. moving the substrate relative to the consecutive wire leading-out terminal along with a predetermined track of the electromagnetic induction coil of the induction digitizer antenna board, so that the consecutive wire leading-out terminal gets in surface-contact with the substrate, and configures the electromagnetic induction coil on the substrate; d. binding the conductive wire of the electromagnetic induction coil with the substrate at every predetermined interval.