Patents by Inventor Hangcheol Choi

Hangcheol Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060192275
    Abstract: Apparatus and center pad die and substrate assemblies configured to provide for molding, in a single molding step, both an attached center pad die and other features on a die attach side of the substrate, and wire bonds an associated bond pads and other features on the opposite side of the substrate. Also, methods for sealing a center pad die and substrate assembly, including such a molding step.
    Type: Application
    Filed: November 14, 2005
    Publication date: August 31, 2006
    Applicant: ChipPAC. Inc
    Inventors: Seongmin Lee, Hangcheol Choi, In-Sang Yoon