Patents by Inventor Hangnga NGUYEN

Hangnga NGUYEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wireless communication chip having internal antenna, internal antenna for wireless communication chip, and method of fabricating wireless communication chip having internal antenna
    Patent number: 10784562
    Abstract: A wireless communication chip having an internal antenna includes a substrate having first and second mounting regions; a wireless communication module molded on the first mounting region; and an antenna block mounted on the second mounting region to be electrically connected to the wireless communication module, wherein the antenna block includes a first antenna on the substrate; a connection element connected to the first antenna; an insulating layer on the first antenna and the connection element to cover the first antenna and the connection element; and a second antenna on the insulating layer such that a first surface of the second antenna is in contact with the insulating layer, and a second surface, which is a reverse surface of the first surface, is exposed to the outside of the wireless communication chip, wherein the second antenna is electrically connected to the first antenna through the connection element.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: September 22, 2020
    Assignee: LS MTRON LTD.
    Inventors: Tae Hyung Kim, Seung Hun Lee, Hangnga Nguyen, Seong Soo Han, Young Ho Kim
  • WIRELESS COMMUNICATION CHIP HAVING INTERNAL ANTENNA, INTERNAL ANTENNA FOR WIRELESS COMMUNICATION CHIP, AND METHOD OF FABRICATING WIRELESS COMMUNICATION CHIP HAVING INTERNAL ANTENNA
    Publication number: 20190020096
    Abstract: A wireless communication chip having an internal antenna includes a substrate having first and second mounting regions; a wireless communication module molded on the first mounting region; and an antenna block mounted on the second mounting region to be electrically connected to the wireless communication module, wherein the antenna block includes a first antenna on the substrate; a connection element connected to the first antenna; an insulating layer on the first antenna and the connection element to cover the first antenna and the connection element; and a second antenna on the insulating layer such that a first surface of the second antenna is in contact with the insulating layer, and a second surface, which is a reverse surface of the first surface, is exposed to the outside of the wireless communication chip, wherein the second antenna is electrically connected to the first antenna through the connection element.
    Type: Application
    Filed: July 13, 2018
    Publication date: January 17, 2019
    Inventors: Tae Hyung KIM, Seung Hun LEE, Hangnga NGUYEN, Seong Soo HAN, Young Ho KIM