Patents by Inventor Hangping CHEN

Hangping CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200197679
    Abstract: A microneedle chip and manufacturing method. The method comprises injecting, into a female mold, a fluid needle liquid, wherein forming cavities matching the shapes of needles of a microneedle chip are provided at the female mold and form a cavity array, injection inlets are provided at a surface of one side of the female mold, and air ejection openings are provided at a surface of another side of the female mold to form an air ejection surface; covering the air ejection surface of the female mold using a breathable film, and during injection, passing a gas through the breathable film so as to retain the liquid inside the forming cavities; curing the fluid needle liquid to form the microneedle chip, and demolding to obtain the same. By employing the air ejection openings and the breathable film, a liquid is retained while ejecting a gas, providing a favorable micro-injection effect.
    Type: Application
    Filed: June 21, 2016
    Publication date: June 25, 2020
    Inventors: Ge LI, Hangping CHEN, Minmin ZHANG, Qian ZHANG, Gangtao YAO