Abstract: Display devices are disclosed. The display device comprises a substrate including an electrostatic discharge area where an electrostatic discharge element is disposed and a normal area surrounding the electrostatic discharge area, a lower planarization layer disposed on the substrate, a first trench positioned between the electrostatic discharge area and the normal area, and disposed in the lower planarization layer, a first upper planarization layer positioned in the normal area, and disposed on the lower planarization layer, and an insulation layer disposed on the first upper planarization layer, the first trench, and the lower planarization layer, and formed of an inorganic material, thereby preventing electrolytic corrosion in the electrostatic discharge area.

Abstract: An LCD device includes a first substrate including a display region having pixel regions and a non-display region disposed outside the display region; gate lines and data lines on the first substrate and cross each other to define the pixel regions; a TFT in each of the pixel regions; a pixel electrode in each pixel region and connected to the TFT; a second substrate disposed opposite the first substrate; a color filter layer on the second substrate; a common electrode; a liquid crystal layer between the first and second substrates; and an FPC connected to the non-display region on one side of the first substrate, the FPC being bent toward an outer side surface of the second substrate, wherein each of the gate lines has a double structure including a first layer of a transparent conductive material and a second layer of Cu or Cu alloy.

Abstract: Disclosed is an organic light emitting diode device fabrication method that includes: preparing a substrate which is defined into a display area and a non-display area; forming a light emission portion, which includes a thin film transistor and an organic light emission layer in the display area, and a pad portion in a part of the non-display area; sequentially forming a sacrificial layer and an encapsulation passivation film throughout the display and non-display areas; and separating the sacrificial layer and the encapsulation passivation film from the pad portion through an irradiation of laser light.

Abstract: Disclosed is an organic light emitting diode device fabrication method that includes: preparing a substrate which is defined into a display area and a non-display area; forming a light emission portion, which includes a thin film transistor and an organic light emission layer in the display area, and a pad portion in a part of the non-display area; sequentially forming a sacrificial layer and an encapsulation passivation film throughout the display and non-display areas; and separating the sacrificial layer and the encapsulation passivation film from the pad portion through an irradiation of laser light.

Abstract: Provided is a method of manufacturing an organic light emitting display device. The method includes: providing a first substrate including: a display portion, and a non-display portion, forming a thin film transistor (TFT) and an organic light emitting diode (OLED) in the display portion of the first substrate, providing a pad portion including: at least one pad contact portion at the non-display portion and electrically connected to the TFT, and a pad insulating portion between adjacent pad contact portions, providing an anti-moisture insulation layer entirely covering the first substrate, adhering an encapsulating substrate onto the anti-moisture insulation portion in correspondence with the display portion, and removing the anti-moisture insulation layer, at the pad contact portion, using a laser.

Abstract: Disclosed is an imprinting apparatus and imprinting method using the same that prevent a process of forming a pattern on a substrate from being affected by flatness of a stage. The imprinting apparatus comprises a chamber unit in which a process of forming a pattern on a substrate is carried out; a stage for supporting the substrate on which a resin layer is formed; an installing member positioned above the stage and having a mold member attached to transform the resin layer so as to form the pattern on the substrate; and a first spraying unit for spraying fluid to separate the substrate supported by the stage from the stage, wherein the installing member moves the mold member in the direction getting near to the substrate separated from the stage so that the mold member and the resin layer are brought into contact with each other.

Abstract: Disclosed is an organic light emitting diode device fabrication method that includes: preparing a substrate which is defined into a display area and a non-display area; forming a light emission portion, which includes a thin film transistor and an organic light emission layer in the display area, and a pad portion in a part of the non-display area; sequentially forming a sacrificial layer and an encapsulation passivation film throughout the display and non-display areas; and separating the sacrificial layer and the encapsulation passivation film from the pad portion through an irradiation of laser light.

Abstract: A liquid crystal display device includes: first and second substrates; a gate line and a data line on an inner surface of the first substrate; a thin film transistor connected to the gate line and the data line; a plurality of pixel electrodes and a plurality of common electrodes in the pixel region; a color filter layer on an inner surface of the second substrate; a black stripe and a column spacer on the color filter layer, the black stripe having a first thickness and the column spacer having a second thickness greater than the first thickness, and the black stripe corresponding to the gate line; and a liquid crystal layer between the first and second substrates.

Abstract: A liquid crystal display device is discussed, which includes a substrate; gate and data lines crossing each other on the substrate to thereby define a pixel region; a thin film transistor connected to the gate and data lines; and a plurality of pixel electrodes and a plurality of first common electrodes alternating with each other in the pixel region and configured to induce an in-plane electric field, and each including a first layer and a second layer on the first layer, wherein the first layer is made of an opaque metal and has a first thickness, and the second layer is made of a transparent conductive material and has a second thickness.

Abstract: Provided is a method of manufacturing an organic light emitting display device. The method includes: providing a first substrate including: a display portion, and a non-display portion, forming a thin film transistor (TFT) and an organic light emitting diode (OLED) in the display portion of the first substrate, providing a pad portion including: at least one pad contact portion at the non-display portion and electrically connected to the TFT, and a pad insulating portion between adjacent pad contact portions, providing an anti-moisture insulation layer entirely covering the first substrate, adhering an encapsulating substrate onto the anti-moisture insulation portion in correspondence with the display portion, and removing the anti-moisture insulation layer, at the pad contact portion, using a laser.

Abstract: An IPS mode LCD device includes gate and data lines on a first substrate and crossing to define pixel regions; a thin film transistor connected to the gate lines and the data lines; a first common electrode and a pixel electrode on the first substrate and alternating with each other in each pixel region, each of the first common electrode and the pixel electrode including lower and upper layers; a color filter layer including red, green and blue color filter patterns and on a second substrate, the color filter patterns corresponding to each pixel region; and a liquid crystal layer between the first and second substrates, wherein at least two of the color filter patterns overlap at a boundary of the pixel regions, and wherein the lower layer is made of MoTi, and the upper layer is made of a transparent conductive material or copper nitride.

Abstract: Disclosed is an organic light emitting diode device fabrication method that includes: preparing a substrate which is defined into a display area and a non-display area; forming a light emission portion, which includes a thin film transistor and an organic light emission layer in the display area, and a pad portion in a part of the non-display area; sequentially forming a sacrificial layer and an encapsulation passivation film throughout the display and non-display areas; and separating the sacrificial layer and the encapsulation passivation film from the pad portion through an irradiation of laser light.

Abstract: Disclosed are an apparatus and method for fabricating a flat panel display device to realize easy separation of a substrate from an imprinting mold. The apparatus includes an imprinting mold connected to a substrate to form a thin film pattern on the substrate, a first adsorption pad to vacuum-adsorb the center of the imprinting mold, a second adsorption pad to vacuum-adsorb the periphery of the imprinting mold, and a connector connected to vacuum pins to vertically move in different regions of the first and second adsorption pads.

Abstract: Disclosed is an imprinting apparatus and imprinting method using the same that prevent a process of forming a pattern on a substrate from being affected by flatness of a stage. The imprinting apparatus comprises a chamber unit in which a process of forming a pattern on a substrate is carried out; a stage for supporting the substrate on which a resin layer is formed; an installing member positioned above the stage and having a mold member attached to transform the resin layer so as to form the pattern on the substrate; and a first spraying unit for spraying fluid to separate the substrate supported by the stage from the stage, wherein the installing member moves the mold member in the direction getting near to the substrate separated from the stage so that the mold member and the resin layer are brought into contact with each other.

Abstract: A method of fabricating an imprint mold is disclosed. The method includes: forming a first photo resist pattern on a substrate; etching the substrate using the first photo resist pattern as an etch mask to form a first pattern in the substrate; ashing the first photo resist pattern to form a second photo resist pattern; and etching the substrate using the second photo resist pattern to form a second pattern derived from the substrate and a third pattern derived from the first pattern.

Abstract: Disclosed is an imprinting apparatus and imprinting method using the same that prevent a process of forming a pattern on a substrate from being affected by flatness of a stage. The imprinting apparatus comprises a chamber unit in which a process of forming a pattern on a substrate is carried out; a stage for supporting the substrate on which a resin layer is formed; an installing member positioned above the stage and having a mold member attached to transform the resin layer so as to form the pattern on the substrate; and a first spraying unit for spraying fluid to separate the substrate supported by the stage from the stage, wherein the installing member moves the mold member in the direction getting near to the substrate separated from the stage so that the mold member and the resin layer are brought into contact with each other.

Abstract: Disclosed herein are a liquid crystal display (LCD) device and a method for manufacturing the same, capable of preventing problems (i.e., movement of balls, damage to the surfaces that face spacers upon application of predetermined pressure, and variation in cell gap) associated with the use of the ball spacers. The liquid crystal display device includes a first substrate and a second substrate facing each other, a spacer formed on the first substrate, wherein the spacer includes a plurality of balls and a solid to aggregate the balls together and adhere the balls to the first substrate, a hard coating layer formed on the second substrate facing the spacer, and a liquid crystal layer filled between the first substrate and the second substrate.

Abstract: A method of manufacturing an array substrate for a liquid crystal display device includes forming gate and data lines crossing each other on a substrate; forming a thin film transistor connected to the gate and data lines; forming a passivation layer on the substrate having the gate lines, data lines and the thin film transistor; forming a first conductive material layer on the passivation layer and connected to a drain electrode of the thin film transistor; oxidizing a surface of the first conductive material layer; forming a second conductive material layer on the oxidized first conductive material layer; forming a photoresist pattern on the second conductive material layer; etching the first and second conductive material layers using the photoresist pattern to form pixel and common electrodes which are alternately arranged in the pixel region and produces an in-plane electric field; and removing the photoresist pattern.

Abstract: A flat panel display device includes a thin film pattern formed by an imprinting mold pressing imprinting resin on a substrate, an outer thin film pattern formed on an outer region of the substrate, adjacent to the thin film pattern, wherein the outer thin film pattern is used as a demolding seed for demolding the substrate from the imprinting mold, and the outer thin film pattern configured to limit movement of the imprinting resin.

Abstract: A method of manufacturing an array substrate for a liquid crystal display device includes forming gate and data lines crossing each other on a substrate; forming a thin film transistor connected to the gate and data lines; forming a passivation layer on the substrate having the gate lines, data lines and the thin film transistor; forming a first conductive material layer on the passivation layer and connected to a drain electrode of the thin film transistor; oxidizing a surface of the first conductive material layer; forming a second conductive material layer on the oxidized first conductive material layer; forming a photoresist pattern on the second conductive material layer; etching the first and second conductive material layers using the photoresist pattern to form pixel and common electrodes which are alternately arranged in the pixel region and produces an in-plane electric field; and removing the photoresist pattern.