Patents by Inventor Hangyu DUAN

Hangyu DUAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11709109
    Abstract: The PCB wind tunnel test device includes: a flow-stabilizing structure, which includes: a box used to provide flow channels for air entering the flow-stabilizing structure; flow-stabilizing plates, which are inserted into the cavities of the box in a layered manner; a wind source, arranged at an air inlet of the flow-stabilizing structure; a test device, arranged at the outlet of the flow-stabilizing structure. When the flow-stabilizing structure receives the wind energy provided by the wind source, the state of the air flow is adjusted by flow stabilization, so that the test device tests the air passing through the flow-stabilizing structure. The present invention solves the problem that conventional wind tunnels cannot test at low air volumes and enables PCB testing at different ambient temperatures.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: July 25, 2023
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Hangyu Duan, Lianfei Zhang
  • Publication number: 20220291081
    Abstract: The present disclosure provides PCB wind tunnel test equipment. The PCB wind tunnel test device includes: a flow-stabilizing structure, which includes: a box used to provide flow channels for air entering the flow-stabilizing structure; flow-stabilizing plates, which are inserted into the cavities of the box in a layered manner; a wind source, arranged at an air inlet of the flow-stabilizing structure; a test device, arranged at the outlet of the flow-stabilizing structure. When the flow-stabilizing structure receives the wind energy provided by the wind source, the state of the air flow is adjusted by flow stabilization, so that the test device can test the air passing through the flow-stabilizing structure. The present invention solves the problem that conventional wind tunnels cannot test at low air volumes and enables PCB testing at different ambient temperatures.
    Type: Application
    Filed: June 24, 2021
    Publication date: September 15, 2022
    Applicants: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Hangyu DUAN, Lianfei ZHANG