Patents by Inventor Hanh Chu

Hanh Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Assessing alignment of top and bottom ends of TSVs and characterizing microfabrication process
    Patent number: 9952041
    Abstract: A method for characterizing a microfabrication process and the product thereof is described. A substrate having TSV's formed therein is assessed by determining the geometries and positions of the top and bottom ends of a TSV. Individual TSV's as well as the entire pattern of TSV's formed in a substrate may be assessed.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: April 24, 2018
    Assignee: Rudolph Technologies, Inc.
    Inventors: Rajiv Roy, David Grant, David S. Marx, Hanh Chu
  • METHOD OF CHARACTERIZING MICROFABRICATION PROCESS AND PRODUCTS THEREOF
    Publication number: 20150362314
    Abstract: A method for characterizing a microfabrication process and the product thereof is described. A substrate having TSV's formed therein is assessed by determining the geometries and positions of the top and bottom ends of a TSV. Individual TSV's as well as the entire pattern of TSV's formed in a substrate may be assessed.
    Type: Application
    Filed: January 23, 2014
    Publication date: December 17, 2015
    Inventors: Rajiv Roy, David Grant, David S. Marx, Hanh Chu