Patents by Inventor Han Hong Lee

Han Hong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11979996
    Abstract: A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: May 7, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yusuf Cinar, Jae Hong Park, Han Hong Lee, Seon Gyun Baek, Won-Gi Hong
  • Publication number: 20240114638
    Abstract: A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.
    Type: Application
    Filed: December 5, 2023
    Publication date: April 4, 2024
    Inventors: Yusuf CINAR, Jae Hong PARK, Han Hong LEE, Seon Gyun BAEK, Won-Gi HONG
  • Patent number: 11889643
    Abstract: An extension kit includes a case, a locking lever, and a first elastic member. The case has an interior space which extends in a first direction. The locking lever includes a lever portion which is rotatable about a first rotation axis extending in a second direction intersecting the first direction, a plate portion which extends from the lever portion and which is exposed at the case, an arm portion which extends in the second direction from the plate portion, and a first locking portion which protrudes from the arm portion. The first elastic member is provided in the interior space of the case and elastically connects the case and the locking lever in the interior space of the case.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: January 30, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Han Hong Lee, Jae Hong Park, Seon Gyun Baek, Yusuf Cinar
  • Patent number: 11877410
    Abstract: A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: January 16, 2024
    Inventors: Yusuf Cinar, Jae Hong Park, Han Hong Lee, Seon Gyun Baek, Won-Gi Hong
  • Patent number: 11495907
    Abstract: Provided are a receptacle connector configured to avoid damage to conductors of the receptacle connector. The receptacle connector includes a plurality of connection terminals, a mold structure which comprises a front part exposing each of the connection terminals and a support part disposed on a rear end of the front part and surrounding each of the connection terminals, and a shield which is disposed on the support part and comprises a conductive material, wherein the support part comprises a flat part which includes a surface along which the shield extends and a protruding part which protrudes from the surface of the flat part and is disposed in front of a front end of the shield. The protruding part is configured to avoid damage to conductors of the receptacle when a plug is mated to the receptacle.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: November 8, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seon Gyun Baek, Jae Hong Park, Yusuf Cinar, Han Hong Lee
  • Publication number: 20220278475
    Abstract: Provided are a receptacle connector configured to avoid damage to conductors of the receptacle connector. The receptacle connector includes a plurality of connection terminals, a mold structure which comprises a front part exposing each of the connection terminals and a support part disposed on a rear end of the front part and surrounding each of the connection terminals, and a shield which is disposed on the support part and comprises a conductive material, wherein the support part comprises a flat part which includes a surface along which the shield extends and a protruding part which protrudes from the surface of the flat part and is disposed in front of a front end of the shield. The protruding part is configured to avoid damage to conductors of the receptacle when a plug is mated to the receptacle.
    Type: Application
    Filed: May 12, 2022
    Publication date: September 1, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seon Gyun BAEK, Jae Hong PARK, Yusuf CINAR, Han Hong LEE
  • Patent number: D986249
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: May 16, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yusuf Cinar, Jae Hong Park, Han Hong Lee, Seon Gyun Baek, Won-Gi Hong
  • Patent number: D986898
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: May 23, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yusuf Cinar, Jae Hong Park, Han Hong Lee, Seon Gyun Baek, Won-Gi Hong
  • Patent number: D986899
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: May 23, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yusuf Cinar, Jae Hong Park, Han Hong Lee, Seon Gyun Baek, Won-Gi Hong
  • Patent number: D986900
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: May 23, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yusuf Cinar, Jae Hong Park, Han Hong Lee, Seon Gyun Baek, Won-Gi Hong
  • Patent number: D986901
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: May 23, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yusuf Cinar, Jae Hong Park, Han Hong Lee, Seon Gyun Baek, Won-Gi Hong
  • Patent number: D987639
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yusuf Cinar, Han-Hong Lee, Seon-Gyun Baek
  • Patent number: D987640
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yusuf Cinar, Han Hong Lee, Seon Gyun Baek
  • Patent number: D988318
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: June 6, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yusuf Cinar, Jae Hong Park, Han Hong Lee, Seon Gyun Baek, Won-Gi Hong
  • Patent number: D989076
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: June 13, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yusuf Cinar, Han-Hong Lee, Seon-Gyun Baek
  • Patent number: D989767
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: June 20, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yusuf Cinar, Han Hong Lee, Seon Gyun Baek
  • Patent number: D996424
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: August 22, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yusuf Cinar, Jae Hong Park, Han Hong Lee, Seon Gyun Baek, Won-Gi Hong
  • Patent number: D997161
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: August 29, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yusuf Cinar, Jae Hong Park, Han Hong Lee, Seon Gyun Baek, Won-Gi Hong
  • Patent number: D997939
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: September 5, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yusuf Cinar, Jae Hong Park, Han Hong Lee, Seon Gyun Baek, Won-Gi Hong
  • Patent number: D998612
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: September 12, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yusuf Cinar, Jae Hong Park, Han Hong Lee, Seon Gyun Baek, Won-Gi Hong