Abstract: Various aspects provide for bending a bending a lead frame of a semiconductor device package into a shape of an “L” and mounting the package on a substrate. A horizontal portion of the bent lead-frame is about parallel with a surface of the package. A vertical portion of the bent lead frame is configured to extend the horizontal portion beyond the surface of the package. A device may be mounted between the substrate and the package.

Abstract: A technique for preventing power interruptions and extending backup power life is provided. The technique automatically prevents power interruptions in a line between a power source and a load. The technique can also extend the operating life of the power source. In one embodiment, a circuit for preventing power interruptions is provided. The circuit may include at least one arrays of capacitors, with the capacitors being arranged in parallel within an array, at least one switching elements configured to couple the at least one array of capacitors to a load, and a controller operatively coupled to the at least one switching element. The controller is configured to selectively drive the at least one switching element based on predetermined criteria.

Abstract: Various aspects provide for bending a bending a lead frame of a semiconductor device package into a shape of an “L” and mounting the package on a substrate. A horizontal portion of the bent lead-frame is about parallel with a surface of the package. A vertical portion of the bent lead frame is configured to extend the horizontal portion beyond the surface of the package. A device may be mounted between the substrate and the package.

Abstract: A technique for preventing power interruptions and extending backup power life is provided. The technique automatically prevents power interruptions in a line between a power source and a load. The technique can also extend the operating life of the power source. In one embodiment, a circuit for preventing power interruptions is provided. The circuit may include at least one arrays of capacitors, with the capacitors being arranged in parallel within an array, at least one switching elements configured to couple the at least one array of capacitors to a load, and a controller operatively coupled to the at least one switching element. The controller is configured to selectively drive the at least one switching element based on predetermined criteria.

Abstract: A technique for preventing power interruptions and extending backup power life is provided. The technique automatically prevents power interruptions in a line between a power source and a load. The technique can also extend the operating life of the power source. In one embodiment, a circuit for preventing power interruptions is provided. The circuit may include at least one arrays of capacitors, with the capacitors being arranged in parallel within an array, at least one switching elements configured to couple the at least one array of capacitors to a load, and a controller operatively coupled to the at least one switching element. The controller is configured to selectively drive the at least one switching element based on predetermined criteria.

Abstract: A technique for preventing power interruptions and extending backup power life is provided. The technique automatically prevents power interruptions in a line between a power source and a load. The technique can also extend the operating life of the power source. In one embodiment, a circuit for preventing power interruptions is provided. The circuit may include at least one arrays of capacitors, with the capacitors being arranged in parallel within an array, at least one switching elements configured to couple the at least one array of capacitors to a load, and a controller operatively coupled to the at least one switching element. The controller is configured to selectively drive the at least one switching element based on predetermined criteria.

Abstract: A novel multi chip module having increased accuracy of the soldering the integrated circuits (ICs) is provided by utilizing two additional lead frames and turning over the first lead frame soldered IC and stacking secondary IC thereon. Arrays of the first lead frames are mounted on a top tray guided by tooling pins. Solder pastes are printed on the first lead frames. Arrays of the second lead frames are placed on the first lead frames guided with tooling pins. Another layer of solder pastes are printed on the second lead frames. Thermal conductive glue is dispensed on the central portions of the first lead frames. ICs, which become the “bottom ICs” later, are placed on the central portions of the first lead frames upside down by a pick/place machine. After heat treatment, inspection and repair, the bottom ICs are mounted in a pocket on a bottom tray facing the first lead frames upside. Another layer of solder pastes are printed on the first lead frames.

Abstract: A write-protected memory device has two write modes. Such memory device has many memory cells organized into pages. A normal write mode checks a one-bit flag collocated with every memory cell to see if writes are allowed. If the flag indicates a write operation to that memory cell is allowed, the flag is toggled and the cell is written. If the flag has previously been toggled, the write operation is prevented. A special write mode allows write operations to memory cells regardless of the state of the one-bit flag. The special write mode can be discerned in hardware by the loading of a register with a reprogrammable password, or the splitting of a normal single write-enable pin into two independent pins, e.g., normal write and special write.