Patents by Inventor Hank Hukyoo Shin

Hank Hukyoo Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure and method for metallization of semiconductor devices
    Patent number: 5700721
    Abstract: A metallization alloy for semiconductor devices comprising aluminum, copper, and tungsten is provided. In a method for applying the metallization, the metal is sputtered onto a semiconductor substrate having devices formed therein. After deposition, the metallization is patterned and etched using conventional semiconductor photoresist and etch techniques.
    Type: Grant
    Filed: June 4, 1996
    Date of Patent: December 23, 1997
    Assignee: Motorola, Inc.
    Inventors: Hank Hukyoo Shin, Clarence J. Tracy, Robert L. Duffin, John L. Freeman, Jr., Gordon Grivna, Syd R. Wilson