Abstract: A cover window including a flat portion and a curved portion extending from an end of the flat portion. The curved portion of the cover window includes a first section, a second section, and a third section, where the second section is disposed between the first section and the third section, an inner surface of the cover window contacts with an adhesive layer, a first radius of curvature having an average value of a radius of curvature of the inner surface of the cover window in the first section is greater than a second radius of curvature having an average value of a radius of curvature in the second section, and a third radius of curvature having an average value of a radius of curvature of the inner surface of the cover window in the third section is greater than the second radius of curvature.

Abstract: Disclosed is a rubber composition for protecting a sidewall of a tire from ozone and a tire manufactured using the same. More specifically, disclosed is a tire including a rubber sheet for preventing aging between a sidewall and a carcass, wherein the rubber sheet for preventing aging includes a rubber composition including 100 parts by weight of a base rubber, 20 to 60 parts by weight of carbon black, and 2 to 5 parts by weight of an amine-based anti-aging agent. The tire produced from the rubber composition has an effect of exhibiting significantly improved ozone resistance without changing a degree of blackness in terms of appearance.

Abstract: The present invention relates to an additive-infusing bottle cap. More specifically, the present invention relates to an additive-infusing bottle cap configured such that additives (functional substance) containing minerals, vitamins, and fruit flavors are provided inside a bottle cap so that when engaging the bottle cap with a container, the functional substance falls into the container and mixed with water. The additive-infusing bottle cap is configured with a thread portion provided on an inner surface of a body part to be screwed with a thread of a container and includes: a storage portion provided inside the body part and being movable while storing a functional substance therein; the functional substance filled in the storage portion; and a pressing portion provided in a space defined between the storage portion and the thread portion of the body part to press and tear the storage portion when engaging the bottle cap with the container.

Abstract: A cover window including a flat portion and a curved portion extending from an end of the flat portion. The curved portion of the cover window includes a first section, a second section, and a third section, where the second section is disposed between the first section and the third section, an inner surface of the cover window contacts with an adhesive layer, a first radius of curvature having an average value of a radius of curvature of the inner surface of the cover window in the first section is greater than a second radius of curvature having an average value of a radius of curvature in the second section, and a third radius of curvature having an average value of a radius of curvature of the inner surface of the cover window in the third section is greater than the second radius of curvature.

Abstract: A pressure sensor including a first conductor located in a pressure sensing region including a first sensing region and a second sensing region; and a second conductor spaced apart from the first conductor, the second conductor forming capacitance with the first conductor. The first conductor includes a first conductive part located in the first sensing region and a second conductive part located in the second sensing region. The area ratio of the second conductive part with respect to the second sensing region is different from the area ratio of the first conductive part with respect to the first sensing region.

Abstract: Disclosed is a rubber composition for protecting a sidewall of a tire from ozone and a tire manufactured using the same. More specifically, disclosed is a tire including a rubber sheet for preventing aging between a sidewall and a carcass, wherein the rubber sheet for preventing aging includes a rubber composition including 100 parts by weight of a base rubber, 20 to 60 parts by weight of carbon black, and 2 to 5 parts by weight of an amine-based anti-aging agent. The tire produced from the rubber composition has an effect of exhibiting significantly improved ozone resistance without changing a degree of blackness in terms of appearance.

Abstract: A pressure sensor including a first conductor located in a pressure sensing region including a first sensing region and a second sensing region; and a second conductor spaced apart from the first conductor, the second conductor forming capacitance with the first conductor. The first conductor includes a first conductive part located in the first sensing region and a second conductive part located in the second sensing region. The area ratio of the second conductive part with respect to the second sensing region is different from the area ratio of the first conductive part with respect to the first sensing region.

Abstract: A display device includes a display panel and a transparent display panel that overlaps the display panel. The display panel displays a whole image according to an input image signal. The transparent display panel displays a partial image when a region having a dynamic range that is greater than a reference range exists in the whole image, where the partial image corresponds to the region having the dynamic range that is greater than the reference range. Thus, the display device can efficiently improve a dynamic range of an image that is provided to a viewer.

Abstract: A multi-chip package may include a first semiconductor chip, a second semiconductor chip, a first stud bump, a first nail head bonding bump, a second stud bump, and a first conductive wire. The first semiconductor chip may have a first bonding pad. The second semiconductor chip may be stacked on the first semiconductor chip so the first bonding pad remains exposed. The second semiconductor chip may have a second bonding pad. The first stud bump may be formed on the first bonding pad. The first nail head bonding bump may be formed on the first stud bump, with one end of a first conductive wire formed between the two. The second stud bump may be formed on the second bonding pad, with another end of the first conductive wire formed between the two. An electrical connection test may be performed on each of the wire bonding processes.

Abstract: A multi-chip package may include a first semiconductor chip, a second semiconductor chip, a first stud bump, a first nail head bonding bump, a second stud bump, and a first conductive wire. The first semiconductor chip may have a first bonding pad. The second semiconductor chip may be stacked on the first semiconductor chip so the first bonding pad remains exposed. The second semiconductor chip may have a second bonding pad. The first stud bump may be formed on the first bonding pad. The first nail head bonding bump may be formed on the first stud bump, with one end of a first conductive wire formed between the two. The second stud bump may be formed on the second bonding pad, with another end of the first conductive wire formed between the two. An electrical connection test may be performed on each of the wire bonding processes.

Abstract: A multi-chip package may include a first semiconductor chip, a second semiconductor chip, a first stud bump, a first nail head bonding bump, a second stud bump, and a first conductive wire. The first semiconductor chip may have a first bonding pad. The second semiconductor chip may be stacked on the first semiconductor chip so the first bonding pad remains exposed. The second semiconductor chip may have a second bonding pad. The first stud bump may be formed on the first bonding pad. The first nail head bonding bump may be formed on the first stud bump, with one end of a first conductive wire formed between the two. The second stud bump may be formed on the second bonding pad, with another end of the first conductive wire formed between the two. An electrical connection test may be performed on each of the wire bonding processes.

Abstract: A multi-chip package may include a package substrate, a plurality of semiconductor chips and conductive connecting members. The semiconductor chips may be sequentially stacked on the package substrate. Each of the semiconductor chips may include a signal pad and a test pad. The conductive wires may be electrically connected between the signal pad of an upper semiconductor chip among the semiconductor chips and the package substrate via the test pad of a lower semiconductor chip under the upper semiconductor chip. The test pad may be converted into the dummy pad by cutting a fuse.