Abstract: A system for Demand Oriented User Interface Framework may include a display screen displaying a user interface, a memory, an input, and a processor to detect information of a data item displaying in a window for an application program in the user interface. The processor, in response to the input detecting the information of the data item, may control the display screen to display one or more additional windows. The one or more additional windows may provide one or more functions outside of functionality for the application program to process the data item. The one or more functions may be ranked and displayed in the user interface for user selection.

Abstract: A system for Demand Oriented User Interface Framework may include a display screen displaying a user interface, a memory, an input, and a processor to detect information of a data item displaying in a window for an application program in the user interface. The processor, in response to the input detecting the information of the data item, may control the display screen to display one or more additional windows. The one or more additional windows may provide one or more functions outside of functionality for the application program to process the data item. The one or more functions may be ranked and displayed in the user interface for user selection.

Abstract: A packaging structure of an electronic card includes a metal cover, a plastic frame and a printed circuit board. The metal cover is produced by providing a metal plate having a central portion and an edge portion and performing a draft operation on the metal plate such that the edge portion is vertical to the central portion. The plastic frame has a first surface combined with the metal cover. The printed circuit board is combined with a second surface of the plastic frame.

Abstract: An electronic device with a USB storage card disposed therein is disclosed. The electronic device comprises a containing space, a first connector disposed in the containing space, and a USB storage card disposed in the containing space and electrically coupled to the electronic device through the first connector for accessing files in the USB storage card. Therefore the inconvenience and the influence on the structure of the storage card caused by changing the storage card frequently can be avoided. Meanwhile, the risk of losing the storage card is also prevented and the trend of miniaturizing the electronic device and increasing the capacity of the storage card can be conformed by the design of the present invention.

Abstract: A signal adapter for signally connecting a USB storage card and a USB port of an electronic apparatus is disclosed. The signal adapter comprises a casing, a slot for inserting the USB storage card therein, a bridge disposed in the casing and electrically coupled to the USB storage card for transmitting a USB format signal from the USB storage card, and a USB connector electrically coupled to the bridge and being inserted into the USB port of the electronic apparatus for transmitting the USB format signal to the electronic apparatus through the USB port.

Abstract: A packaging process of an electronic card is provided. Firstly, a first embedding operation is performed to embed a first metal cover into a first surface of a plastic frame. Then, a circuit board is placed on the plastic frame. Afterward, a second embedding operation is performed to embed a second metal cover into a second surface of the plastic frame. The circuit board is encapsulated into the plastic frame so as to form an electronic card package. The first metal cover, the plastic frame and the second metal cover are separately formed.

Abstract: A packaging structure of an electronic card includes a metal cover, a plastic frame and a printed circuit board. The metal cover is produced by providing a metal plate having a central portion and an edge portion and performing a draft operation on the metal plate such that the edge portion is vertical to the central portion. The plastic frame has a first surface combined with the metal cover. The printed circuit board is combined with a second surface of the plastic frame.

Abstract: A packaging process of an electronic card is provided. Firstly, a first embedding operation is performed to embed a first metal cover into a first surface of a plastic frame. Then, a circuit board is placed on the plastic frame. Afterward, a second embedding operation is performed to embed a second metal cover into a second surface of the plastic frame. The circuit board is encapsulated into the plastic frame so as to form an electronic card package. The first metal cover, the plastic frame and the second metal cover are separately formed.

Abstract: An automatic package process for a card comprises stamping a metal belt to form two shells without leaving from the metal belt, injection molding two plastic frames onto the metal shells, respectively, and combining the plastic frames together to form a case. A package for a small card comprises two metal shells each having a thickness not larger than 0.15 mm, several stakes thereon and an inner surface coated with an insulator film thereon, and two plastic frames having a thickness not larger than 0.7 and 1.4 mm, respectively, injection molded onto the metal shells and embedding the stakes thereon, wherein the plastic frames are combined together by a glue or sonic welding.

Abstract: A package structure and method for a card comprises respective attachment of first and second conductive covers each having a vertical piece extending on one side thereof with first lateral surface of first and second plastic frames in use of a low temperature adhesive therebetween to form first and second half cases, and combination of the first and second half cases with insertion of another adhesive or sonic welding between second lateral surfaces of the first and second plastic frames. The plastic frame also has an outer surface formed with a recess to accommodate the vertical piece of the conductive cover and an adhesive area on the first lateral surface formed deep into the plastic frame to be coated with the low temperature adhesive in order for the attachment of the conductive cover.

Abstract: A package structure and method for a card comprises respective attachment of first and second conductive covers each having a vertical piece extending on one side thereof with first lateral surface of first and second plastic frames in use of a low temperature adhesive therebetween to form first and second half cases, and combination of the first and second half cases with insertion of another adhesive or sonic welding between second lateral surfaces of the first and second plastic frames. The plastic frame also has an outer surface formed with a recess to accommodate the vertical piece of the conductive cover and an adhesive area on the first lateral surface formed deep into the plastic frame to be coated with the low temperature adhesive in order for the attachment of the conductive cover.

Abstract: A PCMCIA card manufacturing process is disclosed, including the steps of (1) providing a top cover and a bottom cover made of a metal, preferably stainless steel, each of the top cover and bottom cover being provided with a plurality of hooks along two opposite lateral edges, (2) placing the top cover and bottom cover respectively into a first mold and a second mode for injection molding a first frame member on the top cover with the hooks of the top cover embedded in the first frame member and a second frame member on the bottom cover with the hooks of the bottom cover embedded in the second frame member, each of the first and second frame member being provided with at least one notch that match each other to define at least a connector slot, (3) disposing a circuit board between the first and second frame members with the connector thereof received within the connector slot, and (4) jointing the first and second members together, preferably by ultra sonic welding.