Patents by Inventor Hanmin Zhang
Hanmin Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10576421Abstract: The present invention discloses a novel hydrophilic and compressible aerogel as draw agent for purification water in forward osmosis (FO), which belongs to environmental pollution control engineering technical field. The improved performances are obtained by optimizing regeneration process of drawing and producing water by using this aerogel as a draw agent in FO technology. Herein, the aerogel complete avoid the draw solution's reverse diffusion and maintain a higher water flux that compensates for its structure characteristics. Moreover, the regeneration of the draw agent and production water should be accomplished through human compression without a complicated physical and chemical method. Simultaneously, this draw agent presents other advantages of wide raw material sources, low cost, wild preparation process, low poison and good film compatibility. It is an innovation as FO technology in portable water purifying device, especially in areas of military and emergency.Type: GrantFiled: November 30, 2016Date of Patent: March 3, 2020Assignee: DALIAN UNIVERSITY OF TECHNOLOGYInventors: Hanmin Zhang, Mingchuan Yu
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Publication number: 20190001271Abstract: The present invention discloses a novel hydrophilic and compressible aerogel as draw agent for purification water in forward osmosis (FO), which belongs to environmental pollution control engineering technical field. The improved performances are obtained by optimizing regeneration process of drawing and producing water by using this aerogel as a draw agent in FO technology. Herein, the aerogel complete avoid the draw solution's reverse diffusion and maintain a higher water flux that compensates for its structure characteristics. Moreover, the regeneration of the draw agent and production water should be accomplished through human compression without a complicated physical and chemical method. Simultaneously, this draw agent presents other advantages of wide raw material sources, low cost, wild preparation process, low poison and good film compatibility. It is an innovation as FO technology in portable water purifying device, especially in areas of military and emergency.Type: ApplicationFiled: November 30, 2016Publication date: January 3, 2019Inventors: Hanmin ZHANG, Mingchuan YU
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Patent number: 9570325Abstract: A packaged semiconductor device, such as a power QFN device, has (rectangular) ribbon wires, instead of circular bond wires. A proximal end of each ribbon wire is connected to a pad on an IC die, and a distal end of each ribbon wire forms a device lead. The die and the ribbon wires are encapsulated in a molding compound with a side of each device lead exposed. Such devices can be assembled without using lead frames. The omission of lead frames and the use of ribbon wires enable assembly of smaller devices having enhanced thermal dissipation capabilities.Type: GrantFiled: June 15, 2015Date of Patent: February 14, 2017Assignee: FREESCALE SEMICONDUCTOR, INC.Inventors: Liqiang Xu, Qingchun He, Peng Liu, Hanmin Zhang
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Publication number: 20160190086Abstract: A packaged semiconductor device, such as a power QFN device, has (rectangular) ribbon wires, instead of circular bond wires. A proximal end of each ribbon wire is connected to a pad on an IC die, and a distal end of each ribbon wire forms a device lead. The die and the ribbon wires are encapsulated in a molding compound with a side of each device lead exposed. Such devices can be assembled without using lead frames. The omission of lead frames and the use of ribbon wires enable assembly of smaller devices having enhanced thermal dissipation capabilities.Type: ApplicationFiled: June 15, 2015Publication date: June 30, 2016Inventors: LIQIANG XU, QINGCHUN HE, PENG LIU, HANMIN ZHANG
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Publication number: 20150235969Abstract: A semiconductor wafer having multiple dies has a partially metallized backside. After wafer dicing, each of the multiple dies has, on its backside, a metallized area surrounded by a peripheral non-metallization ring. The non-metallization ring allows for easier optical inspection of the dies for determining the extent of any backside chipping caused by the wafer dicing. The peripheral non-metallization rings are generated by not metalizing the areas flanking the saw streets of the wafer.Type: ApplicationFiled: November 24, 2014Publication date: August 20, 2015Inventors: Hanmin Zhang, Qingchun He, Dehong Ye, Fei Zong
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Publication number: 20140103096Abstract: A wire bonding machine and a method for testing wire bond connection s using the wire bonding machine. The method includes providing a semiconductor assembly that has a semiconductor die mounted to a substrate, each of which has bonding pads. The method includes bonding a wire to one of the bonding pads to form a first wire bond. A shear force then is applied to the first wire bond. A fault signal is generated when a sensor detects the first wire bond moving during application of the shear force.Type: ApplicationFiled: April 17, 2013Publication date: April 17, 2014Inventors: Hanmin Zhang, Qingchun He, Liqiang Xu, Fei Zong
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Patent number: 8692134Abstract: An electrical connection includes a first wire bonded to adjacent bond pads proximate to an edge of a die and a second wire having one end bonded to a die bond pad distal to the die edge and a second end bonded to a lead finger of a lead frame or a connection pad of a substrate. The second wire crosses and is supported by the first wire. The first wire acts as a brace that prevents the second wire from touching the edge of the die. The first wire also prevents the second wire from excessive lateral movement during encapsulation.Type: GrantFiled: August 16, 2011Date of Patent: April 8, 2014Assignee: Freescale Semiconductor, Inc.Inventors: Jie Yang, Qingchun He, Hanmin Zhang
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Patent number: 8524529Abstract: An electrical connection includes a first wire having one end stitch bonded to a surface, such as the lead finger of a lead frame or the connection pad of a substrate. A second wire has a first end attached to the surface on a first side of the first wire and a second end attached to the surface on a second, opposing side of the first wire. The second wire acts as a brace that prevents the first wire from lifting off of the surface. If necessary, a third wire can be added that, like the second wire, acts as a brace to prevent the first wire from lifting off of the surface.Type: GrantFiled: June 28, 2011Date of Patent: September 3, 2013Assignee: Freescale Semiconductor, Inc.Inventors: Meiquan Huang, Hejin Liu, Hanmin Zhang
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Publication number: 20120326288Abstract: A method of assembling a semiconductor device includes providing a conductive lead frame panel and selectively half-etching a top side of the lead frame panel to provide a pin pads. A flip chip die is attached and electrically connected to the pin pads and then the lead frame panel and die are encapsulated with molding compound. A second selective half etching step is performed on a backside of the lead frame panel to form a plurality of separate input/output pins. The side walls of each input/output pin include arcuate surfaces in cross-section.Type: ApplicationFiled: June 6, 2012Publication date: December 27, 2012Applicant: FREESCALE SEMICONDUCTOR, INCInventors: Meiquan Huang, Hejin Liu, Zhijie Wang, Dehong Ye, Hanmin Zhang
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Publication number: 20120145446Abstract: An electrical connection includes a first wire bonded to adjacent bond pads proximate to an edge of a die and a second wire having one end bonded to a die bond pad distal to the die edge and a second end bonded to a lead finger of a lead frame or a connection pad of a substrate. The second wire crosses and is supported by the first wire. The first wire acts as a brace that prevents the second wire from touching the edge of the die. The first wire also prevents the second wire from excessive lateral movement during encapsulation.Type: ApplicationFiled: August 16, 2011Publication date: June 14, 2012Applicant: FREESCALE SEMICONDUCTOR, INC.Inventors: Jie YANG, Qingchin He, Hanmin Zhang
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Publication number: 20120077316Abstract: An electrical connection includes a first wire having one end stitch bonded to a surface, such as the lead finger of a lead frame or the connection pad of a substrate. A second wire has a first end attached to the surface on a first side of the first wire and a second end attached to the surface on a second, opposing side of the first wire. The second wire acts as a brace that prevents the first wire from lifting off of the surface. If necessary, a third wire can be added that, like the second wire, acts as a brace to prevent the first wire from lifting off of the surface.Type: ApplicationFiled: June 28, 2011Publication date: March 29, 2012Applicant: FREESCALE SEMICONDUCTOR, INCInventors: Meiquan HUANG, Hejin Liu, Hanmin Zhang