Patents by Inventor Hanna E. Rykowska

Hanna E. Rykowska has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hermetic package having covers and a base providing for direct electrical connection
    Patent number: 5200640
    Abstract: The invention relates to the hermetic packaging of typically one or two dice for high power density applications. The package, which is intended for surface mounting to a heating sinking substrate, is particularly compact. Compactness in surface mount applications is measured as a minimum ratio of package area to die area. In accordance with the invention, compactness is achieved by using a novel vertically developed design in which the electrical connections lie within vertical extensions of the die boundaries giving a package to die ratio of less than 2 to 1.
    Type: Grant
    Filed: August 12, 1991
    Date of Patent: April 6, 1993
    Assignees: Electron Power Inc., General Electric Company
    Inventors: David J. Scheftic, William A. Peterson, John E. Escallier, Hanna E. Rykowska