Patents by Inventor Hannah Kwon

Hannah Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device assembly, device module including the device assembly, and device package including the device module
    Patent number: 12616062
    Abstract: Provided is a device assembly including a substrate for mounting a device thereon, electrodes provided on the substrate to be electrically connected to the device, and an encapsulation provided on the substrate and the electrodes to accommodate and encapsulate the device therein, wherein the substrate and the encapsulation are made of a self-healing polymer (SHP), and wherein the electrodes are made of a conductive polymer composite including the SHP.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: April 28, 2026
    Assignees: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY, RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: In Soo Kim, Donghee Son, Hannah Kwon, Hye Jun Kim, Duhwan Seong, Jinhyun Kim
  • DEVICE ASSEMBLY, DEVICE MODULE INCLUDING THE DEVICE ASSEMBLY, AND DEVICE PACKAGE INCLUDING THE DEVICE MODULE
    Publication number: 20230066491
    Abstract: Provided is a device assembly including a substrate for mounting a device thereon, electrodes provided on the substrate to be electrically connected to the device, and an encapsulation provided on the substrate and the electrodes to accommodate and encapsulate the device therein, wherein the substrate and the encapsulation are made of a self-healing polymer (SHP), and wherein the electrodes are made of a conductive polymer composite including the SHP.
    Type: Application
    Filed: August 22, 2022
    Publication date: March 2, 2023
    Inventors: In Soo KIM, Donghee Son, Hannah Kwon, Hye Jun Kim, Duhwan Seong, Jinhyun Kim