Patents by Inventor Hannes Stahr
Hannes Stahr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230135105Abstract: A method for manufacturing a component carrier includes i) providing a metal layer, in particular a copper layer; ii) forming a film on the metal layer; iii) patterning the film in order to expose a part of the metal layer; iv) carrying out a first etch, thereby thinning the film and removing a further part of the exposed metal layer; and thereafter v) carrying out a second etch, thereby forming at least one metal trace that is spatially separated from the metal layer. A component carrier made by the method is further described.Type: ApplicationFiled: December 28, 2022Publication date: May 4, 2023Inventors: Bettina Schuster, Jonathan Silvano de Sousa, Andreas Zluc, Markus Leitgeb, Hannes Stahr
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Patent number: 11570897Abstract: A component carrier including a stack with a plurality of electrically insulating layer structures and/or a plurality of electrically conductive layer structures, and a component embedded in the stack, wherein at least a portion of a side wall of the component is exposed.Type: GrantFiled: August 1, 2018Date of Patent: January 31, 2023Assignee: AT&S Austria Technologie & Systemtechnik AktiengesellschaftInventors: Bettina Schuster, Jonathan Silvano de Sousa, Andreas Zluc, Markus Leitgeb, Hannes Stahr
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Patent number: 10765005Abstract: A method of manufacturing a component carrier is disclosed. The method includes galvanically depositing at least part of at least one electrically conductive pillar on a component, and inserting the at least one electrically conductive pillar and an electrically insulating layer structure into one another.Type: GrantFiled: October 24, 2018Date of Patent: September 1, 2020Assignee: AT&S Austria Technologie & Systemtechnik AktiengesellschaftInventors: Hannes Stahr, Hannes Voraberger, Andreas Zluc, Bettina Schuster
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Patent number: 10643949Abstract: A component carrier including an electrically insulating core, at least one electronic component embedded in the core, and a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end. The electronic component directly contacts the component contacting end. The wiring contacting end is directly electrically contacted to the wiring structure. The exterior surface portion of the coupling structure has homogeneous ablation properties and surface recesses filled with an electrically conductive wiring structure.Type: GrantFiled: September 4, 2019Date of Patent: May 5, 2020Assignee: AT&S Austria Technologie & Systemtechnik AktiengesellschaftInventor: Hannes Stahr
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Publication number: 20190393155Abstract: A component carrier for carrying electronic components includes an at least partially electrically insulating core, at least one electronic component embedded in the core, and a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end. The at least one electronic component is electrically contacted directly to the component contacting end. At least an exterior surface portion of the coupling structure has homogeneous ablation properties and is patterned so as to have surface recesses filled with an electrically conductive wiring structure, and the wiring contacting end is electrically contacted directly to the wiring structure.Type: ApplicationFiled: September 4, 2019Publication date: December 26, 2019Inventor: Hannes Stahr
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Patent number: 10424541Abstract: A component carrier including an electrically insulating core, at least one electronic component embedded in the core, and a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end. The electronic component directly contacts the component contacting end. The wiring contacting end is directly electrically contacted to the wiring structure. The exterior surface portion of the coupling structure has homogeneous ablation properties and surface recesses filled with an electrically conductive wiring structure.Type: GrantFiled: December 16, 2015Date of Patent: September 24, 2019Assignee: AT&S Austria Technologie & Systemtechnik AktiengesellschaftInventor: Hannes Stahr
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Patent number: 10306750Abstract: A circuit board and a method of manufacturing a circuit board or two circuit boards are illustrated and described. The circuit board includes (a) a dielectric layer with a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto and a layer thickness along a z-direction which is perpendicular with respect to the x-axis and to the y-axis; (b) a metallic layer which is attached to the dielectric layer in a planar manner; and (c) a component which is embedded in the dielectric layer and/or in a dielectric core-layer of the circuit board. The dielectric layer includes a dielectric material which has (i) an elastic modulus E in a range between 1 and 20 GPa and (ii) a coefficient of thermal expansion in a range between 0 and 17 ppm/K along the x-axis and along the y-axis.Type: GrantFiled: December 10, 2015Date of Patent: May 28, 2019Assignee: AT & S Austria Technologie & Systemtechnik AktiengesellschaftInventors: Hannes Stahr, Andreas Zluc, Timo Schwarz, Gerald Weidinger
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Publication number: 20190124772Abstract: A method of manufacturing a component carrier is disclosed. The method includes galvanically depositing at least part of at least one electrically conductive pillar on a component, and inserting the at least one electrically conductive pillar and an electrically insulating layer structure into one another.Type: ApplicationFiled: October 24, 2018Publication date: April 25, 2019Inventors: Hannes Stahr, Hannes Voraberger, Andreas Zluc, Bettina Schuster
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Publication number: 20190045636Abstract: A component carrier including a stack with a plurality of electrically insulating layer structures and/or a plurality of electrically conductive layer structures, and a component embedded in the stack, wherein at least a portion of a side wall of the component is exposed.Type: ApplicationFiled: August 1, 2018Publication date: February 7, 2019Inventors: Bettina Schuster, Jonathan Silvano de Sousa, Andreas Zluc, Markus Leitgeb, Hannes Stahr
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Patent number: 9967972Abstract: A circuit board is described which includes a layer composite with at least one dielectric layer which includes a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto, and which includes a layer thickness along a z-axis which is perpendicular with respect to the x-axis and to the y-axis; and at least one metallic layer which is attached to the dielectric layer in a planar manner. The layer composite along the z-axis is free from a symmetry plane which is oriented in parallel with respect to the xy-plane, and the dielectric layer includes a dielectric material which has an elastic modulus E in a range between 1 and 20 GPa and along the x-axis and along the y-axis a coefficient of thermal expansion in a range between 0 and 17 ppm/K. A method of manufacturing such a circuit board is also described.Type: GrantFiled: December 10, 2015Date of Patent: May 8, 2018Assignee: AT & S Austria Technologie & Systemtechnik AktiengesellschaftInventors: Andreas Zluc, Gerald Weidinger, Mario Schober, Hannes Stahr, Timo Schwarz, Benjamin Gruber
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Publication number: 20170339784Abstract: A circuit board is described which includes a layer composite with at least one dielectric layer which includes a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto, and which includes a layer thickness along a z-axis which is perpendicular with respect to the x-axis and to the y-axis; and at least one metallic layer which is attached to the dielectric layer in a planar manner. The layer composite along the z-axis is free from a symmetry plane which is oriented in parallel with respect to the xy-plane, and the dielectric layer includes a dielectric material which has an elastic modulus E in a range between 1 and 20 GPa and along the x-axis and along the y-axis a coefficient of thermal expansion in a range between 0 and 17 ppm/K. A method of manufacturing such a circuit board is also described.Type: ApplicationFiled: December 10, 2015Publication date: November 23, 2017Inventors: Andreas Zluc, Gerald Weidinger, Mario Schober, Hannes Stahr, Timo Schwarz, Benjamin Gruber
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Publication number: 20170339783Abstract: A circuit board and a method of manufacturing a circuit board or two circuit boards are illustrated and described. The circuit board includes (a) a dielectric layer with a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto and a layer thickness along a z-direction which is perpendicular with respect to the x-axis and to the y-axis; (b) a metallic layer which is attached to the dielectric layer in a planar manner; and (c) a component which is embedded in the dielectric layer and/or in a dielectric core-layer of the circuit board. The dielectric layer includes a dielectric material which has (i) an elastic modulus E in a range between 1 and 20 GPa and (ii) a coefficient of thermal expansion in a range between 0 and 17 ppm/K along the x-axis and along the y-axis.Type: ApplicationFiled: December 10, 2015Publication date: November 23, 2017Inventors: Hannes Stahr, Andreas Zluc, Timo Schwarz, Gerald Weidinger
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Publication number: 20170330837Abstract: A component carrier for carrying electronic components, wherein the component carrier comprises an at least partially electrically insulating core, at least one electronic component embedded in the core, and a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end, wherein the at least one electronic component is electrically contacted directly to the component contacting end, wherein at least an exterior surface portion of the coupling structure has homogeneous ablation properties and is patterned so as to have surface recesses filled with an electrically conductive wiring structure, and wherein the wiring contacting end is electrically contacted directly to the wiring structure.Type: ApplicationFiled: December 16, 2015Publication date: November 16, 2017Inventor: Hannes Stahr
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Patent number: 9182549Abstract: An optical coupling system for coupling a first optical waveguide having a first core surrounded by a first sheath to a second optical waveguide having a second core surrounded by a second sheath. An end face of the first core of the first optical waveguide abuts an end face of the second core of the second optical waveguide at a coupling location and the second core is flush with the first core in the axial direction, wherein, in the region of the coupling location, over at least part of a predetermined axial portion, both the second sheath of the second optical waveguide and the first sheath of the first optical waveguide together form a cladding of the optical waveguide in the predetermined portion.Type: GrantFiled: April 4, 2012Date of Patent: November 10, 2015Assignees: Rosenberger-OSI GmbH & CO. OHG, AT&S AGInventors: Clemens Wurster, Gregor Langer, Stefan Schmidt, Hannes Stahr
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Publication number: 20140050442Abstract: An optical coupling system for coupling a first optical waveguide having a first core surrounded by a first sheath to a second optical waveguide having a second core surrounded by a second sheath. An end face of the first core of the first optical waveguide abuts an end face of the second core of the second optical waveguide at a coupling location and the second core is flush with the first core in the axial direction, wherein, in the region of the coupling location, over at least part of a predetermined axial portion, both the second sheath of the second optical waveguide and the first sheath of the first optical waveguide together form a cladding of the optical waveguide in the predetermined portion.Type: ApplicationFiled: April 4, 2012Publication date: February 20, 2014Applicants: AT&S AG, ROSENBERGER-OSI GMBH & CO. OHGInventors: Clemens Wurster, Gregor Langer, Stefan Schmidt, Hannes Stahr