Abstract: A new manufacturing method is described by the present invention for a new LED module 1. The method comprises mounting of at least one LED 3 onto a surface of a substrate 2, and depositing a base layer 5 to cover said substrate 2 surface and the LED 3, wherein the base layer 5 is transparent for visible light and preferably does not comprise phosphor particles. Optionally, a first heat treatment to modify the surface properties of the base layer 5 is comprised. The method further comprises dispensing a matrix material, so that it forms an essentially half-spherical cover covering the LED and optionally nearby portions of the base layer, and optionally, a second heat treatment to harden the half-spherical cover layer. Additionally the present invention discloses an LED module 1, which is manufactured by the claimed method.