Abstract: A component carrier includes a base structure and an electrically conductive wiring structure on the base structure. The wiring structure has a nonrectangular cross-sectional shape configured so that an adhesion promoting constriction is formed by at least one of the group consisting of the wiring structure and a transition between the base structure and the wiring structure.

Abstract: A manufacturing method of manufacturing a constituent for a component carrier, wherein the method comprises providing an electrically conductive structure, forming a highly thermally conductive and electrically insulating or semiconductive structure on the electrically conductive structure, subsequently, and attaching a thermally conductive and electrically insulating structure, having a lower thermal conductivity than the highly thermally conductive and electrically insulating or semiconductive structure, on an exposed surface of the highly thermally conductive and electrically insulating or semiconductive structure.

Abstract: A method of manufacturing a component carrier is disclosed. The method includes galvanically depositing at least part of at least one electrically conductive pillar on a component, and inserting the at least one electrically conductive pillar and an electrically insulating layer structure into one another.

Abstract: A method of manufacturing a printed circuit board or a subassembly thereof comprises the following steps: providing at least two elements (1, 3) of insulating material coupling or connecting the elements (1, 3) of insulating material on at least one adjacent side surface covering the elements (1, 3) of insulating material with a layer (4) of conductive material on at least one surface building up at least one further layer (5, 6, 7, 8) of the printed circuit board (10) at least partly on the elements (1, 3) of insulating material, wherein the elements (1, 3) of insulating material are made of insulating material having different mechanical, chemical or physical properties. Furthermore a printed circuit board (10) or sub-assembly thereof is provided.

Abstract: A method of manufacturing a printed circuit board or a sub-assembly thereof comprises the following steps: providing at least two elements (1, 3) of insulating material coupling or connecting the elements (1, 3) of insulating material on at least one adjacent side surface covering the elements (1, 3) of insulating material with a layer (4) of conductive material on at least one surface building up at least one further layer (5, 6, 7, 8) of the printed circuit board (10) at least partly on the elements (1, 3) of insulating material, wherein the elements (1, 3) of insulating material are made of insulating material having different mechanical, chemical or physical properties. Furthermore a printed circuit board (10) or sub-assembly thereof is provided.

Abstract: An electric device includes a first structure, a second structure, and a deformed layer. The deformed layer includes a dielectric matrix and electrically conductive elements formed therein. The deformed layer is arranged to electrically couple the first structure with the second structure.

Abstract: A component carrier includes a base structure and an electrically conductive wiring structure on the base structure. The wiring structure has a nonrectangular cross-sectional shape configured so that an adhesion promoting constriction is formed by at least one of the group consisting of the wiring structure and a transition between the base structure and the wiring structure.

Abstract: A manufacturing method of manufacturing a constituent for a component carrier, wherein the method comprises providing an electrically conductive structure, forming a highly thermally conductive and electrically insulating or semiconductive structure on the electrically conductive structure, subsequently, and attaching a thermally conductive and electrically insulating structure, having a lower thermal conductivity than the highly thermally conductive and electrically insulating or semiconductive structure, on an exposed surface of the highly thermally conductive and electrically insulating or semiconductive structure.

Abstract: A component carrier includes a base structure and an electrically conductive wiring structure on the base structure. The wiring structure has a nonrectangular cross-sectional shape configured so that an adhesion promoting constriction is formed by at least one of the group consisting of the wiring structure and a transition between the base structure and the wiring structure.

Abstract: A method of manufacturing a component carrier is disclosed. The method includes galvanically depositing at least part of at least one electrically conductive pillar on a component, and inserting the at least one electrically conductive pillar and an electrically insulating layer structure into one another.

Abstract: A component carrier includes a base structure and an electrically conductive wiring structure on the base structure. The wiring structure has a nonrectangular cross-sectional shape configured so that an adhesion promoting constriction is formed by at least one of the group consisting of the wiring structure and a transition between the base structure and the wiring structure.

Abstract: A method of manufacturing a printed circuit board or a sub-assembly thereof comprises the following steps: providing at least two elements (1, 3) of insulating material coupling or connecting the elements (1, 3) of insulating material on at least one adjacent side surface covering the elements (1, 3) of insulating material with a layer (4) of conductive material on at least one surface building up at least one further layer (5, 6, 7, 8) of the printed circuit board (10) at least partly on the elements (1, 3) of insulating material, wherein the elements (1, 3) of insulating material are made of insulating material having different mechanical, chemical or physical properties. Furthermore a printed circuit board (10) or sub-assembly thereof is provided.

Abstract: A method of manufacturing a printed circuit board or a sub-assembly thereof by coupling at least two elements of insulating materials with different properties on adjacent side surfaces and covering the elements with a layer of conductive material and building up at least one further layer at least partly overlapping the at least two elements.

Abstract: A method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof comprises the following steps: providing a layer of rigid insulating material removing at least one area of the rigid insulating material inserting a flexible insulating material into the removed or cut-out area(s) of the rigid insulating material covering the rigid and flexible insulating material with a layer of conductive material on at least one surface building up at least one further layer of the rigid-flex printed circuit board at least on the rigid part(s) of the insulating material, wherein the at least one further layer of the rigid-flex printed circuit board is partly overlapping the flexible area(s) of the insulating material. Furthermore a rigid-flex printed circuit board or sub-assembly thereof is provided.

Abstract: A method of manufacturing a printed circuit board or a sub-assembly thereof comprises the following steps: providing at least two elements of insulating material coupling or connecting the elements of insulating material on at least one adjacent side surface covering the elements of insulating material with a layer of conductive material on at least one surface building up at least one further layer of the printed circuit board at least partly on the elements of insulating material, wherein the elements of insulating material are made of insulating material having different mechanical, chemical or physical properties. Furthermore a printed circuit board or sub-assembly thereof is provided.

Abstract: A method for fixing an electronic component on a printed circuit board, and contact-connecting the electronic component to the printed circuit board, the following steps are provided:—providing the printed circuit board having a plurality of contact and connection pads,—providing the electronic component having a number of contact and connection locations corresponding to the plurality of contact and connection pads, with a mutual spacing reduced in comparison with the spacing of the contact and connection pads, and—arranging or forming at least one interlayer for routing the contact and connection locations of the electronic component between the contact and connection pads and the contact and connection locations of the electronic component. A method for producing an interlayer for routing and a system having a printed circuit board and an electronic component using the interlayer for routing are also provided.

Abstract: The invention relates to an optical sensor device (1) comprising a substrate (2) on which at least one light source (4), such as an LED, is arranged, from which at least one optical waveguide (7) leads to at least one receiver (5), such as a photodiode, to which an evaluating unit (6) is connected, wherein the optical waveguide (7) is accessible in a sensor region (8) for a change of the evanescent field of the optical waveguide present there; an optical layer (3) made of material that can be photopolymerized is applied to the substrate (2), wherein the optical waveguide (7) is structured by an exposure process in said optical layer, wherein the optical waveguide (7) is led to the surface (9) of the optical layer (3) in the sensor region (8).

Abstract: In a method for improving the corrosion resistance of an electronic component, particularly of conductors of a printed circuit board, wherein after the conductors are produced out of copper a further treatment follows, the conductors are subjected to a pretreatment prior to the further treatment, wherein ions or ion impurities present on the surface of the conductors are removed by a purifying treatment and/or treated with at least one complexing composition, whereby the production of conductors and/or printed circuit boards having improved corrosion resistance, particularly when used in surroundings having higher moisture and optionally higher temperatures, becomes possible.

Abstract: In a method for fixing an electronic component (3) on a printed circuit board (2), and contact-connecting the electronic component (3) to the printed circuit board (2), the following steps are provided: —providing the printed circuit board (2) having a plurality of contact and connection pads (8), —providing the electronic component (3) having a number of contact and connection locations (5) corresponding to the plurality of contact and connection pads (8) of the printed circuit board (2), with a mutual spacing reduced in comparison with the spacing of the contact and connection pads (8) of the printed circuit board (2), and —arranging or forming at least one interlayer (4) for routing the contact and connection locations (5) of the electronic component (3) between the contact and connection pads (8) of the printed circuit board (2) and the contact and connection locations (5) of the electronic component (3).