Abstract: A method of producing a semiconductor device is provided. The method includes: providing a semiconductor wafer, the wafer including an upper layer of a semiconductor material, an inner etch stop layer and a lower layer; forming a plurality of functional areas in the upper layer; performing a selective first etch process on the upper layer so as to separate the plurality of functional areas from each other by trenches etched through the upper layer, the first etch process being substantially stopped by the inner etch stop layer; and removing the lower layer by a second etch process, the second etch process being substantially stopped by the inner etch stop layer.

Abstract: A patient support apparatus is provided. The patient support apparatus may be used as an operating table apparatus for a neurosurgical intervention. The patient support apparatus includes a support couch and a transfer plate which may be moved relative to the support couch, wherein the transfer plate is designed to support a patient for the neurosurgical intervention, wherein the patient support apparatus includes a holding unit with a support shell, which is designed to support a head of the patient and/or a surgical head restraint unit, and a fastening unit for fastening the holding unit to the patient support apparatus.

Abstract: A method of forming a thinned encapsulated chip structure, wherein the method comprises providing a separation structure arranged within an electronic chip, encapsulating part of the electronic chip by an encapsulating structure, and thinning selectively the electronic chip partially encapsulated by the encapsulating structure so that the encapsulating structure remains with a larger thickness than the thinned electronic chip, wherein the separation structure functions as a thinning stop.

Abstract: A method for manufacturing a chip arrangement is provided, the method including: forming a hole in a carrier including at least one chip, wherein forming a hole in the carrier includes: selectively removing carrier material, thereby forming a cavity in the carrier, forming passivation material over one or more cavity walls exposed by the selective removal of the carrier material; selectively removing a portion of the passivation material and further carrier material exposed by the selective removal of the passivation material, wherein a further portion of the passivation material remains over at least one cavity side wall; the method further including subsequently forming a layer over the further portion of passivation material remaining over the at least one cavity side wall.

Abstract: A method of thinning a wafer includes thinning the wafer using a grinding process. The wafer, after the grinding processing, has a first non-uniformity in thickness. The thinned wafer is etched using a plasma process. The wafer after the etching processing has a second non-uniformity in thickness. The second non-uniformity is less than the first non-uniformity.

Abstract: Disclosed is a patient support apparatus having a patient support couch, a moveable support plate for supporting a patient, a surgical head fastening unit for fastening a head of the patient in an examination position and/or in an operation position. The patient support apparatus includes a marker unit for marking a maximum occupancy area for the surgical head fastening unit.

Abstract: A method of producing a semiconductor device is provided. The method includes: providing a semiconductor wafer, the wafer including an upper layer of a semiconductor material, an inner etch stop layer and a lower layer; forming a plurality of functional areas in the upper layer; performing a selective first etch process on the upper layer so as to separate the plurality of functional areas from each other by trenches etched through the upper layer, the first etch process being substantially stopped by the inner etch stop layer; and removing the lower layer by a second etch process, the second etch process being substantially stopped by the inner etch stop layer.

Abstract: A method of processing a plurality of packaged electronic chips being connected to one another in a common substrate is provided, wherein the method comprises etching the electronic chips, detecting information indicative of an at least partial removal of an indicator structure following an exposure of the indicator structure embedded within at least a part of the electronic chips and being exposed after the etching has removed chip material above the indicator structure, and adjusting the processing upon detecting the information indicative of the at least partial removal of the indicator structure.

Abstract: In a method and medical imaging system to prepare an interventional and/or diagnostic imaging procedure to be conducted with at least two different medical imaging modalities of the system, a patient is positioned on a patient support device and the patient support device, together with the patient, are moved into a patient acquisition region of a first medical imaging modality of the system. A first image data set of the patient to be examined is acquired with the first medical imaging modality. The first image data set is automatically evaluated in a data evaluation unit. At least patient parameter is automatically calculated from the evaluated first image data set. At least one compatibility value is automatically calculated depending on the at least one patient parameter and depending on at least one apparatus parameter of at least one additional medical imaging modality in the system.

Abstract: A method for manufacturing a chip arrangement is provided, the method including: forming a hole in a carrier including at least one chip, wherein forming a hole in the carrier includes: selectively removing carrier material, thereby forming a cavity in the carrier, forming passivation material over one or more cavity walls exposed by the selective removal of the carrier material; selectively removing a portion of the passivation material and further carrier material exposed by the selective removal of the passivation material, wherein a further portion of the passivation material remains over at least one cavity side wall; the method further including subsequently forming a layer over the further portion of passivation material remaining over the at least one cavity side wall.

Abstract: A method of forming a thinned encapsulated chip structure, wherein the method comprises providing a separation structure arranged within an electronic chip, encapsulating part of the electronic chip by an encapsulating structure, and thinning selectively the electronic chip partially encapsulated by the encapsulating structure so that the encapsulating structure remains with a larger thickness than the thinned electronic chip, wherein the separation structure functions as a thinning stop.

Abstract: A method for manufacturing a chip arrangement is provided, the method including: forming a hole in a carrier including at least one chip, wherein forming a hole in the carrier includes: selectively removing carrier material, thereby forming a cavity in the carrier, forming passivation material over one or more cavity walls exposed by the selective removal of the carrier material; selectively removing a portion of the passivation material and further carrier material exposed by the selective removal of the passivation material, wherein a further portion of the passivation material remains over at least one cavity side wall; the method further including subsequently forming a layer over the further portion of passivation material remaining over the at least one cavity side wall.

Abstract: A method of processing a plurality of packaged electronic chips being connected to one another in a common substrate is provided, wherein the method comprises etching the electronic chips, detecting information indicative of an at least partial removal of an indicator structure following an exposure of the indicator structure embedded within at least a part of the electronic chips and being exposed after the etching has removed chip material above the indicator structure, and adjusting the processing upon detecting the information indicative of the at least partial removal of the indicator structure.

Abstract: A patient support apparatus is provided. The patient support apparatus has a patient table, a movable support plate for supporting a patient, a guide unit, which is designed to guide the support plate along at least one movement direction of the support plate, and a fastening unit for fastening an auxiliary unit to the support plate. The fastening unit has at least one setting unit for setting the position of the auxiliary unit in relation to the support plate in a flexible manner.

Abstract: In a method and medical imaging system to prepare an interventional and/or diagnostic imaging procedure to be conducted with at least two different medical imaging modalities of the system, a patient is positioned on a patient support device and the patient support device, together with the patient, are moved into a patient acquisition region of a first medical imaging modality of the system. A first image data set of the patient to be examined is acquired with the first medical imaging modality. The first image data set is automatically evaluated in a data evaluation unit. At least patient parameter is automatically calculated from the evaluated first image data set. At least one compatibility value is automatically calculated depending on the at least one patient parameter and depending on at least one apparatus parameter of at least one additional medical imaging modality in the system.

Abstract: A patient support apparatus, in particular for a medical imaging apparatus, has a table for supporting a patient, and a support unit, wherein the table is arranged at the support unit such that the table may be displaced along a longitudinal extension of the support unit. Further, the patient support apparatus has a protective wall element which closes off a region for receiving fluids on the table and/or on the support unit in a fluid-tight manner.

Abstract: A method for manufacturing a chip arrangement is provided, the method including: forming a hole in a carrier including at least one chip, wherein forming a hole in the carrier includes: selectively removing carrier material, thereby forming a cavity in the carrier, forming passivation material over one or more cavity walls exposed by the selective removal of the carrier material; selectively removing a portion of the passivation material and further carrier material exposed by the selective removal of the passivation material, wherein a further portion of the passivation material remains over at least one cavity side wall; the method further including subsequently forming a layer over the further portion of passivation material remaining over the at least one cavity side wall.

Abstract: A description is given of a method. In one embodiment the method includes providing a semiconductor chip with semiconductor material being exposed at a first surface of the semiconductor chip. The semiconductor chip is placed over a carrier with the first surface facing the carrier. An electrically conductive material is arranged between the semiconductor chip and the carrier. Heat is applied to attach the semiconductor chip to the carrier.

Abstract: A patient support apparatus is provided. The patient support apparatus may be used as an operating table apparatus for a neurosurgical intervention. The patient support apparatus includes a support couch and a transfer plate which may be moved relative to the support couch, wherein the transfer plate is designed to support a patient for the neurosurgical intervention, wherein the patient support apparatus includes a holding unit with a support shell, which is designed to support a head of the patient and/or a surgical head restraint unit, and a fastening unit for fastening the holding unit to the patient support apparatus.

Abstract: Disclosed is a patient support apparatus having a patient support couch, a moveable support plate for supporting a patient, a surgical head fastening unit for fastening a head of the patient in an examination position and/or in an operation position. The patient support apparatus includes a marker unit for marking a maximum occupancy area for the surgical head fastening unit.