Patents by Inventor Hannu Luoma

Hannu Luoma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mechanically embedded heating element
    Patent number: 9618973
    Abstract: Methods and apparatus relating to provision and/or utilization of a mechanically embedded heating element are described. An embodiment includes a heating element which is thermally coupled to an adhesive. The adhesive bonds a first item and a second item. The heating element is capable of being heated in response to application of power and the heated heating element causes the release of a bond by the adhesive to allow for physical separation of the first item and the second item. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: April 11, 2017
    Assignee: Intel Corporation
    Inventors: Remi Bergmann, Erkki Nokkonen, Juha Paavola, Hannu Luoma, Kari Vallius
  • MECHANICALLY EMBEDDED HEATING ELEMENT
    Publication number: 20160378140
    Abstract: Methods and apparatus relating to provision and/or utilization of a mechanically embedded heating element are described. An embodiment includes a heating element which is thermally coupled to an adhesive. The adhesive bonds a first item and a second item. The heating element is capable of being heated in response to application of power and the heated heating element causes the release of a bond by the adhesive to allow for physical separation of the first item and the second item. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: June 26, 2015
    Publication date: December 29, 2016
    Applicant: Intel Corporation
    Inventors: Remi Bergmann, Erkki Nokkonen, Juha Paavola, Hannu Luoma, Kari Vallius