Abstract: Described herein are diffraction gratings and methods for the manufacture thereof. One method comprises applying a force to a substrate to strain the substrate, disposing a thin film on at least a portion of the substrate, and reducing the force applied to the substrate, thereby causing the thin film to buckle.

Abstract: Disclosed herein are articles and methods useful for the lithographic applications. The articles comprise a wrinkling structure and a photosensitive material. The articles and methods provide low cost alternatives to conventional lithographic applications. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

Abstract: Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.

Abstract: A flexible silicon anode includes a flexible substrate, a layer of silicon with a thickness of 1 ?m or less adhered to the flexible substrate, and a current collector in contact with the layer of silicon. A lithium ion battery cell includes a flexible silicon anode, a current collector in contact with the layer of silicon; a lithium cathode; a separator between the silicon anode and the lithium cathode; an electrolyte in contact with the silicon anode and the lithium cathode; and an electrical connection between the silicon anode and the lithium cathode. Forming the flexible silicon anode can include etching a silicon-on-insulator structure to form a silicon layer on the silicon substrate, treating the silicon layer, contacting the treated silicon layer with a flexible substrate, and separating the flexible substrate and the silicon substrate, thereby transferring the treated silicon layer from the silicon substrate to the flexible substrate.

Abstract: Described herein are diffraction gratings and methods for the manufacture thereof. One method comprises applying a force to a substrate to strain the substrate, disposing a thin film on at least a portion of the substrate, and reducing the force applied to the substrate, thereby causing the thin film to buckle.

Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

Abstract: Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.

Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.