Patents by Inventor Hans Bell
Hans Bell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8518157Abstract: Disclosed is a device for purifying a process gas in a reflow soldering system. Said device comprises a receptacle that contains at least one packing bed. The process gas is fed to the receptacle via a gas inlet while being discharged from the receptacle after penetrating the packing bed. The inventive device further comprises an apparatus for delivering a liquid fluid to the receptacle. Secondary materials of the soldering process in the reflow soldering system can be absorbed by the liquid fluid and thus be eliminated from the process gas. Secondary materials and/or droplets and vapors of the fluid can additionally be absorbed and adsorbed on the surface of the packing.Type: GrantFiled: February 20, 2006Date of Patent: August 27, 2013Assignee: Rehm Thermal Systems GmbHInventors: Hans Bell, Jürgen Felgner, Ralf Heidenreich
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Patent number: 7581668Abstract: According to one aspect of the invention it is possible to rapidly heat a soldering item by reducing an initially larger volume flow at a constant or increasing temperature, effectively preventing small components from overheating. By using the volume flow of a convection heater to control effective heat transmission occurring on said soldering item, it is also possible to adapt the soldering process in an extremely flexible manner to special process requirements by virtue of the fact that adjustment of a modified volume flow can be controlled in a very quick and precise manner.Type: GrantFiled: October 29, 2004Date of Patent: September 1, 2009Assignee: Rehm Thermal Systems GmbHInventor: Hans Bell
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Publication number: 20090188967Abstract: A method is provided for a soldering process. The method can include receiving a liquid phase heat transfer medium at a preheating container. The heat transfer medium can be received from an external supply. The method can also include heating the heat transfer medium to or above a predefined temperature that maintains the liquid phase and directing the heated heat transfer medium from the preheating container to an evaporation container. In the evaporation container, the heat transfer medium can be vaporized to convert the heat transfer medium from the liquid phase to a gas phase. Further, the method can include directing the gas phase heat transfer medium from the evaporation container to a solder chamber. The soldering process occurs in the solder chamber.Type: ApplicationFiled: April 3, 2009Publication date: July 30, 2009Applicant: Rehm Anlagenbau GmbHInventors: Hans BELL, Wilfried Kolb
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Publication number: 20080276801Abstract: Disclosed is a device for purifying a process gas in a reflow soldering system. Said device comprises a receptacle that contains at least one packing bed. The process gas is fed to the receptacle via a gas inlet while being discharged from the receptacle after penetrating the packing bed. The inventive device further comprises an apparatus for delivering a liquid fluid to the receptacle. Secondary materials of the soldering process in the reflow soldering system can be absorbed by the liquid fluid and thus be eliminated from the process gas. Secondary materials and/or droplets and vapors of the fluid can additionally be absorbed and adsorbed on the surface of the packing.Type: ApplicationFiled: February 20, 2006Publication date: November 13, 2008Applicant: Rehm Anlagenbau GmbHInventors: Hans Bell, Jurgen Felgner, Ralf Heidenreich
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Publication number: 20080061116Abstract: According to one aspect of the invention it is possible to rapidly heat a soldering item by reducing an initially larger volume flow at a constant or increasing temperature, effectively preventing small components from overheating. By using the volume flow of a convection heater to control effective heat transmission occurring on said soldering item, it is also possible to adapt the soldering process in an extremely flexible manner to special process requirements by virtue of the fact that adjustment of a modified volume flow can be controlled in a very quick and precise manner.Type: ApplicationFiled: October 29, 2004Publication date: March 13, 2008Applicant: REHM ANLAGENBAU GmbHInventor: Hans Bell
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Publication number: 20050242163Abstract: Thermodynamic fluctuations caused conventionally during introduction of a relatively cold liquid into the vapor generator can be reduced considerably or eliminated by providing a preheating region, so that the necessary amount of vapor can be provided in a substantially continuous manner. Vapor generation can here be controlled on the basis of the vapor pressure in the evaporation region, wherein advantageously during operation of a soldering system the pressure in the corresponding process chamber can also be used for control in such a manner that there is always a pressure gradient and additional conveying means, such as pumps for the vapor supply, can thereby be avoided.Type: ApplicationFiled: April 20, 2005Publication date: November 3, 2005Applicant: Rehm Anlagenbau GmbHInventors: Hans Bell, Wilfried Kolb
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Patent number: 6484926Abstract: The present invention relates to a vapor phase reflow system comprising at least one soldering zone and a process zone, a primary liquid reservoir containing a primary liquid, the vapor phase reflow system further comprising a heating means for converting the primary liquid into the vapor phase. The system is characterized in that primary liquid or the vapor thereof or both can be introduced by means of a primary-liquid fluid line into a soldering-zone heating module in fluid communication with the soldering zone and into a process-zone heating module in fluid communication with the process zone, the heating capacity of the soldering-zone heating module and of the process-zone heating module being adjustable independently of each other to thereby generate superheated vapor based on the zones. Furthermore, the invention relates to a method for operating a vapor phase reflow system.Type: GrantFiled: May 8, 2001Date of Patent: November 26, 2002Assignee: Rehm Anlagenbau GmbH + Co. KGInventor: Hans Bell
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Publication number: 20020007565Abstract: The present invention relates to a vapor phase reflow system comprising at least one soldering zone and a process zone, a primary liquid reservoir containing a primary liquid, the vapor phase reflow system further comprising a heating means for converting the primary liquid into the vapor phase. The system is characterized in that primary liquid or the vapor thereof or both can be introduced by means of a primary-liquid fluid line into a soldering-zone heating module in fluid communication with the soldering zone and into a process-zone heating module in fluid communication with the process zone, the heating capacity of the soldering-zone heating module and of the process-zone heating module being adjustable independently of each other to thereby generate superheated vapor based on the zones. Furthermore, the invention relates to a method for operating a vapor phase reflow system.Type: ApplicationFiled: May 8, 2001Publication date: January 24, 2002Inventor: Hans Bell
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Patent number: 5320271Abstract: A splash protector assembly for printed wiring boards includes splash protector rails for permitting printed wiring boards to be coupled together without additional aids as they are conveyed in a given conveying direction across different conveying planes through soldering machines. The splash protector rails include successive front and rear splash protector rails as seen in the given conveying direction. Each of the splash protector rails are L-shaped and define a longer leg being in an upright position during use, and a shorter leg. Each of the splash protector rails have springs for clamping the printed wiring boards. The longer leg of the rear splash protector rail has hooks and the longer leg of the front splash protector has braces for hanging the rear splash protector rail from the front splash protector rail of the next printed wiring board, and the braces prevent the printed wiring boards from becoming unhung as they are conveyed across meeting points of the different conveying planes.Type: GrantFiled: March 25, 1993Date of Patent: June 14, 1994Assignee: DeTeWe-Deutsche Telephonwerke AG&Co.Inventors: Hans Bell, Raimund Exner