Abstract: The present invention is directed to an arrangement for forming one or more separated scores in a surface of a substrate. The arrangement comprises a laser for providing a laser beam, optical guiding means for guiding said laser beam to said surface of said substrate, means for moving said substrate relative to said laser beam in at least one cutting direction for forming said scores, and primary splitting means for splitting said laser beam into a plurality of primary cutting beams for forming said scores parallel to each other. Said primary splitting means are arranged for moving said primary cutting beams relative to each other for adjusting the separation between said parallel scores. The invention is further related to a method for forming one or more separated scores in a surface of a substrate.

Abstract: The present invention relates generally to a method of and arrangement treating a substrate processed using a laser beam, wherein said substrate comprises at least a body of semiconductor material. The method comprises a step of etching said substrate for removing from said body of semiconductor material recast material deposited on said body during said laser processing. In particular, the step of etching is controlled for removing at least a part of said semiconductor material of said body for improving mechanical strength of said substrate.

Abstract: The present invention is directed to an arrangement for forming one or more separated scores in a surface of a substrate. The arrangement comprises a laser for providing a laser beam, optical guiding means for guiding said laser beam to said surface of said substrate, means for moving said substrate relative to said laser beam in at least one cutting direction for forming said scores, and primary splitting means for splitting said laser beam into a plurality of primary cutting beams for forming said scores parallel to each other. Said primary splitting means are arranged for moving said primary cutting beams relative to each other for adjusting the separation between said parallel scores. The invention is further related to a method for forming one or more separated scores in a surface of a substrate.