Abstract: A method and an optical fiber access unit in which a fiber is optically connected to a transmitter and/or receiver chip. Said chip is in turn connected to an electronic circuit for signal processing and said circuit is connected to a coupling port for distributing signals to and from said circuit and fiber. A fiber ferrule module is formed by an optical fiber and a casing surrounding the fiber except for its two ends that are prepared to form optical interfaces. A transmitter/receiver chip module is arranged for optical connection to a first access end of the fiber ferrule module and a fiber access part is provided for optical connection at a second access end of the fiber ferrule module. A support unit is finally arranged for assembling the fiber ferrule module, the transmitter/receiver chip module and the electronic circuit.

Abstract: A method and an optical fiber access unit in which a fiber is optically connected to a transmitter and/or receiver chip. Said chip is in turn connected to an electronic circuit for signal processing and said circuit is connected to a coupling port for distributing signals to and from said circuit and fiber. A fiber ferrule module is formed by an optical fiber and a casing surrounding the fiber except for its two ends that are prepared to form optical interfaces. A transmitter/receiver chip module is arranged for optical connection to a first access end of the fiber ferrule module and a fiber access port is provided for optical connection at a second access end of the fiber ferrule module. A support unit is finally arranged for assembling the fiber ferrule module, the transmitter/receiver chip module and the electronic circuit.

Abstract: An opto-mechanical interface apparatus includes an optical hybrid, an electronic hybrid adapted to receive electronic components, an adapter fixture for fixing the electronic hybrid and the optical hybrid to one another to form a combined hybrid, a lower-capsule part, and an upper-capsule part adapted to mate with the lower-capsule part. Mating of the upper-capsule part and the lower-capsule part encloses at least part of the combined hybrid. The apparatus forms an opto-mechanical interface for making external optical connection(s).

Abstract: A plastic encapsulated optomodule is provided which includes a leadframe, an optoelectric component, an electric component, and an optical connection interface integrated in the capsule. The electric component is connected electrically to the leadframe. The electric component and the optoelectric component are mutually connected electrically and the optoelectric component and the integrated connection interface are connected together via at least one optical waveguide. The electric component is provided on a first part of the leadframe and electric contact surfaces (80) are provided on leads (5a and 5b) in the leadframe (1). The optoelectric component is provided on a second part of the leadframe and the optical connection interface arranged on an optodevice is connected to a third part of the leadframe. The optodevice is aligned by alignment elements provided on the leadframe and the leadframe includes alignment elements that conform with corresponding alignment elements on a plastic-encapsulation mold tool.

Abstract: In manufacturing an encapsulated optocomponent, the optocomponent is embedded in a plastics material. The optocomponent has guide grooves on one of its surfaces in which guide pins are to extend so that the encapsulated optocomponent will obtain an optical interface of standard type. For the encapsulating operation guide pins are placed in a mold cavity in a mold half and the optocomponent is placed in the cavity in the mold, so that the guide pins are engaged in the guide grooves and ar accurately inserted therein. To achieve this effect, a resilient or elastic force such as from plunger is applied to the other side of the optocomponent, so that it is pressed with some force against the guide pins. The cavity in the mold is then closed by placing a second mold half on top after which the encapsulating material can be introduced in the closed cavity in the mold.

Abstract: The present invention relates to an optical connection means arranged in order to rearrange and connect optical fibers connected to the connection means. In order to simplify handling of optical fiber ribbons, so-called fiber ribbons, an optical connection means with an integrated cross-connection (2) has been produced with which component optical fibers (3) connected to the component can be rearranged such as cross-connected and connected via an interface (4). With an optical cross-connection of the “sidings” type integrated with a so-called MT-connector interface from for example a four-fiber transmitter array and a four-fiber receiver array an eight-fiber MT-connector interface with alternate transmitter respective receiver fibers next to each other can be obtained.

Abstract: In manufacturing an encapsulated optocomponent, the optocomponent is embedded in a plastics material. The optocomponent has guide grooves on one of its surfaces in which guide pins are to extend so that the encapsulated optocomponent will obtain an optical interface of standard type. For the encapsulating operation guide pins are placed in a mold cavity of a mold half and the optocomponent is placed in the cavity of the mold, so that the guide pins are engaged in the guide grooves and are accurately inserted therein. To achieve this effect, a resilient or elastic force, such as from a plunger, is applied to the other side of the optocomponent, so that it is pressed with some force against the guide pins. The cavity in the mold is then closed by placing a second mold half on top after which the encapsulating material can be introduced in the closed cavity of the mold.

Abstract: The present invention relates to a method and a device for aligning wave guides such as optical fibers on a carrier. In order to fix the wave guide such as optical fibers on a carrier made of e.g., silicon, adhesive and a lid have been used, wherein the optical fibers have been placed in grooves on the carrier and the adhesive supplied to capillaries between the optical fibers in the grooves on the carrier and the attached lid, whereby a fixation of the optical fibers on the carrier has been obtained. In order to improve the adhesive penetration and to minimise the risk for air bubbles being formed between the carrier and the lid the lid has been formed divided comprised of for example two ribs (14,15) arranged in parallel. The ribs when fastened onto the carrier will form two short capillaries between the ribs and the carrier with the optical fibers whereby it becomes easier to introduce the adhesive between the ribs and the optical fibers on the carrier and the adhesive will be able to be ventilated better.

Abstract: At a signal transmission rate of 1 Gb/s, the "bit time" is 1 ns. This corresponds to a bit length in an optical fibre of 0.2 m. In view of the fact that skew shall not exceed one-tenth of a bit length, this means that length differences between different conductors in a transmission line may not exceed 2 cm. With the intention of minimizing the skew that would thus otherwise occur in a transmission line, the transmission line (1) and its conductors (2) have been joined to form a ribbon cable or flat cable where the length difference (5) between different conductors (2) in the transmission line does not exceed 2 cm. By providing transmission lines, such as rolled-up flat ribbon cables for instance, which have been previously cut to precise and appropriate lengths, such as lengths of 10, 20, 30 m for instance, with a largest length deviation between different conductors of .+-.1 cm, skew can be minimized when using the cables.

Abstract: In encapsulating an optocomponent with a plastics material, an MT-connector compatible interface is obtained having bores for guide pins in the wall of the capsule and optical connection surfaces. These bores are obtained from mold cavity guide pins that are used for aligning the optocomponent in a mold cavity in a mold in the molding operation of the encapsulating material on top of the component. In order to achieve a good accuracy in the positioning of the component during the molding operation, the mold guide pins are as short as possible and end directly behind the component where they are supported by projections extending from each mold half. Thus, cavities are created extending straight through the capsule behind the component. The cavities allow that the guide pin bores are cleansed and that material residues are removed after the molding operation. Further, the cavities can be used for spring clamps for retaining the optocomponent capsule at an optical connector having a similar interface.

Abstract: In manufacturing an encapsulated optocomponent, the optocomponent is embedded in a plastics material. The optocomponent has guide grooves on one of its surfaces in which guide pins are to extend so that the encapsulated optocomponent will obtain an optical interface of standard type. For the encapsulating operation guide pins are placed in a mold cavity in a mold half and the optocomponent is placed in the cavity in the mold, so that the guide pins are engaged in the guide grooves and ar accurately inserted therein. To achieve this effect, a resilient or elastic force such as from plunger is applied to the other side of the optocomponent, so that it is pressed with some force against the guide pins. The cavity in the mold is then closed by placing a second mold half on top after which the encapsulating material can be introduced in the closed cavity in the mold.

Abstract: A mold arrangement for moulding an optodevice onto an optical ribbon fibre. The mould includes of a plurality of plates which are intended to be inserted between the movable top plate and the stationary bottom plate, or counterpressure plate, of a transfer moulding press, and includes an inlet channel, primary and secondary runners and an optodevice moulding cavity formed when two plates are brought together and through which the ribbon fibre extends. According to the invention, the mould cavity is provided with an outwardly projecting part at the ribbon-inlet end of the optodevice, and a seal in the form of a rubber sleeve or a sleeve of some similar material disposed around the ribbon and positioned in the mould cavity so that one end of the sleeve will completely fill the outwardly projecting part and so that the other end of the sleeve extends into the mould cavity. The seal in the moulded optodevice extends out from the optodevice around the ribbon fibre.

Abstract: A mold arrangement for molding an optodevice onto an optical fibre ribbon. The mould includes several plates which are intended for insertion between the movable top plate and the stationary bottom plate, or counterpressure plate, of a transfer molding press, and includes an inlet channel, primary and secondary runners, and an optodevice molding cavity which is defined by two of the plates, the mould plates, when the mould is closed, and through which the fibre ribbon extends. Each of the mould plates is provided with respective front and back exchangeable jaws. One jaw of the front jaws is provided in the jaw dividing plane with V-grooves which correspond in number to the number of fibers in the fibre ribbon and in which the optical fibers from which a protective covering material has been stripped are positioned so that their centers lie in the jaw dividing plane. That side of the other jaw which lies proximal to the fibers is provided with a recess in which a pad of soft resilient material is mounted.

Abstract: The present invention relates to a mold for simultaneously molding a plurality of ferrules onto a corresponding number of optical fibers. The mold preferably includes a runner plate, a first cavity plate, a second cavity plate, and a support plate, each of which is to be inserted between a movable top plate and a fixed bottom plate of a transfer molding machine. The plates to be inserted have a vertical inlet channel and primary and secondary runners for distributing molding compound. These runners lead to a plurality of first and second mutually coincidental mold cavities arranged in rows in the first and second cavity plates, respectively. In a preferred embodiment, each of the first and second mold cavities are made up of mutually coincidental, cylindrical coaxial parts and a larger coaxial, cylindrical bore formed in one or both cavity plates. The dividing plane between the first and second cavity plates coincides with the wider bore.