Patents by Inventor Hans-Dieter Eckardt

Hans-Dieter Eckardt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6249208
    Abstract: A chip inductance is composed of a wound coil core (1) that is arranged erect on a system carrier (6). Perpendicularly residing clips (7) are located on the system carrier, whereby the coil core (1) is arranged within the space formed by the clips. The terminals are thereby located essentially outside the space existing between the end face planes of the coil core (1).
    Type: Grant
    Filed: August 18, 1999
    Date of Patent: June 19, 2001
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Gerhard Proks, Elmar Walter, Hans-Dieter Eckardt, Manfred Espenhain, Jörg-Rudolf Maier, Kurt Marth, Wilfried Scherer