Patents by Inventor Hans G. Recker

Hans G. Recker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5627222
    Abstract: The subject invention pertains to toughened thermosetting resin systems useful as structural adhesives and as matrix resins for thermosetting fiber-reinforced prepregs. These toughened resins employ a most minor amount of functionalized elastomeric particles having a T.sub.g of 10.degree. C. or below dispersed in a thermosetting base resin system.
    Type: Grant
    Filed: January 9, 1995
    Date of Patent: May 6, 1997
    Assignee: Cytec Technology Corp.
    Inventors: Hans G. Recker, Volker Altsaedt, Helmut Tesch, Thomas Weber
  • Patent number: 5605745
    Abstract: The incorporation of 2 to 35 .mu.m particles of a differentially soluble engineering thermoplastic into heat curable epoxy resin systems significantly increases the toughness of such systems without loss of other desirable properties. These toughened epoxy resin systems are useful in preparing carbon fiber reinforced composites having compression strength after impact (CAI) of greater than 45. Ksi 310 MPa after a 1500 in-lb/in impact.
    Type: Grant
    Filed: December 29, 1994
    Date of Patent: February 25, 1997
    Assignee: Cytec Technology Corp.
    Inventors: Hans G. Recker, J. Timothy Hartness, Thomas Folda, Helmut Tesch, Thomas Weber, Jack D. Boyd
  • Patent number: 5532296
    Abstract: Bismaleimide resin systems and fiber reinforced prepregs prepared therefrom having exceptional toughness are prepared by dispersing into a bismaleimide base resin system preformed functionalized elastomer particles having a T.sub.g of less than 10.degree. C.
    Type: Grant
    Filed: September 24, 1993
    Date of Patent: July 2, 1996
    Assignee: Cytec Technology Corp.
    Inventors: Hans G. Recker, Helmut Tesch, Thomas Weber, Volker Altstaedt, Jack D. Boyd
  • Patent number: 5464902
    Abstract: Relatively brittle epoxy resin systems which may be employed as structural film adhesives and matrix resins for fiber-reinforced prepregs are toughened against impact-induced damage by the addition of minor quantities of functionalized elastomer particles having a glass transition temperature of less than 10.degree. C.
    Type: Grant
    Filed: February 4, 1994
    Date of Patent: November 7, 1995
    Assignee: Cytec Technology Corp.
    Inventor: Hans G. Recker
  • Patent number: 5242748
    Abstract: The incorporation of 2 to 25 .mu.m particles of a limited class of polyimides having appreciable nonaromatic character into heat curable epoxy resin systems significantly increases the toughness of such systems without loss of other desirable properties. These toughened epoxy resin systems are useful in preparing carbon fiber reinforced composites having compression strength after impact (CAI) of greater than 45 Ksi after a 1500 in-lb/in impact.
    Type: Grant
    Filed: January 4, 1989
    Date of Patent: September 7, 1993
    Assignee: BASF Aktiengesellschaft
    Inventors: Thomas Folda, Jack D. Boyd, Helmut Tesch, Thomas Weber, Hans G. Recker