Abstract: The present invention relates to a device (10) for delivering a fluid, in particular a cleaning, care or disinfecting fluid for hands, comprising a housing (12) which encloses a cavity (14) into which a container (18) for holding the fluid can be installed, and forms an outer housing surface (28), a pump and metering unit (20), which can be connected or is connected to the housing (12), which can be connected in a detachable manner to the container (18), and with which the fluid can be pumped out of the container (18) and delivered, comprises a monitoring unit (54), with which device-related and/or user-related data can be collected and stored, and a display (76) interacting with the monitoring unit (54) for entering and displaying the user-related data and/or the device-related data. The invention also relates to a system for monitoring such a device (102).

Abstract: The present invention relates to a device (10) for delivering a fluid, in particular a cleaning, care or disinfecting fluid for hands, comprising a housing (12) which encloses a cavity (14) into which a container (18) for holding the fluid can be installed, and forms an outer housing surface (28), a pump and metering unit (20), which can be connected or is connected to the housing (12), which can be connected in a detachable manner to the container (18), and with which the fluid can be pumped out of the container (18) and delivered, comprises a monitoring unit (54), with which device-related and/or user-related data can be collected and stored, and a display (76) interacting with the monitoring unit (54) for entering and displaying the user-related data and/or the device-related data. The invention also relates to a system for monitoring such a device (102).

Abstract: A process and manufacturing system for manufacturing injection molded parts with integrated flexible printed circuit board (9), provided with a cover (39/47) of plastic, fixed in a recess (2) of a carrier strip (1) by projecting carrier elements (14, 15, 16, 17). A circuit board (9) fixed in the carrier strip (1) is inserted into the cavity (21) of first casting mold half (20) of an injection mold, held in position by the carrier elements (14 through 17). The cavity (21) of the first casting mold half is closed by a closing mold part, which has no cavity, including the printed circuit board (9), and the cavity (21) is filled with injection molding compound in a first casting operation. The closing mold part (35) is removed and replaced with a second casting mold half (45) with a cavity (46), which is filled with injection molding compound in a second casting operation.

Abstract: A process is provided for manufacturing a hybrid electrical component (40), which has as electrical conductors connection elements (2, 3, 4, 5). The electrical conductors connection elements are punched out of a pressed screen (1) and are in turn extrusion-coated with a plastic housing (24). To make it possible to manufacture such a hybrid component in a possibly continuous process, the connection elements (2, 3, 4, 5) are connected to one another at least before the extrusion coating with stabilizing webs (6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16) and are stationarily in connection with the pressed screen (1) via holding webs (17, 18, 19, 20). The pressed screen (1) is extrusion coated with a plastic housing (24) together with the connection elements (2, 3, 4, 5) that are in connection with the pressed screen (1) in one injection molding operation.

Abstract: A process for manufacturing a hybrid component. To manufacture a hybrid component with electronic components in a possibly continuous manufacturing process, it is proposed according to the present invention that the electronic component be extrusion-coated with a hot melt adhesive melting at low temperature and to extrusion coat the intermediate product formed with a conventional plastic suitable for injection molding in an additional injection molding operation. On the one hand, damage to the electronic component is reliably prevented from occurring by this procedure, and, on the other hand, a hybrid component can be manufactured with a housing that is insensitive to external effects.