Abstract: A selective encapsulation is produced which covers the connection pads and bonding wires with a potting compound and leaves free active regions, in particular a bearing area for a finger in a fingerprint sensor, by the chip surface being selectively adapted by different roughness or coating and/or the viscosity of the potting compound being altered by irradiation thereof.

Abstract: A selective encapsulation is produced which covers the connection pads and bonding wires with a potting compound and leaves free active regions, in particular a bearing area for a finger in a fingerprint sensor, by the chip surface being selectively adapted by different roughness or coating and/or the viscosity of the potting compound being altered by irradiation thereof.

Abstract: A chip card module contains, in addition to conductor tracks and a chip carrier, one or more semiconductor chips and, if necessary, a stiffening frame. The semiconductor chip(s) and/or stiffening frame are attached with the aid of an adhesive, with which particles of a defined size are admixed as spacers. The adhesive in preferably a flexible adhesive, and the particles preferably are formed of a deformable material. The invention has the effect that the semiconductor chip(s) and/or stiffening frame are adhesively attached to the underlying surface at a defined, uniform distance. The flexible adhesive and the deformable particles adapt to deformations of the chip card module and thus prevent damage to the adhesively bonded mating surfaces.

Abstract: A nonconductive substrate forms a strip or a panel on which a multiplicity of carrier elements is formed, in particular for installation in a chipcard. One side of the substrate is provided with conductive contact surfaces which lie within an outer contour line that determines the size of a carrier element. The other side of the substrate has conductor structures within the outer contour line which form at least contact fields for at least one coil to be contacted and for at least one semiconductor chip. The substrate has cut-outs outside each outer contour line, through which it is possible to access coil terminals of the semiconductor chip for testing purposes from the contact-surface side, as long as the carrier element is still in the strip or in the panel.

Abstract: A heat flow which is introduced into a chip module from the outside is specifically controlled to avoid delaminations between a covering composition and a chip during a hot-melt incorporation process. This takes place either by a heat-insulating layer which is interposed between a flexible carrier tape of the chip module and a chip adhesively fixed thereon, or by clearances within an area or layer of metal contacts. As a result, a heat flow from a hollow punch brought down in an outer region of the metal contacts, in the direction of the centrally mounted chip, is prevented.