Abstract: A molded plastic mounting part (15, 16, 23) is formed as a base for function parts in a metal supporting plate (1, 20). The mounting part, in order to be mounted on the support plate, has a bridge element (5, 17) traversing a hole (2, 21) in the metal supporting plate and has retaining elements (7a, 7b) which bear against both plate surfaces (6a, 6b) of the metal supporting plate. To guarantee that the predetermined position of the mounting part with respect to the axis of the hole is maintained in spite of the shrinkage of the plastic material, the plate surfaces of the metal supporting plate (1, 20) have recesses (4a, 4b;) adjacent the hole, which recesses are engaged by projections (11a; 24a to 24d, 25a to 25d) of the retaining elements of the mounting part.

Abstract: A device for applying exactly dosed quantities of a viscous medium on support surfaces including a backing plate with an upper side and a lower side and at least one through hole, a dosing plate having at least one through hole and an upper side and a lower side which rests on the upper side of the backing plate, while it is possible to change the positions of the backing plate and the dosing plate relative to one another through shifting of the dosing plate or backing plate, an internally hollow tube whose outer wall is connected with exact fit to the whole wall of the hole of the backing plate at one end of the tube for each through hole of the backing plate, a die which can be passed through the through holes of the dosing plate and of the backing plate and through the internally hollow tube, for each through hole of the backing plate, and a wiper device operating parallel to the upper side of the dosing plate, by means of which a viscous medium can be introduced into the through hole of the dosing plate.

Abstract: The invention relates to a method of securing an apparatus part in a hole (5) in a metal base plate (1), adjoining peripheral areas (5a, 7a) of the hole (5) and of the part (7) being fused to one another by melting adjoining material portions of the base plate (1) and the part (7) by means of a parallel beam of coherent light (laser light), a mandril (15) being introduced into the hole (5) in which the part (7) is to be secured in a precise orientation relative to the x, y and z axes of the base plate, which mandril (15) is introduced in the exact x, y and z orientation relative to the base plate (1), the edge (5a) of the hole being upset in the mandril direction or z-axis direction at a plurality of peripheral areas of the hole which are equispaced along the 360 angular degrees of the edge (5a) of the hole, as a result of which a protective layer (3) on the base plate (1) is broken up or removed by mechanical deformation in the fusing area prior to fusing, so as to expose the bare metal in the fusing area, t

Abstract: An electromechanical device for moving magnetic tapes or disks has a metal load-bearing plate provided with openings and injection molded plastic control rods and shafts held in phase by injection molded plastic retention pieces connected through the openings. These retention pieces are provided with a greater clearance relative to the metal load-bearing plate than that achieved by injection molding by a deformation blow to the plastic control rods and shafts after molding.

Abstract: A technical device, in particular an electromechanical running gear for the movement of information carriers, such as magnetic tapes or discs, having a carrier plate (1) made of metal at which movable functional parts (5, 7) made of synthetic resin are formed by an injection molding process (outsert molding). Each functional part is held in a respective hole (3, 4) in the plate by means of retaining pieces (5a, 5b, 7, 7c) made of synthetic resin which overlie both plate surfaces (1c, 1d). The retaining pieces are interconnected through the hole by an integral synthetic-resin connection bridge (5b, 7b) integral with these pieces. Clearance sufficient to obtain a smooth movement of the functional parts (5, 7) in the holes (3, 4) is obtained through mechanical deformation of the retaining pieces subsequent to the insertion molding.

Abstract: The invention relates to a product carrier for circuit boards (23), which are subjected on this carrier to an operation, more particularly to a component mounting operation. The circuit boards (23) are provided for this purpose with location holes (21), into which location pins (5) engage, which can be arranged on the base plate (1) of the carrier in order to fix the circuit board (23) on the product carrier in a given position and at a given height with respect to the base plate (1). The location pins (5) are arranged on the base plate (1) so that they can be individually lowered. Between the location pins (5) there are provided mounting areas (27) for supporting pins (29), from which these pins (29) extend vertically up to the lower side (35) of the circuit board (23) between components which may already be provided at said side to additionally define a supporting plane (37).

Abstract: A device for transferring leadless components from a carrier type to a given mounting position on a circuit board. Removal of the components from the tape is effected by means of a punch and a suction pick-up. The component is pulled along alignment walls of a feeding channel into a slide chamber of a transfer slide. After having received the component, the slide moves to an end position; the component is lifted by a suction tube into an alignment chamber and is then placed on the circuit board. From the instant of transfer from the tape to the instant of mounting on the circuit board, the component is permanently held by suction due to subatmospheric pressure. Even after withdrawal of the suction pick-up, a subatmospheric pressure is maintained in the slide which holds the component during displacement of the slide until the suction tube lifts it again.