Abstract: Phototools are located for processing both sides of printed circuit board panels by an apparatus and process that utilizes a work station with two alignment fixtures each including panel center registration PCR alignment mechanism to locate phototools and panels. Processing steps utilize the alignment fixtures to locate phototools on both sides of a panel. Each of the two phototools is initially positioned on its alignment fixture by the PCR alignment mechanism and secured to its alignment fixture by means of a vacuum supplied by a vacuum chuck which is operative as the top surface of the alignment fixture. The panel is then placed on top of the first phototool and aligned to the first phototool in the first alignment fixture using the PCR alignment mechanism. This first phototool is then affixed to the first side of the panel.

Abstract: A metrology system to analyze panel misregistration in a panel manufacturing process includes a software controlled system which checks defined panel parameters on the four corners of a panel and related artwork for processing with a master pattern etched on a glass reference with a machine vision measuring system. The panel or artwork being checked is positioned by panel center registration means to align the center of the panel with the center of the master pattern. Displacement and rotational differences are entered under software control into a data base and analyzed by a stored program intelligent analyses system into a plurality of parameters based on a parameter model which permits an analysis of the cause of the misregistration.

Abstract: A method and apparatus for positioning a locating mechanism and the artwork frame of a panel processing machine has been devised utilizing a flexible beam apparatus for suspending the panel location mechanism and artwork frame which permit these devices to be moved out of the way during loading and unloading panels into and from the work surface of processing machinery. The flexible beam suspending the location mechanism in the disclosed embodiment comprises two parallel surface thin members of resilient sheet material. These members are each attached along one edge to a rigid portion of the machinery and along an opposing edge to the panel locating mechanism. This flexible beam arrangement permits the locating elements of the locating mechanism to be moved from and restored to a previous position with great accuracy. A pair of co-planar high aspect ratio sheet beam members are used to support the artwork frame.

Abstract: A panel locating method engages holes in a panel which are located in the panel symmetrically about a fixed point and axis and applies synchronized opposing displacements of engaging elements to locate and secure the panel on a work surface.

Abstract: An electrically heated soldering device adapted to simultaneously heat a plurality of spaced electrical elements in a reflow soldering operation includes an elongated metal laminate of substantially U-shaped cross section having a bight portion between two side portions which may be parallel or divergent. The laminate includes a layer of aluminum between a layer of copper and a layer of stainless steel, with the layers being roll bonded together. The copper and aluminum layers are removed at the bight portion to expose the stainless steel layer and form a heat generating zone for contacting the plurality spaced electrical elements which is corrosion resistant and nonwettable by solder. The edges of the copper and aluminum layers adjacent to the exposed stainless steel bight portion are shaped to impart a selectable temperature profile, either uniform or non-uniform along the length of the bight portion.

Abstract: A process and apparatus are disclosed for controlling losses in volatile working fluid systems. In accordance with the process, the object upon which a work operation is to be effected is sequentially moved from a first sealable chamber to a second such chamber and back to the first chamber. While in the second chamber the object is exposed to a working fluid vapor which elevates the temperature of the object to a level near the boiling point of the working fluid. Thereafter, while still in the second chamber, a substantial portion of the working fluid is drained from the object such that the sensible heat acquired by the object upon its elevation of temperature is sufficient to evaporate working fluid remaining on the object upon its removal to the first chamber. Upon removal of the object to the first chamber the object is thoroughly dried through control of the partial pressure of the working fluid vapor contained within the first chamber atmosphere.

Abstract: A process and machine are disclosed for reflowing solder plated continuous flexible circuit webs. During reflow in a vapor environment, the flexible web is maintained in a planar orientation to produce a relatively uniform distribution of solder. Virtually all of the heat transfer fluid used in producing the vapor is recovered and retained.

Abstract: .[.Article.]. .Iadd.An article .Iaddend.to be soldered, fused or brazed is placed in hot saturated vapors generated by continuously boiling .Iadd.a .Iaddend.heat transfer liquid having selected properties including .Iadd.a .Iaddend.boiling point at least equal to, and preferably above, .Iadd.the .Iaddend.temperature required for .Iadd.such .Iaddend.operation. Vapors condense on .Iadd.the .Iaddend.article and give up latent heat of vaporization to heat .Iadd.the .Iaddend.article to .Iadd.the .Iaddend.temperature for soldering, fusing or brazing. .[.Heat.]. .Iadd.The heat .Iaddend.transfer liquid may be a fluorocarbon. Apparatus is shown for soldering, fusing or brazing a single article, a batch of articles, or a continuously moving line of articles. Specifically, mass reflow soldering and mass wave soldering operations are described. .Iadd.