Abstract: Shown are embodiments where a process of manufacturing a semiconductor element on a semiconductor wafer is shown. The semiconductor element is obtained by dividing the function-providing semiconductor wafer into functional elements. The function-providing semiconductor wafer is, at its first main surface, mechanically coupled to a handling wafer. The thinning is carried out in the coupled state of the function-providing semiconductor wafer, and the function-providing semiconductor wafer is divided in its state coupled to the handling wafer. During or after connecting the semiconductor element to a lead frame the mechanical coupling between the semiconductor element and the corresponding part of the handling wafer is destroyed. Other embodiments are also shown.

Abstract: Shown are embodiments where a process of manufacturing a semiconductor element on a semiconductor wafer is shown. The semiconductor element is obtained by dividing the function-providing semiconductor wafer into functional elements. The function-providing semiconductor wafer is, at its first main surface, mechanically coupled to a handling wafer. The thinning is carried out in the coupled state of the function-providing semiconductor wafer, and the function-providing semiconductor wafer is divided in its state coupled to the handling wafer. During or after connecting the semiconductor element to a lead frame the mechanical coupling between the semiconductor element and the corresponding part of the handling wafer is destroyed. Other embodiments are also shown.

Abstract: A heat flow which is introduced into a chip module from the outside is specifically controlled to avoid delaminations between a covering composition and a chip during a hot-melt incorporation process. This takes place either by a heat-insulating layer which is interposed between a flexible carrier tape of the chip module and a chip adhesively fixed thereon, or by clearances within an area or layer of metal contacts. As a result, a heat flow from a hollow punch brought down in an outer region of the metal contacts, in the direction of the centrally mounted chip, is prevented.

Abstract: A chip cover for complete or partial covering of electrical, electronic, optoelectronic and/or electromechanical components includes an activator capable of fully or partially destroying the electrical, electronic, optoelectronic and/or electromechanical components of the chip when activated. The activator can be activated by an attempt to remove the chip cover from the chip. In this way it is possible to reliably prevent reverse engineering and/or manipulation of the chip.