Patents by Inventor Hans J. Hacke

Hans J. Hacke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacture of fine structures for semiconductor contacting
    Patent number: 4795694
    Abstract: A method for the manufacture of fine structures for semiconductors were in a photographic structuring is carried out on both sides of a smooth, non-stressed metal tape. The tape is etched from both sides. A single sided metal deposition than takes place by means of a float type electroplating. Stabilization of the fine structure is achieved by depositing a lacquer or resin by an electrophoretic deposition or by electro-immersion lacquering. The insulator carrier is applied as one of the final steps of the process.
    Type: Grant
    Filed: May 21, 1987
    Date of Patent: January 3, 1989
    Assignee: Siemens Aktiengesellschaft
    Inventors: Alfred Groeber, Hans Hadersbeck, Fritz Mueller, Hubert Zukier, Hans J. Hacke
  • Intermediate member for mounting and contacting a semiconductor body
    Patent number: 4210926
    Abstract: An intermediate carrier with several contact fingers is disclosed for the support and contacting of a semiconductor member. The contact fingers have an outer contact and an inner contact. An inner contact is provided for each electrode of the semiconductor member. In relation to the adjoining areas of the contact fingers, the inner contacts are constructed as raised projections or bumps. The space required between the contact fingers and the semiconductor member is produced primarily by the projections or bumps.
    Type: Grant
    Filed: March 16, 1979
    Date of Patent: July 1, 1980
    Assignee: Siemens Aktiengesellschaft
    Inventor: Hans J. Hacke