Patents by Inventor Hans J. Quenzer

Hans J. Quenzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Direct substrate bonding
    Patent number: 5407856
    Abstract: Disclosed is a process for producing a solid, surface bonding between two wafer plates, of which at least one is composed of a semiconducting material, such as e.g. silicon. The process has the following steps: on the cleaned surface of at least one wafer plate a film having a residual moisture from solvents containing silicates or phosphates is applied, the two wafer surfaces on at least one of which a film is applied are joined, the two wafers are tempered in the joined state at temperatures lower than approx. 420.degree. C.
    Type: Grant
    Filed: May 9, 1994
    Date of Patent: April 18, 1995
    Assignee: Fraunhofer Gesellschaft zur Forderung der angewandten Forschung
    Inventors: Hans J. Quenzer, Wolfgang Benecke