Patents by Inventor Hans-Jörg Wagner
Hans-Jörg Wagner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11804951Abstract: The described techniques facilitate the secure transmission of sensor measurement data to an ECU by implementing an authentication procedure. The authentication procedure includes an integrated circuit (IC) generating authentication tags by encrypting portions of sensor measurement data. These authentication tags are then transmitted together with the sensor measurement data as authenticated sensor measurement data. The ECU may then use the authentication tags to authenticate the sensor measurement data based upon a comparison of the portions of the sensor measurement data sensor measurement data to the authentication tag that is expected to be generated for those portions of sensor measurement data.Type: GrantFiled: July 19, 2021Date of Patent: October 31, 2023Assignee: Infineon Technologies AGInventors: Friedrich Rasbornig, Hans-Joerg Wagner, Dirk Hammerschmidt, Tobias Werth
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Publication number: 20230305048Abstract: Some described techniques address issues of latency and lengthy processing times associated with conventional redundant sensor measurement systems that rely upon digital transmission protocols by implementing a diverse analog sensor interface architecture. Additional described techniques provide a redundant signaling solution to achieve signaling diversity using a combination of analog and digital sensor interface architectures. The described architectures may advantageously use a number of sensor measurement paths that may be independent of one another or share any suitable number of common components to provide varying levels of redundancy. When redundant analog sensor interface architectures are implemented, the analog interfaces may also provide signal diversity with respect to the use of different types of analog transmission protocols, which may include different signaling interfaces (e.g. differential versus single-ended), different transmission interfaces (e.g.Type: ApplicationFiled: June 5, 2023Publication date: September 28, 2023Inventors: Friedrich Rasbornig, Dirk Hammerschmidt, Bernhard Schaffer, Hans-Jörg Wagner
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Patent number: 11689326Abstract: The described techniques address the issues of latency and lengthy processing times associated with conventional redundant sensor measurement systems that rely upon digital transmission protocols by implementing a diverse analog sensor interface architecture. The described architecture may advantageously use a number of sensor measurement paths that may be independent of one another or share any suitable number of common components to provide varying levels of redundancy. The analog interfaces may provide signal diversity with respect to the use of different types of analog transmission protocols, which may include different signaling interfaces (e.g. differential versus single-ended), different transmission interfaces (e.g. voltage versus current interfaces), and/or the use of different signalization schemes.Type: GrantFiled: July 29, 2020Date of Patent: June 27, 2023Assignee: Infineon Technologies AGInventors: Friedrich Rasbornig, Bernhard Schaffer, Hans-Joerg Wagner, Dirk Hammerschmidt
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Publication number: 20230035123Abstract: The present disclosure relates to a sensor chip, including a semiconductor substrate, a first sensor circuit monolithically integrated into the semiconductor substrate, at least one second sensor circuit monolithically integrated into the semiconductor substrate, wherein the first and second integrated sensor circuits are embodied identically.Type: ApplicationFiled: July 28, 2022Publication date: February 2, 2023Applicant: Infineon Technologies AGInventors: Stephan LEISENHEIMER, Richard HEINZ, Hans-Joerg WAGNER, Markus KAMMERSBERGER
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Patent number: 11561115Abstract: Sensor devices and corresponding methods are provided. When a signal path output (COMP OUT) indicates no threshold crossings, diagnosis is performed with a timing based on a clock. In case threshold crossings are indicated, diagnosis is performed with a timing based on threshold crossings.Type: GrantFiled: December 4, 2020Date of Patent: January 24, 2023Assignee: Infineon Technologies AGInventors: Dragos Vocurek, Hans-Joerg Wagner
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Publication number: 20230020730Abstract: The described techniques facilitate the secure transmission of sensor measurement data to an ECU by implementing an authentication procedure. The authentication procedure includes an integrated circuit (IC) generating authentication tags by encrypting portions of sensor measurement data. These authentication tags are then transmitted together with the sensor measurement data as authenticated sensor measurement data. The ECU may then use the authentication tags to authenticate the sensor measurement data based upon a comparison of the portions of the sensor measurement data sensor measurement data to the authentication tag that is expected to be generated for those portions of sensor measurement data.Type: ApplicationFiled: July 19, 2021Publication date: January 19, 2023Inventors: Friedrich Rasbornig, Hans-Joerg Wagner, Dirk Hammerschmidt, Tobias Werth
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Publication number: 20220366209Abstract: A device comprises a magnet and an angle sensor, wherein the angle sensor is configured to detect a rotation angle of the magnet. The device also contains a rotation counter, wherein the rotation counter is configured to record a number of rotations of the magnet. The angle sensor and the rotation counter are implemented in physically separate components.Type: ApplicationFiled: May 9, 2022Publication date: November 17, 2022Inventors: Konrad KAPSER, Johannes HUCHZERMEIER, Mario MOTZ, Alexander PLAUTZ, Simone REALE, Veikko SUMMA, Dhananjayee VIJAYAKRISHNA, Hans-Joerg WAGNER
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Publication number: 20220290968Abstract: A rotational angle sensor device and a corresponding method are provided. Two signals which have a phase offset with respect to one another are generated based on a modulated magnetic field using a sensor arrangement. Three signals which have a phase offset with respect to one another are generated from the signals.Type: ApplicationFiled: March 7, 2022Publication date: September 15, 2022Inventors: Rainer KLING, Stephan LEISENHEIMER, Severin NEUNER, Monika PFEIFER, Dragos VOCUREK, Hans-Joerg WAGNER
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Publication number: 20220038222Abstract: The described techniques address the issues of latency and lengthy processing times associated with conventional redundant sensor measurement systems that rely upon digital transmission protocols by implementing a diverse analog sensor interface architecture. The described architecture may advantageously use a number of sensor measurement paths that may be independent of one another or share any suitable number of common components to provide varying levels of redundancy. The analog interfaces may provide signal diversity with respect to the use of different types of analog transmission protocols, which may include different signaling interfaces (e.g. differential versus single-ended), different transmission interfaces (e.g. voltage versus current interfaces), and/or the use of different signalization schemes.Type: ApplicationFiled: July 29, 2020Publication date: February 3, 2022Inventors: Friedrich Rasbornig, Bernhard Schaffer, Hans-Joerg Wagner, Dirk Hammerschmidt
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Publication number: 20210172765Abstract: Sensor devices and corresponding methods are provided. When a signal path output (COMP OUT) indicates no threshold crossings, diagnosis is performed with a timing based on a clock. In case threshold crossings are indicated, diagnosis is performed with a timing based on threshold crossings.Type: ApplicationFiled: December 4, 2020Publication date: June 10, 2021Applicant: Infineon Technologies AGInventors: Dragos VOCUREK, Hans-Joerg WAGNER
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Patent number: 10705132Abstract: A method including feeding a test signal into a first end of a conductor track of a semiconductor chip, wherein the conductor track crosses an indentation of a substrate of the semiconductor chip; and detecting the test signal at a second ends of the conductor track, which wherein the detected test signal is indicative of fracture of the substrate of the semiconductor chip at the indentation.Type: GrantFiled: March 1, 2019Date of Patent: July 7, 2020Assignee: Infineon Technologies AGInventors: Thomas Zettler, Dirk Hammerschmidt, Friedrich Rasbornig, Wolfgang Scheibenzuber, Hans-Joerg Wagner
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Publication number: 20190195937Abstract: A method including feeding a test signal into a first end of a conductor track of a semiconductor chip, wherein the conductor track crosses an indentation of a substrate of the semiconductor chip; and detecting the test signal at a second endsof the conductor track, which wherein the detected test signal is indicative of fracture of the substrate of the semiconductor chip at the indentation.Type: ApplicationFiled: March 1, 2019Publication date: June 27, 2019Inventors: Thomas Zettler, Dirk Hammerschmidt, Friedrich Rasbornig, Wolfgang Scheibenzuber, Hans-Joerg Wagner
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Patent number: 10281517Abstract: A semiconductor chip includes a substrate, an integrated circuit, an indentation of the substrate, a conductor track, and also a crossover between the indentation and the conductor track. Detection of a test signal fed into the conductor track is made possible in this way. In various examples, a fracture of the substrate in the region of the indentation can be detected.Type: GrantFiled: February 6, 2017Date of Patent: May 7, 2019Assignee: Infineon Technologies AGInventors: Thomas Zettler, Dirk Hammerschmidt, Friedrich Rasbornig, Wolfgang Scheibenzuber, Hans-Joerg Wagner
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Publication number: 20180374783Abstract: An integrated circuit package having a first die configured to sense a first physical characteristic and provide a first data signal, and a second die, wherein the first die is configured to transmit the first data signal to the second die, and the second die is configured to determine if there is an error in the first die and transmit the result to a controller.Type: ApplicationFiled: June 23, 2017Publication date: December 27, 2018Inventors: Friedrich Rasbornig, Wolfgang Granig, Dirk Hammerschmidt, Hans-Joerg Wagner, Thomas Zettler
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Patent number: 10163763Abstract: An integrated circuit package having a first die configured to sense a first physical characteristic and provide a first data signal, and a second die, wherein the first die is configured to transmit the first data signal to the second die, and the second die is configured to determine if there is an error in the first die and transmit the result to a controller.Type: GrantFiled: June 23, 2017Date of Patent: December 25, 2018Assignee: Infineon Technologies AGInventors: Friedrich Rasbornig, Wolfgang Granig, Dirk Hammerschmidt, Hans-Joerg Wagner, Thomas Zettler
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Publication number: 20170227597Abstract: A semiconductor chip includes a substrate, an integrated circuit, an indentation of the substrate, a conductor track, and also a crossover between the indentation and the conductor track. Detection of a test signal fed into the conductor track is made possible in this way. In various examples, a fracture of the substrate in the region of the indentation can be detected.Type: ApplicationFiled: February 6, 2017Publication date: August 10, 2017Inventors: Thomas Zettler, Dirk Hammerschmidt, Friedrich Rasbornig, Wolfgang Scheibenzuber, Hans-Joerg Wagner