Patents by Inventor Hans-Juergen Hesse
Hans-Juergen Hesse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220193812Abstract: A device for heating and determining the actual temperature of a bonding tool of an ultrasonic bonder, comprising the bending tool, which has a first end face, a second end face, a lateral surface, which connects the first end face to the second end face, and an absorption region, comprising a temperature measuring unit for determining an actual temperature of the bonding tool at a temperature measuring point, which is provided on the lateral surface of the bonding tool and preferably at a tip of the bonding tool, and comprising a laser generator, a laser beam being provided with the aid of the laser generator, and the laser beam striking the bonding tool in the absorption region, and the bonding tool being heated as a result of the absorption of the laser beam.Type: ApplicationFiled: March 10, 2022Publication date: June 23, 2022Applicant: Hesse GmbHInventors: Andreas UNGER, Michael BROEKELMANN, Matthias HUNSTIG, Hans-Juergen HESSE
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Publication number: 20220193814Abstract: An ultrasonic tool including a first end face and a second end face opposite the first end face. A tool lateral surface connects the first and second end face. The ultrasonic tool is elongate in a longitudinal direction of the tool, wherein at least the first end face is designed as a connection contact surface that is arranged for pressing the ultrasonic tool against a connection component, wherein the ultrasonic tool has an end region having the connection contact surface, which end region extends from the connection contact surface in the longitudinal direction of the tool over 15 mm, but at most one third of a length of the ultrasonic tool, toward the opposite end face, and wherein a pocket-shaped and/or blind-hole-like recess having a recess lateral surface and having a recess floor facing the connection contact surface is formed at the tool lateral surface in the end region.Type: ApplicationFiled: March 10, 2022Publication date: June 23, 2022Applicant: Hesse GmbHInventors: Andreas UNGER, Michael BROEKELMANN, Matthias HUNSTIG, Hans-Juergen HESSE
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Publication number: 20220193811Abstract: An apparatus for detecting the temperature of a bonding tool during laser-assisted ultrasonic bonding, comprising an automatic bonding machine having the bonding tool, having a displacement and/or positioning module for the bonding tool and having a device for exciting the bonding tool to ultrasonically vibrate, comprising a laser generator for providing a laser beam, and comprising an optical waveguide for guiding the laser beam from the laser generator to the bonding tool, wherein the optical waveguide has a multi-part design, that a deflecting and beam-splitting unit is provided between at least two adjacent parts of the optical waveguide and that furthermore a temperature sensor is provided.Type: ApplicationFiled: March 10, 2022Publication date: June 23, 2022Applicant: Hesse GmbHInventors: Andreas UNGER, Michael BROEKELMANN, Matthias HUNSTIG, Hans-Juergen HESSE
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Publication number: 20220193816Abstract: An ultrasonic tool comprising a first end face and a second end face, which is opposite the first end face, as well as a tool cover surface connecting the first end face and the second end face, wherein the ultrasonic tool is elongated in a longitudinal direction of the tool, wherein at least the first end face is formed as a connecting contact surface, which is arranged for pressing the ultrasonic tool against a connecting component, and wherein the ultrasonic tool comprises an end region comprising the connecting contact surface, which extends from the connecting contact surface in the longitudinal direction of the tool over 15 mm, but at most extends one third of the length of the ultrasonic tool in the direction of the opposite end face, and wherein in the end region, a first partial surface of the tool cover surface is formed as a surface-structured absorption surface.Type: ApplicationFiled: March 10, 2022Publication date: June 23, 2022Applicant: Hesse GmbHInventors: Andreas UNGER, Michael BROEKELMANN, Matthias HUNSTIG, Hans-Juergen HESSE
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Publication number: 20220193815Abstract: A bonding arrangement comprising a bonding tool, having a tool shank which is designed to extend in a longitudinal direction of the tool, and a tool tip which connects to the tool shank. A first end side of the bonding tool is provided on the tool tip, which is designed to come into contact with a connection part. A second end side of the bonding tool is provided on the tool shank. The bonding tool has a casing surface connecting the first end side and the second end side, said bonding arrangement comprising a laser generator for providing a laser beam and comprising a light guide designed to guide the laser beam to the bonding tool. A functional recess is formed on the bonding tool on the casing side and the light guide is associated with the bonding too on the casing side from the outside and at a distance.Type: ApplicationFiled: March 10, 2022Publication date: June 23, 2022Applicant: Hesse GmbHInventors: Andreas UNGER, Michael BROEKELMANN, Matthias HUNSTIG, Hans-Juergen HESSE
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Publication number: 20220194014Abstract: A method for producing an electrically conductive connection between a contact surface of a functional component and a connection component. The connection component is pressed against the contact surface of the functional component with a normal force using a bonding tool. The bonding tool and the connection component are brought in contact with same to vibrate ultrasonically. A laser beam is generated by a laser generator and directed onto the bonding tool, and preferably onto a tip of the bonding tool, whereby the tip of the bonding tool is heated. An actual temperature of the tip is contactlessly measured and the laser generator is operated intermittently and/or with an adjustable laser output such that a predefined target temperature is adjusted at the tip of the bonding tool.Type: ApplicationFiled: March 10, 2022Publication date: June 23, 2022Applicant: Hesse GmbHInventors: Andreas UNGER, Michael BROEKELMANN, Matthias HUNSTIG, Hans-Juergen HESSE
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Publication number: 20210194102Abstract: An ultrasonic bonding method for electrical contacting a plurality of battery cells of a battery block. A first connection point is produced in that a bonding tool is heated directly, and a first connection contact surface of a first battery cell and/or a connection conductor is/are heated locally and indirectly by a laser beam directed toward the bonding tool. The connection conductor is pressed against the first connection contact surface of the first battery cell. The bonding tool is excited to vibrate ultrasonically, the ultrasonic vibrations being transferred from the bonding tool to the connection conductor. A second connection point is produced in that the connection conductor is pressed against a second connection contact surface of a second battery cell of the battery block or a common connection contact of the battery block by the bonding tool and excited to vibrate ultrasonically.Type: ApplicationFiled: March 5, 2021Publication date: June 24, 2021Applicant: HESSE GmbHInventors: Michael BROEKELMANN, Hans-Juergen HESSE, Matthias HUNSTIG
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Patent number: 11017554Abstract: A method for securing a bonding product in a working region of a bonder via a clamping device. The bonding product and the clamping device are positioned in the working region of the bonder and a partial characteristic contour is captured to determine the position of the bonding product in the working region. The previously set clamping position of the clamping fingers is captured via a camera and a clamping position is calculated. A current position and orientation of clamping fingers and a new misalignment of the clamping fingers is calculated and displayed until the current position and orientation of the clamping fingers corresponds to a clamping finger reference position.Type: GrantFiled: August 2, 2019Date of Patent: May 25, 2021Assignee: HESSE GmbHInventors: Hans-Juergen Hesse, Gregor Belting, Markus Riese
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Publication number: 20200282488Abstract: A production method for a bonding tool with a body that has an elongated tool shank of the bonding tool and a tool tip adjoining the tool shank, and with a blind hole that is provided in the region of an elongated tool shank of the bonding tool and that is carried into the region of a tool tip, wherein a contact surface of the bonding tool is provided on the tool tip, comprising the following production steps: first a through opening is produced that is carried through the tool shank to the tool tip; then the through opening is closed in the region of the tool tip by a terminating element inserted into the body.Type: ApplicationFiled: May 20, 2020Publication date: September 10, 2020Applicant: HESSE GmbHInventors: Hans-Juergen HESSE, Michael BROEKELMANN, Matthias HUNSTIG
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Patent number: 10634572Abstract: A calibration method for a bonder. Characteristics of a force actuator of the bonder are measured and stored in such a way that the force actuator can be controlled optimally during production operation of the bonder on the basis of the measured data. Further, a device for fully automatic or partially automatic bonding force calibration.Type: GrantFiled: June 14, 2016Date of Patent: April 28, 2020Assignee: Hesse GmbHInventors: Frank Walther, Hans-Juergen Hesse, Andreas Jochheim
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Publication number: 20190355146Abstract: A method for securing a bonding product in a working region of a bonder via a clamping device. The bonding product and the clamping device are positioned in the working region of the bonder and a partial characteristic contour is captured to determine the position of the bonding product in the working region. The previously set clamping position of the clamping fingers is captured via a camera and a clamping position is calculated. A current position and orientation of clamping fingers and a new misalignment of the clamping fingers is calculated and displayed until the current position and orientation of the clamping fingers corresponds to a clamping finger reference position.Type: ApplicationFiled: August 2, 2019Publication date: November 21, 2019Applicant: Hesse GmbHInventors: Hans-Juergen HESSE, Gregor BELTING, Markus RIESE
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Publication number: 20180113046Abstract: A calibration method for a bonder. Characteristics of a force actuator of the bonder are measured and stored in such a way that the force actuator can be controlled optimally during production operation of the bonder on the basis of the measured data. Further, a device for fully automatic or partially automatic bonding force calibration.Type: ApplicationFiled: June 14, 2016Publication date: April 26, 2018Inventors: Frank Walther, Hans-Juergen Hesse, Andreas Jochheim
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Patent number: 9296065Abstract: In a method for ultrasonic bonding, two longitudinal ultrasonic waves propagating in a common working plane oriented parallel to a substrate are induced in one or more ultrasonic transducers and are passed through ultrasound-conducting arms from different spatial directions onto a common connection point of the arms. At the connection point the ultrasonic waves cause an ultrasonic tool arranged directly or indirectly at said connection point to oscillate in two or three dimensions. At least one of the ultrasonic transducers induces an ultrasonic wave with a first harmonic oscillation component and a second oscillation component.Type: GrantFiled: July 26, 2012Date of Patent: March 29, 2016Assignee: HESSE GMBHInventors: Hans-Juergen Hesse, Michael Broekelmann
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Publication number: 20150336206Abstract: The invention relates to a tool (1) for producing a friction-welded connection between a wire and a substrate having a tool shaft (2, 3) extending in the direction of a longitudinal center axis of the tool, having a tool receptacle section (2) for fastening the tool to a tool receptacle of a friction-welding machine and having a tool tip (3) connecting to the tool shaft, wherein a face (5) of the tool (1) is allocated to the tool tip (3) and wherein, in order to receive the wire during friction-welding, there is a channel-shaped groove (7) extending in a transverse direction of the tool in the region of the face (5) which is delimited by a shell surface, which can contact the wire at least in sections during friction welding, wherein there is at least one pocket-shaped recess (11) on the shell surface such that a cross-section of the groove (7) is designed to flare in the region of the recesses (11) and there is a wall of the recess (11) set back opposite the shell surface.Type: ApplicationFiled: December 5, 2013Publication date: November 26, 2015Applicant: Hesse GmbHInventors: Michael BROEKELMANN, Hans-Juergen HESSE
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Patent number: 8783545Abstract: A method for quality control during ultrasonic bonding, in which a transducer bonding tool unit and an ultrasonic generator are used and in which, during the bonding, one or more sensors are used to sense measurement signals for one or more parameters, which can vary during the bonding, for assessing the bond quality and/or for influencing the bonding, and which proposes that, during the bonding, at least one speed profile measurement signal representing the time/speed profile of the tip of the ultrasonic tool in the direction of oscillation thereof be sensed. The invention also relates to a bonding apparatus which is suitable for carrying out the method. Furthermore, the invention relates to other quality control methods for ultrasonic bonding and to bonding apparatuses which are suitable for carrying out these methods.Type: GrantFiled: May 12, 2010Date of Patent: July 22, 2014Assignee: Hesse GmbHInventors: Hans-Juergen Hesse, Michael Broekelmann, Sebastian Hagenkoetter
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Publication number: 20140151439Abstract: In a method for ultrasonic bonding, two longitudinal ultrasonic waves propagating in a common working plane oriented parallel to a substrate are induced in one or more ultrasonic transducers and are passed through ultrasound-conducting arms from different spatial directions onto a common connection point of the arms. At the connection point the ultrasonic waves cause an ultrasonic tool arranged directly or indirectly at said connection point to oscillate in two or three dimensions. At least one of the ultrasonic transducers induces an ultrasonic wave with a first harmonic oscillation component and a second oscillation component.Type: ApplicationFiled: July 26, 2012Publication date: June 5, 2014Applicant: Hesse GmbHInventors: Hans-Juergen Hesse, Michael Broekelmann
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Patent number: 8434659Abstract: A bonding device, particularly for producing bond connections between electrical conductors made of wire material or strip material and contact points of substrates such as electrical circuits, wherein the bonding device comprises a bonding head (2) which can be rotated about a geometric axis of rotation (D), in particular a vertical axis, and on which a bonding tool (5) and an ultrasonic transducer (35) are disposed for ultrasonic vibration excitation of the bonding tool (5). It is proposed that the main direction of extension (36) of the ultrasonic transducer (35) and/or the direction of extension thereof in the direction of the axis of the minimum moment of inertia extends parallel to the geometric axis of rotation (D) of the bonding head (2). The invention further relates to a bonding device or an ultrasonic transducer.Type: GrantFiled: October 7, 2009Date of Patent: May 7, 2013Assignee: Hesse & Knipps GmbHInventors: Hans-Juergen Hesse, Joerg Wallaschek, Michael Broekelmann, Piotr Vasiljev
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Publication number: 20110266329Abstract: A bonding device, particularly for producing bond connections between electrical conductors made of wire material or strip material and contact points of substrates such as electrical circuits, wherein the bonding device comprises a bonding head (2) which can be rotated about a geometric axis of rotation (D), in particular a vertical axis, and on which a bonding tool (5) and an ultrasonic transducer (35) are disposed for ultrasonic vibration excitation of the bonding tool (5). It is proposed that the main direction of extension (36) of the ultrasonic transducer (35) and/or the direction of extension thereof in the direction of the axis of the minimum moment of inertia extends parallel to the geometric axis of rotation (D) of the bonding head (2). The invention further relates to a bonding device or an ultrasonic transducer.Type: ApplicationFiled: October 7, 2009Publication date: November 3, 2011Applicant: HESSE & KNIPPS GMBHInventors: Hans-Juergen Hesse, Joerg Wallaschek, Michael Broekelmann, Piotr Vasiljev
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Publication number: 20100280646Abstract: A method for quality control during ultrasonic bonding, in which a transducer bonding tool unit and an ultrasonic generator are used and in which, during the bonding, one or more sensors are used to sense measurement signals for one or more parameters, which can vary during the bonding, for assessing the bond quality and/or for influencing the bonding, and which proposes that, during the bonding, at least one speed profile measurement signal representing the time/speed profile of the tip of the ultrasonic tool in the direction of oscillation thereof be sensed. The invention also relates to a bonding apparatus which is suitable for carrying out the method. Furthermore, the invention relates to other quality control methods for ultrasonic bonding and to bonding apparatuses which are suitable for carrying out these methods.Type: ApplicationFiled: May 12, 2010Publication date: November 4, 2010Inventors: Hans-Juergen Hesse, Michael Broekelmann, Sebastian Hagenkoetter
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Patent number: 7611039Abstract: The invention relates to an ultrasonic transducer comprising at least one sensor, particularly for use in ultrasonic bonders. At least one sensor (4, 6) is arranged in/on a mounting (2, 3) of the ultrasonic transducer and, in particular, by means of which a transverse extension perpendicular to a propagating exciting ultrasonic wave can be metrologically detected.Type: GrantFiled: March 16, 2007Date of Patent: November 3, 2009Assignee: Hesse & Knipps GmbHInventors: Hans-Juergen Hesse, Joerg Wallaschek, Piotr Vasiljev