Abstract: An emulsified reactive epoxy polymer composition which is readily dispersed in water particularly suited for use in a coating composition which may be cured at ambient temperatures. The emulsified composition incorporates a hydrophilic polyoxyalkylene segment.

Abstract: The specification describes and claims filled compositions, e.g. moisture curable sealant compositions which comprise 100 parts by weight of polymeric material comprising a mixture and/or a reaction product of a polydiorganosiloxane having silicon-bonded hydroxyl groups with a compound containing silicon-bonded alkoxy or alkoxyalkoxy groups, 50 to 200 parts by weight of finely divided filler and an additive which is a reaction product of an organic amine, an oxide, hydroxide, carbonate, bicarbonate or a mixture thereof with a sulphonic acid of the formula RSO.sub.3 H in which R represents a hydrocarbon group which may be halogenated. The additive is preferably a reaction product of the sulphonic acid and an oxide, hydroxide, carbonate or bicarbonate of magnesium, or calcium and the acid is preferably one in which R represents a group R'C.sub.6 H.sub.4 wherein R' represents an alkyl group having 6 to 18 carbon atoms, for example dodecylbenzenesulphonic acid.

Abstract: The specification discloses a curable composition comprising 100 parts by weight of polysiloxane, 50 to 200 parts by weight of finely divided filler having an average particle size greater than 0.05 micron and not less than 0.5 parts by weight per 100 parts by weight of the filler of an additive which is a reaction product of an organic amine, or an oxide, hydroxide, carbonate, or bicarbonate or a mixture thereof with a sulphonic acid of the formula RSO.sub.3 H in which R represents a hydrocarbon group which may have halogen or amino substituents and which contains not less than six carbon atoms. Preferred additives are reaction products of the sulphonic acid and an oxide, hydroxide, carbonate or bicarbonate of sodium, magnesium, zinc, calcium, barium, aluminium or a mixture thereof. The group R of the sulphonic acid may be R'C.sub.6 H.sub.4 where R' represents an alkyl group having 6 to 18 carbon atoms and a preferred acid is dodecylbenzenesulphonic acid.