Abstract: A semiconductor package assembly and molding resin case is provided. The package includes a lead frame having a first and a second lead frame side opposite to the first; a semiconductor die structure having a first and a second die side opposite to the first, the die structure being mounted with its second die side on the first lead frame side, resulting in a first connection; a bond element connected to the first die of the die structure, resulting in another connection; with the molding resin case encapsulating at least the die structure, the lead frame and a first part of at least one bond element connected to the die structure, leaving the second lead frame side and the at least one bond element partly exposed; and at least one bond element is provided with electric field modulation structures configured to alter an electric field created between the connections.

Abstract: A motor vehicle having a bearing structure, which includes a shell having a crossbeam, which is integrated into the bearing structure with its opposite ends between two B-pillars. A respective side impact support is combined with a crash pad between the opposite ends of the crossbeam and the B-pillars, which side impact support constitutes a second load path emanating from the affected B-pillar in case of a side impact, which is provided in addition to a first load path, which extends from the B-pillar into the crossbeam via the respective side impact support in case of a side impact.

Abstract: A semiconductor device is provided, including: a lead frame, a semiconductor chip, a mold, and an adhesion promoter. The lead frame includes a first surface and a second frame surface opposite the first surface, and the chip includes a first and a second surface opposite the first surface, the first frame surface is an outer surface of the device, with the second frame surface attached to the first chip surface so that the second frame surface is partially covered by the first chip surface. An uncovered surface part of the second frame surface and the second chip side are in contact with the mold by the adhesion promoter, that is on the uncovered surface part of the second frame surface and/or on the second chip surface. The adhesion promoter enhances adhesion between the mold, and either the second frame surface or the second chip surface of the chip.

Abstract: A method of manufacturing a semiconductor package is provided, with an integrated heatsink and electrical connection feature. The semiconductor die can be attached to the terminal using eutectic bonding, preferably CuSn eutectic, Ag containing adhesives or Ag sintering material. These bondings are lead (Pb) free connection methods, which make the finished semiconductor package RoHS compliant (restriction of hazardous materials).

Abstract: The present disclosure relates to a reader, such as a reader for a physical access control system. The reader can include first and second antennas, each designed or configured for receiving ultra-wide band (UWB) signals. The reader can also include a mounting plane configured for mounting the reader to a surface. An axis aligning the first and second antennas can be arranged substantially perpendicular relative the mounting plane. A material can be provided between the first and second antennas. The material can have a thickness that defines a distance between the first and second antennas of less than a half wavelength of the UWB signal through air (?A/2), the material configured to slow down electromagnetic waves passing therethrough such that the thickness of the material provides an effective separation distance of the first and second antennas of at least a half wavelength of the UWB signal through air (?A/2).

Abstract: A panel may include a panel top side and a panel underside having complementary holding profiles which are provided in pairwise fashion on the panel margins, wherein a first holding profile pair is equipped with a groove profile and a tongue profile, wherein the groove profile and the tongue profile of identical panels can be locked together by means of a pivoting joining movement, and wherein a second holding profile pair is equipped with hook profiles, specifically with a receiving hook on one panel margin and with an arresting hook on the opposite panel margin, wherein the receiving hook has a receiving edge directed toward the panel top side and a receiving groove open toward the panel top side, and the arresting hook is equipped with an arresting edge which is directed toward the panel underside and with an arresting groove which is open toward the panel underside.

Abstract: A computed tomography device has a gantry having a first gantry part, a second gantry part and a flexible material sheet. The first gantry part has a rotor having a projection data acquisition system and is movably mounted, via a linear guiding arrangement, relative to the second gantry part such that the first gantry part is configured for translational movement relative to the second gantry part. The gantry has a tensioning apparatus for the flexible material sheet. The flexible material sheet has a covering section, wherein the covering section spans between the first gantry part and the second gantry part to cover a region of the gantry.

Abstract: The present disclosure relates to imaging and endoradiotherapy of diseases involving chemokine receptor 4 (CXCR4). Provided are compounds which bind or inhibit hCXCR4 and mCXCR4 and furthermore carry at least one moiety which is amenable to labeling. Provided are also medical uses of such compounds.

Abstract: One or more example embodiments of the present invention relates to a chassis for a gantry of a computed tomography unit, which has receiving areas to which rotating components of the computed tomography unit can be attached. The chassis is at least in part produced using additive manufacturing. One or more example embodiments of the present invention is also directed to a gantry and a computed tomography unit with such a chassis.

Abstract: An imaging optical unit comprises a plurality of minors for imaging an object field into an image field. The imaging optical unit has an image-side numerical aperture greater than 0.55. Each mirror is configured so that it can be measured by a testing optical unit having at least one DOE with a predetermined maximum diameter for test wavefront generation. For the complete measurement of all reflection surfaces of the minors, a maximum number of DOEs of the testing optical unit and/or a maximum number of DOE test positions of the at least one DOE of the testing optical unit comes into play, which is no more than five times the number of minors in the imaging optical unit. The result is an imaging optical unit in which a testing-optical measurement remains manageable even in the case of a design with an image-side numerical aperture which is relatively large.

Abstract: The present disclosure relates to a method of improving semiconductor package creepage. The package includes a semiconductor device, and a plurality of electrically conductive contacts at a surface of the package, the package includes insulating material for electrically insulating the package between the plurality of electrically conductive contacts and an initial creepage distance is defined by the shortest distance over the surface of the package between two of the plurality of contacts, and the method includes the steps of: applying a layer of insulating material over at least part of at least one of the two contacts, the insulating material is applied in a thin layer and selected to obtain a package thermal resistance increase less than a factor 3 as compared to an uncoated semiconductor package, to increase the initial creepage distance and improve package creepage of the semiconductor package.

Abstract: A cooking accessory receivable within a cooking chamber of an oven appliance includes a base plate to receive a food item thereon, an enclosing lid disposed over the base plate, the enclosing lid defining a main inlet and an access opening, the main inlet being defined along the vertical direction and the access opening being defined along the transverse direction, and a guide plate attached to an interior surface of the enclosing lid above the base plate, wherein the base plate and the enclosing lid form a high temperature chamber for the food item, the high temperature chamber being in fluid communication with the cooking chamber.

Abstract: An electronic unit, in particular for an electric fluid pump of a motor vehicle, having a functional element for holding electronics, and a heat sink arranged on the functional element, wherein the functional element and the heat sink are sealed from one another in fluid-tight fashion by means of a cured sealing compound of a liquid seal, and wherein the functional element has at least one ventilation opening, which is open in the course of a curing process for the sealing compound, and which, after the curing process, is sealed in fluid-tight fashion by means of a closure element.

Abstract: A device connectable to a reader of an access control system includes an antenna, an ultra-wide band (UWB) front end circuit, a controller, and a communication link. The (UWB) front end circuit is connected to the antenna to facilitate UWB communication with a credential device. The controller is connected to the UWB front end and configured to perform ranging for the credential device using the UWB communication. The communication link is configured to interface with the reader.

Abstract: The present invention relates to certain SGLT-2 inhibitors for treating, preventing, protecting against and/or delaying the progression of chronic kidney disease in patients, for example patients with prediabetes, type 1 or type 2 diabetes mellitus.

Abstract: An imaging optical unit comprises a plurality of mirrors for imaging an object field in an object plane into an image field in an image plane. An image-side numerical aperture is greater than 0.55. A ratio between an object/image offset and a meridional transverse direction is at least 0.5. A ratio between a working distance between the object plane and a reflection portion, closest to the object plane, of one of the mirrors and the meridional transverse dimension is at least 0.05. The working distance is at least 270 mm. This can yield an imaging optical unit, the use of which is relatively manageable in a projection exposure apparatus, such as for EUV projection lithography.

Abstract: An oven appliance includes a plurality of sidewalls defining a cooking chamber, a door to selectively open and close the cooking chamber; and a bottom panel assembly removably provided within the cooking chamber. The bottom panel assembly includes a panel defining an aperture, a front air deflector attached to the panel at the aperture, and a retention clip provided within the cooking chamber, the retention clip defining a receiving slot to selectively receive the panel when the panel is in an installed position.

Abstract: An extruder including a housing, a first material inlet for a mixture at least consisting of a solvent and a dissolved medium, a material outlet, a screw, a screw drive, and at least one distillation region between the inlet and the outlet, which allows an outflow of solvent, and a discharge line for the solvent.

Abstract: Various systems and methods for providing discovering smart card slots in a device are described herein. A server device for discovering smart card slots in a client device may be implemented with a processor subsystem; and memory including instructions, which when executed by the processor subsystem, cause the processor subsystem to perform operations comprising: receiving, at the server device from the client device, over an established Bluetooth connection, smart card connector parameters, the client device having a plurality of smart card slots; iterating through the plurality of smart card slots; at each slot of the plurality of smart card slots, using a smart card protocol to attempt to access an application at each slot, the application pre-associated with the server device; and in response to identifying the application exists in a slot of the plurality of smart card slots, connecting with the application.

Abstract: The apparatus has a control unit, a connection unit and a vibration unit. The connection unit has a control-element-side region, an edge region and a flexible region, wherein the control-element-side region is flexibly mounted relative to the edge region by the flexible region. The control unit has a contact region, wherein the contact region is fixed relative to the control-element-side region. The control unit is configured to generate a contact signal based on contact with the contact region. The vibration unit is configured to induce a vibration of the contact region relative to the edge region during contact with the contact region.