Abstract: A method of manufacturing a multilayer ceramic electronic component which comprises alternately conductive layers and dielectric layers, and in which successive, conductive layers are made alternately from two different electrode materials and extend up to the surfaces of all four side faces of the substrate, in which method, an end face of the stack of layers is immersed in an electrolytic solution and the least noble electrode material of the two electrode materials is electrochemically dissolved out, the resultant cavities are filled with a curable monomer, the noblest one of the two electrode materials is exposed by removing the polymeryzate formed, and a potential is applied to said electrode material, which is so high as to enable said noble electrode material at the other end face of the stack to be electrochemically dissolved out, the resultant cavities at the other end face are filled with a curable monomer, and outer electrodes are provided on opposite sides of the stack.