Patents by Inventor Hans Jurgen Mayer

Hans Jurgen Mayer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7897893
    Abstract: Disclosed is a valve having a housing with a valve seat for a two-piece flap which is rotatably mounted on a drive shaft. An annular piston seal and an adjacent cover disk are disposed between the first part and the second part of the two-piece flap so as to revolve therearound. The diameter of the cover disk is smaller than the diameter of the annular piston seal which is embodied as a metal ring that is provided with a gap. The invention also relates to the use of the valve as a gas recirculation valve.
    Type: Grant
    Filed: April 29, 2005
    Date of Patent: March 1, 2011
    Assignee: Hitachi Via Mechanics, Ltd.
    Inventors: Alexander Kilthau, Hans Jürgen Mayer, Marc Van Biesen
  • Patent number: 6437283
    Abstract: When a laser beam is focussed onto a substrate for the purpose of substrate processing, the optical units such as beam expander, deflecting unit, and optical imaging device prescribe the range of depth of focus in which it is possible to work with a minimum spot size. The difficulty of boring thin holes, especially in thick substrates, is overcome with a second laser beam that is widened via a second beam expander and likewise focused onto the substrate via the deflecting unit and the optical imaging device. The position and the length of the second range of depth of focus can be varied by selecting the magnification of the second beam expander or by maladjustment. Thin holes can also be bored into thick substrates by using the two laser beams one after another.
    Type: Grant
    Filed: November 29, 2000
    Date of Patent: August 20, 2002
    Assignee: Siemens Aktiengesellschaft
    Inventors: Udo Wiggermann, Alex Schreiner, Hans Jürgen Mayer, Leo Higgins, Eddy Roelants
  • Publication number: 20020063113
    Abstract: When a laser beam is focussed onto a substrate for the purpose of substrate processing, the optical units such as beam expander, deflecting unit, and optical imaging device prescribe the range of depth of focus in which it is possible to work with a minimum spot size. The difficulty of boring thin holes, especially in thick substrates, is overcome with a second laser beam that is widened via a second beam expander and likewise focused onto the substrate via the deflecting unit and the optical imaging device. The position and the length of the second range of depth of focus can be varied by selecting the magnification of the second beam expander or by maladjustment. Thin holes can also be bored into thick substrates by using the two laser beams one after another.
    Type: Application
    Filed: November 29, 2000
    Publication date: May 30, 2002
    Inventors: Udo Wiggermann, Alex Schreiner, Hans Jurgen Mayer, Leo Higgins, Eddy Roelants