Abstract: The invention is directed to a method for producing highly adhesive conductive structures on nonconductive substrates, in particular for application in electric circuits, and to a surface-activating compound for use in the method. The method comprises the following method steps: application and selective irradiation of a surface-activating compound, and subsequent electroless metallization of the irradiated areas to form metallic structures.

Abstract: The invention relates to a device and process for laser structuring and applications thereof in the production of semiconductors.

Abstract: Conductive structures in polymers are obtained by a method in which poly(organylheteroacetylenes) of formula I ##STR1## or a mixture of poly(organylheteroacetylenes) of formula I and other polymers are exposed to radiation of high energy density, preferably laser radiation. At relatively low temperatures of 100.degree. C. to 600.degree. C., the polymer structure is effected so that electrically conductive structures result. The products are employed in electrical engineering, electronics and microelectronics, preferably as printed conductors. The invention makes it possible to inscribe long-term stable, conductive structures in an insulating polymer matrix in a one-step method, it being possible to use modern computer techniques (computer graphics)and to produce computer-aided conductor structures directly. The polymers can be used without supports or applied on rigid or flexible materials.