Abstract: A rotary transmitter having a first light-conducting hollow body, at least one transmitter for generating at least one optical signal and at least one receiver for receiving the optical signal is disclosed. The optical signal is transmitted from the transmitter to the receiver via the first light-conducting hollow body.

Abstract: A rotary transmitter having a first light-conducting hollow body, at least one transmitter for generating at least one optical signal and at least one receiver for receiving the optical signal is disclosed. The optical signal is transmitted from the transmitter to the receiver via the first light-conducting hollow body.

Abstract: For creating flat surfaces along the circumference of a polymer optical fiber of a round cross section by machining, the polymer optical fiber is wound onto a mandrel in a plurality of windings, the mandrel having a generally non-circular cross section with at least one projecting sector in which the radius is constant or, starting from an apex of the largest radius, in which the radius linearly decreases on both sides with an increasing angular distance to the apex, the machining including using a cutting chisel of a high quality for turning-off the polymer optical fiber in the projecting sector of the mandrel. Subsequently, the polymer optical fiber is cut to several pieces that can be used for the manufacture of optical splitters.

Abstract: For creating flat surfaces along the circumference of a polymer optical fiber of a round cross section by machining, the polymer optical fiber is wound onto a mandrel in a plurality of windings, the mandrel having a generally non-circular cross section with at least one projecting sector in which the radius is constant or, starting from an apex of the largest radius, in which the radius linearly decreases on both sides with an increasing angular distance to the apex, the machining including using a cutting chisel of a high quality for turning-off the polymer optical fiber in the projecting sector of the mandrel. Subsequently, the polymer optical fiber is cut to several pieces that can be used for the manufacture of optical splitters.

Abstract: A light-emitting diode arrangement comprises a sub-mount on which a light-emitting diode chip is mounted, and a reflector which is adjusted at the sub-mount and has a reflector surface located in the beam path of the light-emitting diode chip. The reflector is formed from the lateral wall of a solid body consisting of a transparent material and having a small irradiation surface located opposite the light-emitting diode chip (3) and a large radiation surface which is located opposite the same, at a distance, a lateral wall forming a reflector surface extending therebetween, and the sub-mount comprises an opening into which the reflector body is inserted, with the irradiation surface first.

Abstract: A light-emitting diode arrangement comprises a sub-mount on which a light-emitting diode chip is mounted, and a reflector which is adjusted at the sub-mount and has a reflector surface located in the beam path of the light-emitting diode chip. The reflector is formed from the lateral wall of a solid body consisting of a transparent material and having a small irradiation surface located opposite the light-emitting diode chip (3) and a large radiation surface which is located opposite the same, at a distance, a lateral wall forming a reflector surface extending therebetween, and the sub-mount comprises an opening into which the reflector body is inserted, with the irradiation surface first.

Abstract: For a precisely fitting alignment of an optical waveguide on an electro-optical component, the electro-optical component is attached onto a submount, which can be attached at any position on a support. For retaining the optical waveguide, a coupling element is selectively provided, the coupling element having a negative imaging of the contour of the submount. This element is positively attached at the submount and receives the end of the optical waveguide. The space between the electro-optical component and the optical waveguide is filled by a transparent adhesive. The submount can be formed in micro-structure technique. The coupling element can be eliminated if the optical waveguide is directly aligned on the submount.

Abstract: The invention relates to a transmitter-receiver assembly by means of which light signals can be transformed into electric signals (receiver mode), or electric signals into light signals (transmitter mode). Said assembly comprises a component (10) comprising positioning configurations (16), an optical waveguide (17), a first mirror (14) and a second mirror (15), the two mirrors (14, 15) lying in prolongation of the optical waveguide (17), and the second mirror (15), as seen from the optical waveguide (17), lying behind the first mirror (14), as well as to a component (20) having adjustment configurations (23), an optical transmitter (29) and an optical receiver (25), the transmitter (29) and the receiver (25) being arranged next to one another.

Abstract: A circuit board (5) is described, consisting of at least two individual circuit board layers (10) made of plastics and produced by formation technique, which each have first and second functional sides and at least one microstructured positioning formation (16) on each of the first and second functional sides and at least one microstructured conductor trench (12) on one of the functional sides, the conductor trench (12) being provided with a metallization (18). This allows a low expenditure production of circuit boards having a high packing density.

Abstract: For a precisely fitting alignment of an optical waveguide on an electro-optical component, the electro-optical component is attached onto a submount, which can be attached at any position on a support. For retaining the optical waveguide, a coupling element is selectively provided, the coupling element having a negative imaging of the contour of the submount. This element is positively attached at the submount and receives the end of the optical waveguide. The space between the electro-optical component and the optical waveguide is filled by a transparent adhesive. The submount can be formed in micro-structure technique. The coupling element can be eliminated if the optical waveguide is directly aligned on the submount.

Abstract: An assembly unit comprises a printed circuit board (10) and an optical component (54, 56, 58), the printed circuit board (10) being provided with at least one electro-optical component (16), at least one conducting track (24) for the connection of the electro-optical component (16), as well as a three-dimensional, microstructured adjustment formation (12), the electro-optical component (16) being precisely arranged relative to the latter, and a three-dimensional positioning formation (52) being provided on the optical component (54, 56, 58) and cooperating with the adjustment formation (12) of the printed circuit board (10) in such a way that the optical component (54, 56 58) is precisely coupled with the electro-optical component (16) of the printed circuit board (10).

Abstract: Described is a polymer optical fiber including a section having a circular cross-section and a section having a non-circular cross-section. Also described are optical components containing such an optical fiber, as well as a method of fabricating such an optical fiber.

Abstract: An optical transceiver comprises a housing, a circuit board produced by formation technology and provided with conductor tracks, at least one optical fiber coupled with the circuit board, and a plurality of electrically conductive contact elements which are connected with the conductor tracks of the circuit board in an electrically conductive manner.

Abstract: A circuit board (5) is described, consisting of at least two individual circuit board layers (10) made of plastics and produced by formation technique, which each have first and second functional sides and at least one microstructured positioning formation (16) on each of the first and second functional sides and at least one microstructured conductor trench (12) on one of the functional sides, the conductor trench (12) being provided with a metallization (18). This allows a low expenditure production of circuit boards having a high packing density.

Abstract: A method for producing a microstructured body, in which a casting mold including a casting frame and a bottom plate is formed and is filled with a reaction molding compound. After curing, the casting frame is part of the component, while the bottom plate can be reused. Since both the base plate and the frame have been produced by microstructuring technology methods, this method yields a component that has high precision but can nevertheless be produced inexpensively in large numbers.

Abstract: For the shaping of a microstructure substrate via a mold cavity, an unmolding device allows an abrupt, shear-free separation, in particular at reaction temperature, of the microstructure substrate manufactured using the reaction molding method. Optical waveguide components meeting stringent damping requirements can easily be manufactured with this device.

Abstract: To planarize an electroformed, magnetic metal sheet having micropatterns, the metal sheet is clamped on a magnet and is mechanically processed on the back side of the metal in such a way that it assumes a plane-parallel shape. Metal sheets can be used which are not stress-free and are obtained in a fast electroplating process. Multiple copying is possible.

Abstract: In a method for manufacturing an integrated, optical waveguide component having fiber couplings, a substrate component and a cover component are used, the cover component being obtained by forming a positive-negative replica of the substrate component. To separate the optical waveguide pattern region from the regions of the fiber couplings, grooves, as well as corresponding webs, are provided transversely to the fiber couplings. The method eliminates the need for carrying out the fiber adjustment and the waveguide formation in one process.

Abstract: An integrated optical component is proposed, which has an optical component coupled to a waveguide. A buffer layer is provided for improving the coupling. The integrated optical component is produced with the aid of molding techniques. In the process an optical component is placed on a molding die and is adjustedly arranged on a waveguide by means of adjusting tabs. Following molding and removal of the molding die, the optical component is disposed, adjusted in respect to a waveguide, in a substrate plate. The waveguide is filled with a polymer and covered with a cover plate.

Abstract: A method for producing a cover for an integrated optical circuit, and an integrated optical circuit produced with this cover. The method minimizes the effort for the integration of optical components into fiber-optic systems by automatically positioning an optical component placed onto a mold punch. A liquid that can harden is poured around the optical component and the mold punch, and after this solidifies, it forms the cover.